JPS622558A - 半導体整流装置 - Google Patents
半導体整流装置Info
- Publication number
- JPS622558A JPS622558A JP14116485A JP14116485A JPS622558A JP S622558 A JPS622558 A JP S622558A JP 14116485 A JP14116485 A JP 14116485A JP 14116485 A JP14116485 A JP 14116485A JP S622558 A JPS622558 A JP S622558A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor pellet
- conductive paste
- semiconductor
- electrodes
- pellet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 48
- 239000008188 pellet Substances 0.000 claims abstract description 36
- 238000007789 sealing Methods 0.000 claims abstract description 6
- 229920005989 resin Polymers 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 229920002379 silicone rubber Polymers 0.000 abstract description 7
- 239000004945 silicone rubber Substances 0.000 abstract description 6
- 239000003822 epoxy resin Substances 0.000 abstract description 3
- 229920000647 polyepoxide Polymers 0.000 abstract description 3
- 230000015572 biosynthetic process Effects 0.000 abstract 2
- 230000004913 activation Effects 0.000 abstract 1
- 230000002708 enhancing effect Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 239000004020 conductor Substances 0.000 description 9
- 230000002093 peripheral effect Effects 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 235000011962 puddings Nutrition 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14116485A JPS622558A (ja) | 1985-06-27 | 1985-06-27 | 半導体整流装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14116485A JPS622558A (ja) | 1985-06-27 | 1985-06-27 | 半導体整流装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS622558A true JPS622558A (ja) | 1987-01-08 |
| JPH0365898B2 JPH0365898B2 (enrdf_load_stackoverflow) | 1991-10-15 |
Family
ID=15285622
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14116485A Granted JPS622558A (ja) | 1985-06-27 | 1985-06-27 | 半導体整流装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS622558A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5521124A (en) * | 1995-04-04 | 1996-05-28 | Tai; Chao-Chi | Method of fabricating plastic transfer molded semiconductor silicone bridge rectifiers with radial terminals |
| US6946730B2 (en) | 2001-04-25 | 2005-09-20 | Denso Corporation | Semiconductor device having heat conducting plate |
-
1985
- 1985-06-27 JP JP14116485A patent/JPS622558A/ja active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5521124A (en) * | 1995-04-04 | 1996-05-28 | Tai; Chao-Chi | Method of fabricating plastic transfer molded semiconductor silicone bridge rectifiers with radial terminals |
| US6946730B2 (en) | 2001-04-25 | 2005-09-20 | Denso Corporation | Semiconductor device having heat conducting plate |
| US6963133B2 (en) * | 2001-04-25 | 2005-11-08 | Denso Corporation | Semiconductor device and method for manufacturing semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0365898B2 (enrdf_load_stackoverflow) | 1991-10-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |