JPS6224939B2 - - Google Patents
Info
- Publication number
- JPS6224939B2 JPS6224939B2 JP55066562A JP6656280A JPS6224939B2 JP S6224939 B2 JPS6224939 B2 JP S6224939B2 JP 55066562 A JP55066562 A JP 55066562A JP 6656280 A JP6656280 A JP 6656280A JP S6224939 B2 JPS6224939 B2 JP S6224939B2
- Authority
- JP
- Japan
- Prior art keywords
- diffusion
- wafer
- source
- target
- aluminum oxide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10P32/19—
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/22—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
- H01L21/2225—Diffusion sources
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/22—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
- H01L21/223—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities using diffusion into or out of a solid from or into a gaseous phase
-
- H10P32/12—
-
- H10P32/171—
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S252/00—Compositions
- Y10S252/95—Doping agent source material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S252/00—Compositions
- Y10S252/95—Doping agent source material
- Y10S252/951—Doping agent source material for vapor transport
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/909—Controlled atmosphere
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US06/040,881 US4239560A (en) | 1979-05-21 | 1979-05-21 | Open tube aluminum oxide disc diffusion |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS568819A JPS568819A (en) | 1981-01-29 |
| JPS6224939B2 true JPS6224939B2 (OSRAM) | 1987-05-30 |
Family
ID=21913485
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6656280A Granted JPS568819A (en) | 1979-05-21 | 1980-05-21 | Method of diffusing aluminum |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US4239560A (OSRAM) |
| EP (1) | EP0019272B1 (OSRAM) |
| JP (1) | JPS568819A (OSRAM) |
| DE (1) | DE3063857D1 (OSRAM) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5824006B2 (ja) * | 1980-01-30 | 1983-05-18 | 株式会社日立製作所 | 不純物拡散法 |
| DE3267491D1 (en) * | 1981-03-02 | 1986-01-02 | Bbc Brown Boveri & Cie | Process for doping semiconductor bodies for the production of semiconductor devices |
| US4592793A (en) * | 1985-03-15 | 1986-06-03 | International Business Machines Corporation | Process for diffusing impurities into a semiconductor body vapor phase diffusion of III-V semiconductor substrates |
| DE3782608D1 (de) * | 1986-09-30 | 1992-12-17 | Siemens Ag | Verfahren zum erzeugen eines p-dotierten halbleitergebiets in einem n-leitenden halbleiterkoerper. |
| US5890951A (en) * | 1996-04-15 | 1999-04-06 | Lsi Logic Corporation | Utility wafer for chemical-mechanical planarization |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL6407230A (OSRAM) * | 1963-09-28 | 1965-03-29 | ||
| US3374125A (en) * | 1965-05-10 | 1968-03-19 | Rca Corp | Method of forming a pn junction by vaporization |
| US3577287A (en) * | 1968-02-12 | 1971-05-04 | Gen Motors Corp | Aluminum diffusion technique |
| GB1199399A (en) * | 1968-06-21 | 1970-07-22 | Matsushita Electronics Corp | Improvements in or relating to the Manufacture of Semiconductors. |
| US3644154A (en) * | 1969-06-09 | 1972-02-22 | Ibm | Method of fabricating semiconductor structures with reduced crystallographic defects |
| DE2133877A1 (de) * | 1971-07-07 | 1973-01-18 | Siemens Ag | Anordnung zum eindiffundieren von dotierstoffen in halbleiterscheiben |
| JPS6011457B2 (ja) * | 1973-04-02 | 1985-03-26 | 株式会社日立製作所 | デイポジシヨン法 |
| US3842794A (en) * | 1973-06-29 | 1974-10-22 | Ibm | Apparatus for high temperature semiconductor processing |
| GB1536545A (en) * | 1975-03-26 | 1978-12-20 | Mullard Ltd | Semiconductor device manufacture |
| US4141738A (en) * | 1978-03-16 | 1979-02-27 | Owens-Illinois, Inc. | Melt-formed polycrystalline ceramics and dopant hosts containing phosphorus |
-
1979
- 1979-05-21 US US06/040,881 patent/US4239560A/en not_active Expired - Lifetime
-
1980
- 1980-05-14 EP EP80102674A patent/EP0019272B1/en not_active Expired
- 1980-05-14 DE DE8080102674T patent/DE3063857D1/de not_active Expired
- 1980-05-21 JP JP6656280A patent/JPS568819A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS568819A (en) | 1981-01-29 |
| US4239560A (en) | 1980-12-16 |
| EP0019272B1 (en) | 1983-06-22 |
| EP0019272A1 (en) | 1980-11-26 |
| DE3063857D1 (en) | 1983-07-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US3914138A (en) | Method of making semiconductor devices by single step diffusion | |
| EP0015694B1 (en) | Method for forming an insulating film on a semiconductor substrate surface | |
| KR19990044245A (ko) | 실리콘 단결정 웨이퍼의 열처리 방법과 그 열처리 장치 및 실리콘 단결정 웨이퍼와 그 제조 방법 | |
| US3808065A (en) | Method of polishing sapphire and spinel | |
| US3841927A (en) | Aluminum metaphosphate source body for doping silicon | |
| US3506508A (en) | Use of gas etching under vacuum pressure for purifying silicon | |
| US4235650A (en) | Open tube aluminum diffusion | |
| JPS6224939B2 (OSRAM) | ||
| JP4309714B2 (ja) | 静電吸着機能を有する加熱装置 | |
| JPS5588323A (en) | Manufacture of semiconductor device | |
| US4081293A (en) | Uniform thermomigration utilizing sample movement | |
| JPS61198744A (ja) | デバイスの製造方法 | |
| JPH0324055B2 (OSRAM) | ||
| US3183131A (en) | Semiconductor diffusion method | |
| JPS60200519A (ja) | 発熱体 | |
| TWI303087B (OSRAM) | ||
| CA1157576A (en) | Open tube aluminum oxide disc diffusion | |
| JP3393714B2 (ja) | クランプリング | |
| US3775197A (en) | Method to produce high concentrations of dopant in silicon | |
| US4266990A (en) | Process for diffusion of aluminum into a semiconductor | |
| US3036006A (en) | Method of doping a silicon monocrystal | |
| JP2005166823A (ja) | 半導体基板熱処理装置、半導体基板熱処理用ウェハボート、及び半導体基板の熱処理方法 | |
| JPS59191327A (ja) | 熱処理用治具 | |
| JP3693470B2 (ja) | 保護膜付きシリコンウェーハの製造方法およびその製造装置 | |
| JPS6155918A (ja) | 半導体製造装置 |