JPS6225488A - Metal foilled metal substrate and manufacture thereof - Google Patents

Metal foilled metal substrate and manufacture thereof

Info

Publication number
JPS6225488A
JPS6225488A JP16401785A JP16401785A JPS6225488A JP S6225488 A JPS6225488 A JP S6225488A JP 16401785 A JP16401785 A JP 16401785A JP 16401785 A JP16401785 A JP 16401785A JP S6225488 A JPS6225488 A JP S6225488A
Authority
JP
Japan
Prior art keywords
protective layer
steel plate
silicon steel
metal
synthetic resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16401785A
Other languages
Japanese (ja)
Other versions
JPH0564878B2 (en
Inventor
建夫 井口
新一郎 浅井
千春 渡辺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denka Co Ltd
Original Assignee
Denki Kagaku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denki Kagaku Kogyo KK filed Critical Denki Kagaku Kogyo KK
Priority to JP16401785A priority Critical patent/JPS6225488A/en
Publication of JPS6225488A publication Critical patent/JPS6225488A/en
Publication of JPH0564878B2 publication Critical patent/JPH0564878B2/ja
Granted legal-status Critical Current

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  • Insulated Metal Substrates For Printed Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明は電子機器等に・用いられるモーター用プリント
回路基板に係り、特に珪素鋼板基板を用いた金属箔張金
属基板とその製造方法に関するものである。
[Detailed Description of the Invention] (Industrial Application Field) The present invention relates to a printed circuit board for a motor used in electronic equipment, etc., and particularly relates to a metal foil-clad metal board using a silicon steel plate board and a method for manufacturing the same. It is.

(従来の技術) 電子機器は近年、小型、軽量化、薄型化、高密度実装化
が急速に進んでいる。この様な影響は、プリント回路基
板にも、現われており、同様な要求が強くなっている。
(Prior Art) In recent years, electronic devices have rapidly become smaller, lighter, thinner, and more densely packaged. This kind of influence is also appearing in printed circuit boards, and similar demands are becoming stronger.

モーター用ステータ基板としては、従来別々の鋼板とプ
リント配線板を重ね合せていたものが使用されていたが
、最近は鋼板上にフ0リント配線を直接に施した鉄板基
板が普及してきた。また、さらに磁束密度や、ヒステリ
シスの特性を要求するモーターの場合には、珪素含有量
の多い珪素鋼板を用いた基板が使用されている。
Conventionally, stator boards for motors have been made by laminating separate steel plates and printed wiring boards, but recently iron plate boards with printed wiring directly on the steel plates have become popular. Furthermore, in the case of motors that require higher magnetic flux density and hysteresis characteristics, a substrate using a silicon steel plate with a high silicon content is used.

この珪素鋼板は耐食性、耐候性が著しく悪いために、通
常、板の両面にコーティングによる防錆処理が施こされ
て入手される。
Since this silicon steel plate has extremely poor corrosion resistance and weather resistance, it is usually obtained with anti-corrosion treatment applied to both sides of the plate.

