JPS62250683A - Laminated board for metal board base circuit - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION <Industrial Field of Application> The present invention relates to a laminated board for a metal board-based circuit, which is formed by adhering a gold striped foil and a gold M plate through an insulating resin layer.

Conventional technology〉 Laminated boards for circuits based on gold hAa such as iron or aluminum generally have high heat dissipation properties due to their high heat conductivity, and are suitable for mounting power modules and hybrid ICs. It is expanding as a substrate. Furthermore, the heat resistance of this substrate is superior to general-purpose laminates because the base is made of metal.

Laminated boards for metal printed circuits with such excellent properties also have a three-layer structure of metal foil, side fat, and metal plate, so they are resistant to thermal aging at the gold-resin interface, PCT, etc. The disadvantage is that peeling tends to occur due to humidity and humidity.

In order to improve this drawback, metal plates have been subjected to surface treatments with acids, alkalis, etc., and physical polishing treatments such as sandblasting.

<Problems to be Solved by the Invention> However, even with the above treatment, peeling could not be completely prevented under conditions of high humidity.

The present invention has been made in view of the above situation, and it is an object of the present invention to provide a laminate for metal plate-based circuits with excellent adhesion.

<Means for solving the problem> The objective is achieved by adding an organic compound (complexing agent) that forms a complex compound with the remaining ends into the insulating resin layer. .

The present invention will be explained in detail below. FIG. 1 shows a laminated board for a metal plate-based circuit according to the present invention, in which 1 is a metal plate made of iron, aluminum, silicon, brass, etc. alone, or a metal plate whose surface has been subjected to anti-corrosion treatment, etc. 3 is gold JI of copper, aluminum, etc.
i-foil, 2 is a resin prepreg layer, an adhesive layer, and an IP of a filler, etc. that has been treated with a coupling treatment! It is a lilac layer. The material of this metal plate base board is not limited, but the shape and dimensions should be 0.1 to 4 ff II 111 thick and 2000 x 2000 mm or less to avoid problems such as warpage.
The thickness of the insulating resin layer 2 is required to be 200 μm or less from the viewpoint of heat dissipation. In addition, the thickness of the metal foil 3 is 100 μm to 5 μm.
μm is required for soil.

As the resin for the insulating resin layer, epoxy, polyimide, phenol, unsaturated polyester, polytetrafluoroethylene, polyethylene, polysulfone, etc. alone, modified products, or mixed resins are used.

To this resin, 0.1 to 20% by weight of a complexing agent, such as phthalocyanine or merocyanine, which forms a strong coordination bond with the gold wire of copper, zinc, iron, aluminum, silicon, etc., is added. If this amount is less than a1%, the effect of the present invention cannot be obtained, and even if the amount is 20% or more, the adhesion will not improve.

The above-mentioned complexing agent can be added using a conventional method.

Phthalocyanine is resistant to ordinary organic solvents and is nonvolatile.
It has good acid resistance.
It is considered to be the most superior fat additive.

Examples of the present invention are shown below.

[Example 1] Phthalocyanine (phase f pure fruit, entalcyanine blue) α1 part, 15 parts, 1 part, 5 parts, 10s, 20 parts by weight was applied to the roughened surface of the copper foil 3 with a thickness of 35 μm on the epoxy thread face. It was coated with the additive and made into a B stage with a thickness of 80 μm.

The obtained coated steel foil 3 and a 1 mm thick iron plate were integrated to obtain a metal plate-based printed circuit laminate.

[Example 2] The epoxy varnish of Example 1 was mixed with 200 parts of silica treated with a silane coupling agent and coated, and B-staged at 80 μm in diameter. Obtained coating MFg3 and thickness 1f
A metal plate-based printed circuit laminate was obtained by integrating the iron plates of f+I11.

[Comparative Example 1] Using the same varnish as in Example 1, 0 parts of phthalocyanine and (10 parts of phthalocyanine)
A metal plate-based printed circuit laminate was obtained in the same manner as in Example 1 by adding 5 parts and 25 parts.

[Comparative Example 2] Under the conditions of Example 20, phthalonanine was added to 0 parts, α05 parts, and 2 parts.
A laminate for a metal printed circuit was obtained using the same recipe as in Example 2.

Table 1 shows the results of the accelerated heating test of these circuit boards at 190°C, and Table 2 shows the results of the PCT test.

Table 1 Heating Acceleration % Note 6 Table 2 PCT Characteristics From Tables 1 and 2, it can be seen that the system in which 7talo/anine was added to the insulating resin layer maintained excellent aging characteristics.

<Effects of the Invention> As is clear from the above explanation, the present invention improves the interfacial adhesion with metal, making it possible to provide a metal plate-based circuit laminate with excellent heat resistance and moisture resistance. became.

[Brief explanation of drawings]

FIG. 1 is a sectional view of a metal plate-based circuit board according to the present invention. 1 Metal plate 2 Insulating resin layer 3 Metal foil 4 Complexing agent

Claims (1)

[Claims] 1. In a metal plate-based circuit board formed by bonding a metal foil for circuit formation and a metal plate with an insulating resin layer interposed therebetween, the insulating resin layer is at least complex with the metal of the metal plate. A laminate for a metal plate-based circuit, comprising 0.1 to 20% by weight of a complexing agent that forms a compound. 2. The laminate for metal plate-based circuits according to claim 1, wherein the metal foil is copper foil and the complexing agent is phthalocyanine.