JP3067517B2 - Metal foil clad laminate and method for producing the same - Google Patents
Metal foil clad laminate and method for producing the sameInfo
- Publication number
- JP3067517B2 JP3067517B2 JP6069299A JP6929994A JP3067517B2 JP 3067517 B2 JP3067517 B2 JP 3067517B2 JP 6069299 A JP6069299 A JP 6069299A JP 6929994 A JP6929994 A JP 6929994A JP 3067517 B2 JP3067517 B2 JP 3067517B2
- Authority
- JP
- Japan
- Prior art keywords
- metal foil
- clad laminate
- resin
- producing
- prepreg
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229910052751 metal Inorganic materials 0.000 title claims description 26
- 239000002184 metal Substances 0.000 title claims description 26
- 239000011888 foil Substances 0.000 title claims description 15
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 229920005989 resin Polymers 0.000 claims description 21
- 239000011347 resin Substances 0.000 claims description 21
- 229920000800 acrylic rubber Polymers 0.000 claims description 7
- 229920000058 polyacrylate Polymers 0.000 claims description 7
- 239000011342 resin composition Substances 0.000 claims description 7
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 6
- 239000003822 epoxy resin Substances 0.000 claims description 6
- 229920000647 polyepoxide Polymers 0.000 claims description 6
- 239000011256 inorganic filler Substances 0.000 claims description 5
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 229920001187 thermosetting polymer Polymers 0.000 claims description 5
- 239000002738 chelating agent Substances 0.000 claims description 4
- 238000001035 drying Methods 0.000 claims description 4
- 238000000465 moulding Methods 0.000 claims description 4
- 229920001568 phenolic resin Polymers 0.000 claims description 4
- 239000005011 phenolic resin Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 2
- 239000013013 elastic material Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 description 18
- 230000005012 migration Effects 0.000 description 9
- 238000013508 migration Methods 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 239000011889 copper foil Substances 0.000 description 8
- 229910000679 solder Inorganic materials 0.000 description 8
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 5
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- 229920000459 Nitrile rubber Polymers 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000005725 8-Hydroxyquinoline Substances 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 102220492656 Integrin alpha-3_H42S_mutation Human genes 0.000 description 1
- -1 Isopropyl Phenolic resin Chemical compound 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 229960003540 oxyquinoline Drugs 0.000 description 1
- MCJGNVYPOGVAJF-UHFFFAOYSA-N quinolin-8-ol Chemical compound C1=CN=C2C(O)=CC=CC2=C1 MCJGNVYPOGVAJF-UHFFFAOYSA-N 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、表面実装用プリント配
線板の材料として適した金属箔張り積層板に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a metal foil-clad laminate suitable as a material for a printed wiring board for surface mounting.
【０００２】[0002]
【従来の技術】表面実装用プリント配線板では、表面実
装するセラミックチップ部品の熱膨張係数が７ｐｐｍと
小さいのに対して、プリント配線板の基板（金属箔張り
積層板を材料とする）の熱膨張係数は１４〜２２ｐｐｍ
と大きい。従って、冷熱サイクルを繰り返すと、セラミ
ックチップ部品と基板の熱膨張係数の差に起因して、セ
ラミックチップ部品の半田接続部に応力がかかる。最終
的には、半田接続部にクラックが入り断線に至るおそれ
がある。そこで、プリント配線板の材料である金属箔張
り積層板の熱膨張係数を小さくするために、シート状基
材に熱硬化性樹脂を含浸乾燥して得たプリプレグの層の
表面に金属箔を載置して加熱加圧成形した積層板におい
て、熱硬化性樹脂に無機充填剤を含有させる技術があ
る。また、半田接続部にかかる応力を緩和するために、
金属箔の下に低弾性樹脂層を配置することが検討されて
いる。例えば、アクリロニトリルブタジエンゴムやアク
リルゴムを予め金属箔に塗布して積層板を加熱加圧成形
する方法や、表面層のプリプレグに同様にアクリロニト
リルブタジエンゴムやアクリルゴムを塗布して加熱加圧
成形する方法である。2. Description of the Related Art In a printed wiring board for surface mounting, the thermal expansion coefficient of a ceramic chip component to be surface mounted is as small as 7 ppm, whereas the thermal expansion coefficient of a substrate of the printed wiring board (made of a metal foil-clad laminate) is increased. Expansion coefficient is 14-22ppm
And big. Therefore, when the thermal cycle is repeated, stress is applied to the solder connection portion of the ceramic chip component due to the difference in thermal expansion coefficient between the ceramic chip component and the substrate. Eventually, there is a possibility that cracks may enter the solder connection portion and lead to disconnection. Therefore, in order to reduce the coefficient of thermal expansion of the metal foil-clad laminate, which is the material of the printed wiring board, the metal foil is placed on the surface of the prepreg layer obtained by impregnating and drying the thermosetting resin on the sheet-like base material. There is a technique in which a thermosetting resin contains an inorganic filler in a laminated plate that is placed and heated and pressed. Also, in order to reduce the stress applied to the solder connection,
It has been studied to arrange a low elastic resin layer under a metal foil. For example, a method in which acrylonitrile-butadiene rubber or acrylic rubber is applied to a metal foil in advance to heat-press and mold a laminate, or a method in which acrylonitrile-butadiene rubber or acrylic rubber is similarly applied to a prepreg of a surface layer and heated and pressed to form It is.