従来、珪素鋼板を用いてこの上に絶縁層を介して金属箔
を貼着してプリント配線板を製作するには、珪素鋼板の
表面処理保護層(以下保護層という)は、亜鉛等の無機
質のメッキやコーティング処理したものが用いられてい
た。この場合に、無機質処理保護層に直接に合成樹脂の
絶縁剤を施こすと、無機質処理保護層と絶縁層の接着力
は十分でなく、かつ切断時や打ち抜き加工時に、珪素鋼
板と無機質処理保護層の界面で、剥れやクラックの発生
がみられた。そのために、絶縁剤を施す面の無機質処理
保護層を全面的に除去してから、無機質処理保護層の無
い珪素鋼板面に、絶縁剤を施す必要があった。しかしな
がらこの無機質処理保護層を除去するためには、特殊の
方法を用いるとか、サンドブラスト、別布研磨等の通常
の研磨方法では、工程を数回繰返したシするか設備を長
く大型化したシする必要があった。
Conventionally, in order to manufacture a printed wiring board by pasting metal foil on a silicon steel plate through an insulating layer, the surface treatment protective layer (hereinafter referred to as the protective layer) of the silicon steel plate is made of an inorganic material such as zinc. Those that were plated or coated were used. In this case, if a synthetic resin insulating agent is applied directly to the mineral-treated protective layer, the adhesive strength between the mineral-treated protective layer and the insulating layer will not be sufficient, and when cutting or punching, the silicon steel plate and the mineral-treated protective Peeling and cracking were observed at the interface between the layers. For this reason, it was necessary to completely remove the inorganic-treated protective layer on the surface to which the insulating agent was applied, and then apply the insulating agent to the surface of the silicon steel plate that did not have the inorganic-treated protective layer. However, in order to remove this inorganic treated protective layer, a special method is used, or regular polishing methods such as sandblasting and separate cloth polishing require repeating the process several times or requiring longer and larger equipment. There was a need.

(発明が解決しようとする問題点) 本発明はかかる欠点を解決したものであり、合成樹脂と
無機物との混合物からなる保護層を両面に有する珪素鋼
板を用いることによシ、通常のサンドブラストや別布研
磨等の研削法の工程で容易に保護層が剥離でき、珪素鋼
板に絶縁層が密着性よく接着して切断時や打ち抜き加工
時の衝撃による剥れやクラックの発生が防止できる金属
箔張金属基板とその製造方法を提供するものである。
(Problems to be Solved by the Invention) The present invention solves these drawbacks by using a silicon steel plate having a protective layer on both sides made of a mixture of synthetic resin and inorganic material. A metal foil whose protective layer can be easily peeled off during grinding processes such as separate cloth polishing, and whose insulating layer adheres well to the silicon steel plate to prevent peeling or cracking caused by impact during cutting or punching. The present invention provides a stretched metal substrate and a method for manufacturing the same.

(問題点を解決するだめの手段) すなわち本発明は、 1、 合成樹脂と無機物との混合物保護層、珪素鋼板層
、合成樹脂と無機物との混合物部分保護層、絶縁層およ
び金属箔層を順々に積層してなる基板 2゜珪素鋼板の両面に合成樹脂と無機物との混合物から
なる保護層を設け、該保護層の片面を少なくとも部分的
に研磨して無機物充填剤を含有する合成樹脂を塗布して
絶縁層となし、さらに上面に金属箔を貼着する製造方法
を特徴とするものである。
(Means for Solving the Problems) That is, the present invention has the following steps: 1. A synthetic resin and inorganic substance mixture protective layer, a silicon steel sheet layer, a synthetic resin and inorganic substance mixture partial protective layer, an insulating layer, and a metal foil layer are formed in this order. A protective layer made of a mixture of a synthetic resin and an inorganic substance is provided on both sides of a 2° silicon steel plate laminated with a substrate, and one side of the protective layer is at least partially polished to form a synthetic resin containing an inorganic filler. It is characterized by a manufacturing method in which it is coated to form an insulating layer and then a metal foil is attached to the top surface.

以下図面によシ本発明の詳細な説明する。The present invention will be explained in detail below with reference to the drawings.

第1図は本発明の基板を示す断面図であシ、珪素鋼板1
の底面には保護層2が貼着されている。
FIG. 1 is a cross-sectional view showing a substrate of the present invention, a silicon steel plate 1
A protective layer 2 is adhered to the bottom surface.

また珪素鋼板1の上面にも保護層2が貼着され、この上
面の保護層2け部分的に研磨され、珪素鋼板1が露出し
ている。さらに絶縁層3は、上面保護層2を被覆すると
同時に露出された珪素鋼板1と強固な状態で接着し、他
方の面に銅箔4を密着させている。
A protective layer 2 is also adhered to the upper surface of the silicon steel plate 1, and the protective layer 2 on the upper surface is partially polished to expose the silicon steel plate 1. Further, the insulating layer 3 coats the upper surface protective layer 2 and at the same time is firmly adhered to the exposed silicon steel plate 1, and the copper foil 4 is tightly adhered to the other surface.

絶縁層3の絶縁剤は合成樹脂と無機物充填剤との混合物
とからなυ、合成樹脂は例えばエポキシ樹脂、フェノー
ル樹脂、ポリイミド樹脂、不飽和−リエステル樹脂およ
びエポキシ変性シリコーン樹脂などの熱硬化性樹脂を用
いることができ、無機物充填剤としては、例えばシリカ
、クレー、アルミナ、酸化マグネシウム、窒化アルミニ
ウム、炭化珪素およびピロンナイトライドなどを用いる
ことができる。これら合成樹脂から選ばれた一種または
二種以上と、これら無機物充填剤から選ばれた一種また
は二種以上に、合成樹脂の硬化剤を添加後、混合、混練
して絶縁剤を調合した。
The insulating material of the insulating layer 3 is made of a mixture of synthetic resin and inorganic filler, and the synthetic resin is a thermosetting resin such as epoxy resin, phenol resin, polyimide resin, unsaturated polyester resin, and epoxy-modified silicone resin. Examples of the inorganic filler include silica, clay, alumina, magnesium oxide, aluminum nitride, silicon carbide, and pyrone nitride. A curing agent for the synthetic resin was added to one or more selected from these synthetic resins and one or more selected from these inorganic fillers, and then mixed and kneaded to prepare an insulating agent.

一方、珪素鋼板1は、保護層2として合成樹脂と無機物
との混合物とから成り、かつ、珪素鋼板1とその保護層
2が切断時や打ち抜き時の衝撃に耐える特性をもつ、例
えば、新日鉄(株)品、電磁鋼板L−コーティングやL
2−コーティングあるいは川崎製鉄(株)品、電気鋼帯
A1コーテイング品が好ましい。そして、この保護層2
を有する珪素鋼板1を必要に応じ、界面活性剤水溶液あ
るいはトルエン、トリクレン等の有機溶剤で洗浄し、次
いで絶縁層3を形成する片面のみを、サンドブラスト、
別布研磨、サンドペーパー等を用いて研削、表面粗化を
行った。この場合、珪素鋼板1の保護層2は、部分的に
残っていてよく珪素鋼板1の元板が現われるほど、保護
層2を全面的に取シ除く必要は、必ずしもない。
On the other hand, the silicon steel plate 1 is made of a mixture of synthetic resin and inorganic material as the protective layer 2, and the silicon steel plate 1 and its protective layer 2 have characteristics that can withstand impact during cutting or punching. Co., Ltd., electrical steel sheet L-coating and L
2-coating, a product manufactured by Kawasaki Steel Corporation, and an electrical steel strip A1 coated product are preferred. And this protective layer 2
If necessary, the silicon steel plate 1 having the above-mentioned properties is cleaned with an aqueous surfactant solution or an organic solvent such as toluene or trichlene, and then only one side on which the insulating layer 3 will be formed is sandblasted,
Grinding and surface roughening were performed using separate cloth polishing, sandpaper, etc. In this case, the protective layer 2 of the silicon steel plate 1 may remain partially, and it is not necessarily necessary to completely remove the protective layer 2 to the extent that the original plate of the silicon steel plate 1 is exposed.

この珪素鋼板1の研削面に、無機物充填剤を含んだ合成
樹脂から成る絶縁剤を40μm〜200μmの範囲で塗
布して絶縁層3を形成し、この上面に金属箔4を貼着す
るものである。金属箔4としては、通常0.009〜0
−15mmの厚さの、銅箔、アルミニウム箔、ニッケル
箔などを用いることができる。
An insulating agent made of synthetic resin containing an inorganic filler is applied to the ground surface of the silicon steel plate 1 to a thickness of 40 μm to 200 μm to form an insulating layer 3, and a metal foil 4 is pasted on the top surface of the insulating layer 3. be. The metal foil 4 is usually 0.009 to 0.
-15 mm thick copper foil, aluminum foil, nickel foil, etc. can be used.