【０００３】[0003]
【発明が解決しようとする課題】しかし、上記の無機充
填剤を含有させる技術では、積層板の熱膨張係数が期待
するほどには低くならず積層板の弾性率は高くなるの
で、返って半田接続部にクラックが入りやすくなる。ま
た、アクリロニトリルブタジエンゴムやアクリルゴムを
塗布する技術は塗布面に粘着性が残り、このような金属
箔やプリプレグを取り扱うときの作業性が悪い。また、
形成された低弾性樹脂層は、耐マイグレーション性がよ
くない。本発明が解決しようとする課題は、金属箔の下
に低弾性樹脂層を形成した金属箔張り積層板において、
その製造時に低弾性の樹脂組成物の塗布面に粘着性が残
らないようにし、また、表面実装プリント配線板用とし
て適した耐マイグレーション性に優れた金属箔張り積層
板を提供することである。However, in the above-described technique of incorporating an inorganic filler, the thermal expansion coefficient of the laminate is not so low as to be expected, and the elastic modulus of the laminate is high. Cracks are easily formed in the connection part. In addition, the technique of applying acrylonitrile butadiene rubber or acrylic rubber has adhesiveness remaining on the applied surface, resulting in poor workability when handling such a metal foil or prepreg. Also,
The formed low elastic resin layer has poor migration resistance. The problem to be solved by the present invention is a metal foil-clad laminate in which a low elastic resin layer is formed under a metal foil,
An object of the present invention is to provide a metal foil-clad laminate excellent in migration resistance suitable for use in a surface-mounted printed wiring board so as not to leave adhesiveness on a surface to which a low elasticity resin composition is applied at the time of its production.
【０００４】[0004]
【課題を解決するための手段】上記課題を解決するため
に、本発明に係る金属箔張り積層板は、シート状基材に
熱硬化性樹脂を含浸乾燥して得たプリプレグの層の表面
に金属箔を載置して加熱加圧成形したものにおいて、金
属箔の直下に下記の（ａ）〜（ｅ）の成分からなる厚さ
２０μｍ以上で弾性率１０Kgf／mm2以下の低弾性樹脂層
を設けたことを特徴とする。Means for Solving the Problems In order to solve the above problems, a metal foil-clad laminate according to the present invention is provided on a surface of a prepreg layer obtained by impregnating and drying a thermosetting resin on a sheet-like substrate. A metal foil is placed and molded under heat and pressure, and a low elastic resin layer having a thickness of 20 μm or more and an elastic modulus of 10 kgf / mm 2 or less consisting of the following components (a) to (e) immediately below the metal foil. Is provided.