(実施例) 以下本発明の実施例を示す。(Example) Examples of the present invention will be shown below.

実施例1 エポキシ樹脂の50容量チにアルミヵ粉5o容量チとア
ミン系硬化剤を添加し混合、混練し、絶縁剤を調合した
。一方、両面に形成された保護層が、岑棲光金物樹脂と
無機物からなる珪素鋼板(新日鉄(株)製、商品名電磁
鋼板L−コーティング)をトリクレンで脱脂洗浄後、片
面を別布研磨機にて保護層を研磨した。この時、研磨面
は、まだら状に80チはど珪素鋼板の地肌が見えておシ
20%は保護層が残っていた。
Example 1 50 volumes of aluminum powder and an amine curing agent were added to 50 volumes of epoxy resin, mixed and kneaded to prepare an insulating agent. On the other hand, after degreasing and cleaning a silicon steel plate (manufactured by Nippon Steel Corporation, product name: electromagnetic steel sheet L-coating, manufactured by Nippon Steel Corporation) with a protective layer formed on both sides, which is made of a metal resin and an inorganic substance, one side was polished using a separate cloth polishing machine. The protective layer was polished. At this time, on the polished surface, the bare surface of the 80-inch silicon steel plate was visible in a mottled manner, and 20% of the protective layer remained.

この研磨面に調合した絶縁剤をロールコータ−にて、厚
さ80μmを塗布して絶縁層とした。この後65μmの
電解銅箔を貼合せてオープンにて加熱硬化後、銅張珪素
鋼板基板を作成した。
The prepared insulating agent was applied to the polished surface using a roll coater to a thickness of 80 μm to form an insulating layer. Thereafter, a 65 μm electrolytic copper foil was laminated and heated and cured in the open to create a copper-clad silicon steel plate substrate.

物性評価を表に示す。The physical property evaluation is shown in the table.

実施例2 フェノール樹脂の60容量チにシリカ40容量チとアミ
ン系硬化剤を添加し、混合、混練し、絶縁剤を調合した
。一方、両面に形成された保護層域 が毒譜北合倫樹脂と無機物からなる珪素鋼板(用1崎製
鉄(株)製、商品名A1コーティング)をアルカリ性界
面活性剤にて脱脂洗浄後、片面をサンドブラストにて保
護層を研磨した。この時・研磨面は、班点状に60チは
ど珪素鋼板の地肌が見え残りは保護層であった。
Example 2 To 60 volumes of phenolic resin, 40 volumes of silica and an amine curing agent were added, mixed and kneaded to prepare an insulating agent. On the other hand, after degreasing and cleaning with an alkaline surfactant a silicon steel plate (manufactured by Yoichisaki Steel Co., Ltd., trade name: A1 coating), in which the protective layer region formed on both sides is made of poison Fubekheirin resin and inorganic substances, one side The protective layer was polished by sandblasting. At this time, on the polished surface, the bare surface of the 60-inch silicon steel plate was visible in the form of speckles, and the rest was a protective layer.

この研磨面に調合した絶縁剤をロールコータ−にて、厚
さ100μmを塗布して絶縁層とした。
The prepared insulating agent was applied to the polished surface using a roll coater to a thickness of 100 μm to form an insulating layer.

この後、65μmの電解銅箔を貼合せて、オープンにて
加熱硬化後、銅張珪素鋼板基板を作成した。
Thereafter, a 65 μm electrolytic copper foil was laminated thereon and heated and cured in the open to create a copper-clad silicon steel plate substrate.

物性評価を表に示す。The physical property evaluation is shown in the table.

比較例1 エポキシ樹脂にアミン系硬化剤を添加し、混合、混練し
、絶縁剤を調合した。一方、両面に亜鉛メッキの無機質
層を有する珪素鋼板を、トリクレンで脱脂洗浄後、片面
の亜鉛メッキの無機質層を完全に除去するために、別布
研磨機に6回通して研磨した。
Comparative Example 1 An amine curing agent was added to an epoxy resin, mixed and kneaded to prepare an insulating agent. On the other hand, a silicon steel plate having a galvanized inorganic layer on both sides was degreased and cleaned with trichloride, and then polished by passing it through a separate cloth polisher six times to completely remove the galvanized inorganic layer on one side.

この研磨面に調合した絶縁剤をロールコータ−にて厚さ
80μmを塗布して絶縁層とした。この後、35μmの
電解銅箔を貼合せて、オープンにて加熱硬化後、銅張珪
素鋼板基板を作成した。
The prepared insulating agent was applied to the polished surface using a roll coater to a thickness of 80 μm to form an insulating layer. Thereafter, a 35 μm electrolytic copper foil was laminated, and after heating and curing in an open setting, a copper-clad silicon steel plate substrate was created.

物性評価を表に示す。The physical property evaluation is shown in the table.

比較例2 エポキシ樹脂にアミン系硬化剤を添加し、混合、混練し
、絶縁剤を調合した。一方、両面に亜鉛メッキの無機質
層を有する珪素鋼板を、トリクレンで脱脂洗浄後、この
片面に調合した絶縁剤をロールコータ−にて厚さ80μ
mを塗布して絶縁層とした。この後、35μmの電解鋼
箔を貼合せて、オープンにて加熱硬化後、銅張珪素鋼板
基板を作成した。
Comparative Example 2 An amine curing agent was added to an epoxy resin, mixed and kneaded to prepare an insulating agent. On the other hand, a silicon steel plate with galvanized inorganic layers on both sides was degreased and cleaned with trichloride, and then a blended insulating agent was coated on one side with a roll coater to a thickness of 80 μm.
m was applied to form an insulating layer. Thereafter, a 35 μm electrolytic steel foil was laminated and heated and cured in the open to create a copper-clad silicon steel plate substrate.

物性評価を表に示す 1、落下衝撃テスト測定方法 試験方法は実施例と比較例で得た4 4 mt X68
隨の基板上に16顛X13mX2mの銅のブロックを半
田で4個取り付け75 amの高さよシ厚さ30mの樫
の木の平板上に平面を下にして落下し、銅のブロックの
剥がれよシ評価した。
The physical property evaluation is shown in the table 1. Drop impact test measurement method The test method is 4 4 mt X68 obtained in Examples and Comparative Examples.
Four copper blocks measuring 16 meters x 13 meters x 2 meters were attached to a board at the bottom using solder, and the copper blocks were dropped face down onto a 30 meter thick oak wooden board with a height of 75 am. evaluated.

2、打ち抜き加工性 実施例と比較例で得た銅張珪素鋼板基板をシャーにて切
断し、その切断部分の絶縁層及び保護層の剥れやクラッ
ク発生をみた。
2. Punching workability The copper-clad silicon steel plate substrates obtained in Examples and Comparative Examples were cut with a shear, and peeling and cracking of the insulating layer and protective layer at the cut portions were observed.

(発明の効果) 上記の結果よシ本発明による実施例では、保護層面の表
面研磨工程が、少なくてすみ、通常のラインにそのまま
適用できる。かつ、耐落下衝撃性が良好であり、切断加
工性にも優れていることから、絶縁層と珪素鋼板及び保
護層の王者間の密着性、接着性が、良いことを示してい
る。
(Effects of the Invention) In view of the above results, the embodiments of the present invention require less surface polishing steps on the surface of the protective layer, and can be applied to ordinary lines as they are. In addition, the drop impact resistance is good and the cutting workability is also excellent, indicating that the adhesion and adhesion between the insulating layer, the silicon steel plate, and the protective layer are good.