【０００５】（ａ）アクリルゴム （ｂ）エポキシ樹脂 （ｃ）フェノール樹脂 （ｄ）無機充填剤 （ｅ）キレート化剤(A) Acrylic rubber (b) Epoxy resin (c) Phenolic resin (d) Inorganic filler (e) Chelating agent
【０００６】[0006]
【作用】上記（ｂ）成分は（ａ）成分を硬化させる働き
があり、さらに、（ｃ）および（ｄ）成分を配合するこ
とにより塗布後の粘着性をなくすることができ、併せて
低弾性樹脂層の耐熱性も向上させることができる。そし
て、金属箔の下に形成されている低弾性樹脂層の厚さと
弾性率を上記のように特定することにより、表面実装部
品の半田接続部にかかる応力を低弾性樹脂層で吸収して
緩和し、半田接続部のクラック発生を抑制することがで
きる。低弾性樹脂層中に存在するキレート化剤は高湿度
雰囲気で通電したときにイオン化した金属を捕捉し、耐
マイグレーション性の向上に寄与している。The component (b) has the function of curing the component (a) and, by blending the components (c) and (d), can eliminate the stickiness after coating. The heat resistance of the elastic resin layer can also be improved. By specifying the thickness and elastic modulus of the low elastic resin layer formed below the metal foil as described above, the stress applied to the solder connection portion of the surface mount component is absorbed and reduced by the low elastic resin layer. In addition, it is possible to suppress the occurrence of cracks in the solder connection portion. The chelating agent present in the low elastic resin layer captures ionized metal when energized in a high humidity atmosphere, and contributes to the improvement of migration resistance.
【０００７】[0007]
実施例１〜５，比較例１〜６ （ａ）アクリルゴム（日本ゼオン製「ＬＸ−８５２」） （ｂ）ビスフェノールＡ型エポキシ樹脂（油化シェルエ
ポキシ製「Ｅｐ−８２８」） （ｃ）イソプロピルフェノール樹脂（三井東圧化学製
「パーマノール１００」） （ｄ）水酸化アルミニウム（昭和電工製「Ｈ４２Ｓ
Ｔ」） （ｅ）８−ヒドロキシキノリン（和光純薬製） を表１および表２に示す配合でメチルエチルケトン／ト
ルエン（容量比９／１）混合溶液に溶解分散させ、固形
分３０重量％の樹脂組成物を調製した。前記各樹脂組成
物を、３５μｍ厚の銅箔にロールコータで塗布乾燥し、
この塗布層によって積層板成形後に銅箔の下に形成され
る低弾性樹脂層の厚さが、表１および表２に示す厚さに
なるように調整した。別途、ガラス織布（日東紡製「Ｗ
ＦＡ−１８」，単位重量２０５ｇ／ｍ2）に、ビスフェ
ノールＡ型エポキシ樹脂を含浸乾燥して樹脂付着量４０
重量％のプリプレグ（Ａ）を用意した。また、ガラス不
織布（キュムラス製「ＥＰＭ−４０５０」，単位重量５
０ｇ／ｍ2）に、充填剤として水酸化アルミニウムを配
合したビスフェノールＡ型エポキシ樹脂（樹脂／充填剤
重量比１００／５０）を含浸乾燥して充填剤を含む樹脂
付着量８４重量％のプリプレグ（Ｂ）を用意した。プリ
プレグ（Ｂ）を６プライ重ね、その両側にプリプレグ
（Ａ）を１プライずつ重ね、最表面には上述の樹脂組成
物塗布銅箔を載置して（樹脂組成物塗布面を内側にし
て）、加熱加圧成形により１．６mm厚のコンポジット銅
張り積層板を製造した。Examples 1-5, Comparative Examples 1-6 (a) Acrylic rubber ("LX-852" manufactured by Zeon Corporation) (b) Bisphenol A type epoxy resin ("Ep-828" manufactured by Yuka Shell Epoxy) (c) Isopropyl Phenolic resin (Mitsui Toatsu Chemicals “Permanol 100”) (d) Aluminum hydroxide (Showa Denko “H42S”
T)) (e) 8-Hydroxyquinoline (manufactured by Wako Pure Chemical Industries, Ltd.) was dissolved and dispersed in a mixed solution of methyl ethyl ketone / toluene (volume ratio: 9/1) in a composition shown in Tables 1 and 2 to obtain a resin having a solid content of 30% by weight. A composition was prepared. Each of the resin compositions was applied to a 35 μm thick copper foil by a roll coater and dried,
The thickness of the low-elastic resin layer formed under the copper foil after the laminate was formed by this coating layer was adjusted so as to be the thickness shown in Tables 1 and 2. Separately, glass woven fabric (Nittobo “W
FA-18 ", unit weight 205 g / m 2 ), impregnated with bisphenol A type epoxy resin and dried to obtain a resin adhesion amount of 40.