以上より、本発明によシ通常の生産工程を利用して、信
頼性の高い金属箔張珪素鋼板基板が製造でき、基板の加
工時やモーター用等の複雑な形状の回路配線珪素鋼板基
板をダメージなく打ち抜き加工出来るものである。
As described above, according to the present invention, a highly reliable metal foil-clad silicon steel plate substrate can be manufactured using a normal production process, and a complex-shaped circuit wiring silicon steel plate substrate for processing a board or for a motor can be manufactured. It can be punched out without damage.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は、本発明の金属基板の断面図であり、第2図(
a)、(b)は、落下衝撃テスト用サンプルの断面図お
よび平面図である。 符号1・・・珪素鋼板 2・・・本発明における保護層
3・・・絶縁層   4・・・銅箔 5・・・珪素鋼板基板
FIG. 1 is a cross-sectional view of the metal substrate of the present invention, and FIG.
a) and (b) are a cross-sectional view and a plan view of a drop impact test sample. Code 1...Silicon steel plate 2...Protective layer in the present invention 3...Insulating layer 4...Copper foil 5...Silicon steel plate substrate

Claims (2)

【特許請求の範囲】[Claims] (1)合成樹脂と無機物との混合物保護層、珪素鋼板層
、合成樹脂と無機物との混合物部分保護層、絶縁層およ
び金属箔層を順々に積層してなることを特徴とする金属
箔張金属基板。
(1) A metal foil cladding characterized by being formed by sequentially laminating a protective layer made of a mixture of synthetic resin and an inorganic substance, a silicon steel plate layer, a partial protective layer made of a mixture of a synthetic resin and an inorganic substance, an insulating layer, and a metal foil layer. metal substrate.
(2)珪素鋼板の両面に合成樹脂と無機物との混合物か
らなる保護層を設け、該保護層の片面を少なくとも部分
的に研磨して無機物充填剤を含有する合成樹脂を塗布し
て絶縁層となし、さらにその上面に金属箔を貼着するこ
とを特徴とする金属箔張金属基板の製造方法。
(2) A protective layer made of a mixture of synthetic resin and inorganic material is provided on both sides of a silicon steel plate, and one side of the protective layer is at least partially polished and a synthetic resin containing an inorganic filler is applied to form an insulating layer. 1. A method for producing a metal foil-clad metal substrate, which further comprises bonding a metal foil to the upper surface of the substrate.
JP16401785A 1985-07-26 1985-07-26 Metal foilled metal substrate and manufacture thereof Granted JPS6225488A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16401785A JPS6225488A (en) 1985-07-26 1985-07-26 Metal foilled metal substrate and manufacture thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16401785A JPS6225488A (en) 1985-07-26 1985-07-26 Metal foilled metal substrate and manufacture thereof

Publications (2)

Publication Number Publication Date
JPS6225488A true JPS6225488A (en) 1987-02-03
JPH0564878B2 JPH0564878B2 (en) 1993-09-16

Family

ID=15785201

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16401785A Granted JPS6225488A (en) 1985-07-26 1985-07-26 Metal foilled metal substrate and manufacture thereof

Country Status (1)

Country Link
JP (1) JPS6225488A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63224391A (en) * 1987-03-13 1988-09-19 株式会社アルメックス Printed wiring board and manufacture of the same
CN1099152C (en) * 1997-06-24 2003-01-15 日本胜利株式会社 Stator core and wire winding method for the same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63224391A (en) * 1987-03-13 1988-09-19 株式会社アルメックス Printed wiring board and manufacture of the same
JPH0556876B2 (en) * 1987-03-13 1993-08-20 Almex Inc
CN1099152C (en) * 1997-06-24 2003-01-15 日本胜利株式会社 Stator core and wire winding method for the same

Also Published As

Publication number Publication date
JPH0564878B2 (en) 1993-09-16

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