% By weight of prepreg (A) was prepared. In addition, a glass nonwoven fabric (“EPM-4050” manufactured by Cumulus, unit weight 5
0 g / m 2 ), and impregnated with a bisphenol A type epoxy resin (resin / filler weight ratio 100/50) containing aluminum hydroxide as a filler, and dried by drying. B) was prepared. Six layers of prepreg (B) are stacked, one layer of prepreg (A) is stacked on each side, and the above-mentioned resin composition-coated copper foil is placed on the outermost surface (with the resin composition-coated surface inside). Then, a 1.6 mm-thick composite copper-clad laminate was manufactured by heat and pressure molding.
【０００８】[0008]
【表１】 [Table 1]
【０００９】[0009]
【表２】 [Table 2]
【００１０】従来例 プリプレグ（Ｂ）を６プライ重ね、その両側にプリプレ
グ（Ａ）を１プライずつ重ね、最表面には樹脂組成物を
塗布していない銅箔を載置して、加熱加圧成形により
１．６mm厚のコンポジット銅張り積層板を製造した。銅
箔の下に低弾性樹脂層は形成されない。Conventional Example 6 layers of prepreg (B) are stacked, one layer of prepreg (A) is stacked on each side, and a copper foil not coated with a resin composition is placed on the outermost surface, and heated and pressed. A 1.6 mm thick composite copper-clad laminate was produced by molding. No low elastic resin layer is formed below the copper foil.
【００１１】上記実施例、比較例および従来例の積層板
をプリント配線板に加工し、セラミックチップ部品を半
田接続したときの接続信頼性（半田接続部のクラックに
よる断線発生率）および耐マイグレーション性と積層板
成形に供する銅箔の粘着性についての観察結果を表３お
よび表４に示す。断線発生率は、Ｒ３２１６（セラミッ
クチップレジスタ）を表面実装し（ｎ＝１００）、−３
０℃と１２０℃の冷熱サイクルを繰返し、１０００回サ
イクル後の半田接続部の断線率を計数した。耐マイグレ
ーション性は、銅張り積層板をエッチング加工してライ
ン間隔０．２５mmのクシ型パターンを形成し、これを６
０℃，９５％ＲＨの雰囲気に置いてＤＣ１００Ｖの電圧
を１０００時間かける処理に供し、その後絶縁抵抗の測
定と併せて断面観察を行ないマイグレーション発生の有
無を確認した。 ○：マイグレーション発生なし △：一部マイグレーション発生 ×：ショートあり 粘着性は、５cm角にカットした銅箔を塗布面を下にして
１０枚重ねその上に１０Kgの荷重をかけて、２３℃，湿
度６０％の雰囲気に２４時間放置し、その後に銅箔同士
の貼り付き具合を観察して３段階で評価した。 ○：貼り付きなし △：貼り付きあるも容易に剥離可 ×：剥離不可[0011] The connection reliability (rate of occurrence of disconnection due to cracks in the solder connection portion) and migration resistance when the laminated boards of the above-described examples, comparative examples, and conventional examples are processed into printed wiring boards and ceramic chip components are connected by soldering. Tables 3 and 4 show the results of observations on the adhesiveness of the copper foil to be used for forming the laminate and the laminate. The disconnection rate was determined by mounting R3216 (ceramic chip register) on the surface (n = 100), and
The cooling and heating cycle at 0 ° C. and 120 ° C. was repeated, and the disconnection rate of the solder connection after 1000 cycles was counted. The migration resistance was evaluated by etching a copper-clad laminate to form a comb pattern having a line spacing of 0.25 mm.
The sample was placed in an atmosphere of 0 ° C. and 95% RH and subjected to a process of applying a voltage of 100 V DC for 1000 hours. Thereafter, the cross section was observed together with the measurement of the insulation resistance to confirm the occurrence of migration. ○: No migration occurred △: Some migration occurred ×: Short occurred Adhesion was measured by applying a load of 10 kg on copper foil cut into 5 cm square with the coated surface facing down at 23 ° C and humidity. It was left in a 60% atmosphere for 24 hours, and thereafter, the degree of sticking between the copper foils was observed and evaluated in three steps. ：: No sticking △: Easy peeling with sticking ×: No peeling
【００１２】[0012]
【表３】 [Table 3]
【００１３】[0013]
【表４】 [Table 4]
【００１４】[0014]
【発明の効果】上述のように、本発明に係る金属箔張り
積層板は、プリント配線板の材料として耐熱性に優れる
と共に表面実装部品の半田接続信頼性も確保する上で極
めて好適なものである。そして、耐マイグレーション性
に優れているので、高密度配線にも適している。積層板
の金属箔の下に低弾性樹脂層を形成するために塗布した
樹脂組成物の層は粘着性をなくすることができるので、
積層板製造の作業性を悪くすることがない。As described above, the metal-foil-clad laminate according to the present invention has excellent heat resistance as a material for a printed wiring board and is extremely suitable for securing the solder connection reliability of surface-mounted components. is there. Further, since it has excellent migration resistance, it is suitable for high-density wiring. Since the layer of the resin composition applied to form the low-elastic resin layer under the metal foil of the laminate can lose tackiness,
The workability of manufacturing the laminate is not deteriorated.
Claims (2)
て得たプリプレグの層の表面に金属箔を載置して加熱加
圧成形した金属箔張り積層板において、金属箔の直下に
下記（ａ）〜（ｅ）の成分からなる厚さ２０μｍ以上で
弾性率１０Kgf／mm2以下の低弾性樹脂層を設けたことを
特徴とする金属箔張り積層板。 （ａ）アクリルゴム （ｂ）エポキシ樹脂 （ｃ）フェノール樹脂 （ｄ）無機充填剤 （ｅ）キレート化剤1. A metal foil-clad laminate obtained by placing a metal foil on the surface of a prepreg layer obtained by impregnating and drying a sheet-like base material with a thermosetting resin and heating and press-molding the same, directly under the metal foil. A metal foil-clad laminate comprising a low elastic resin layer having a thickness of 20 μm or more and an elastic modulus of 10 kgf / mm 2 or less, comprising the following components (a) to (e): (A) acrylic rubber (b) epoxy resin (c) phenolic resin (d) inorganic filler (e) chelating agent
てプリプレグを得、当該プリプレグの層の表面に金属箔
を載置して加熱加圧成形する金属箔張り積層板の製造に
おいて、 金属箔に下記（ａ）〜（ｅ）の成分からなる樹脂組成物
を塗布して前記加熱加圧成形を行ない、金属箔の直下に
厚さ２０μｍ以上で弾性率１０Kgf／mm2以下の低弾性樹
脂層を設けることを特徴とする金属箔張り積層板の製造
法。 （ａ）アクリルゴム （ｂ）エポキシ樹脂 （ｃ）フェノール樹脂 （ｄ）無機充填剤 （ｅ）キレート化剤2. A method for producing a metal foil-clad laminate in which a sheet-like substrate is impregnated with a thermosetting resin and dried to obtain a prepreg, a metal foil is placed on the surface of the prepreg layer and heated and pressed. A resin composition comprising the following components (a) to (e) is applied to a metal foil and subjected to the heat and pressure molding, and a low elastic material having a thickness of 20 μm or more and an elastic modulus of 10 kgf / mm 2 or less immediately below the metal foil. A method for producing a metal foil-clad laminate, comprising providing an elastic resin layer. (A) acrylic rubber (b) epoxy resin (c) phenolic resin (d) inorganic filler (e) chelating agent
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6069299A JP3067517B2 (en) | 1994-04-07 | 1994-04-07 | Metal foil clad laminate and method for producing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6069299A JP3067517B2 (en) | 1994-04-07 | 1994-04-07 | Metal foil clad laminate and method for producing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07276563A JPH07276563A (en) | 1995-10-24 |
| JP3067517B2 true JP3067517B2 (en) | 2000-07-17 |
Family
ID=13398559
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6069299A Expired - Fee Related JP3067517B2 (en) | 1994-04-07 | 1994-04-07 | Metal foil clad laminate and method for producing the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3067517B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020123285A1 (en) * | 2000-02-22 | 2002-09-05 | Dana David E. | Electronic supports and methods and apparatus for forming apertures in electronic supports |
| JP4864462B2 (en) * | 2006-01-05 | 2012-02-01 | 株式会社フジクラ | Epoxy adhesive, coverlay, prepreg, metal-clad laminate, printed wiring board |
| JP5272509B2 (en) * | 2008-05-13 | 2013-08-28 | 日立化成株式会社 | Prepreg, metal foil-clad laminate and printed wiring board |
-
1994
- 1994-04-07 JP JP6069299A patent/JP3067517B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH07276563A (en) | 1995-10-24 |
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