JPS6223460B2 - - Google Patents

Info

Publication number
JPS6223460B2
JPS6223460B2 JP59260788A JP26078884A JPS6223460B2 JP S6223460 B2 JPS6223460 B2 JP S6223460B2 JP 59260788 A JP59260788 A JP 59260788A JP 26078884 A JP26078884 A JP 26078884A JP S6223460 B2 JPS6223460 B2 JP S6223460B2
Authority
JP
Japan
Prior art keywords
metal wiring
wiring layer
hole
holes
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP59260788A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60192350A (ja
Inventor
Masaaki Ishizaka
Masae Oota
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP26078884A priority Critical patent/JPS60192350A/ja
Publication of JPS60192350A publication Critical patent/JPS60192350A/ja
Publication of JPS6223460B2 publication Critical patent/JPS6223460B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP26078884A 1984-12-12 1984-12-12 半導体集積回路装置 Granted JPS60192350A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP26078884A JPS60192350A (ja) 1984-12-12 1984-12-12 半導体集積回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26078884A JPS60192350A (ja) 1984-12-12 1984-12-12 半導体集積回路装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2036577A Division JPS5839380B2 (ja) 1977-02-28 1977-02-28 半導体集積回路装置

Publications (2)

Publication Number Publication Date
JPS60192350A JPS60192350A (ja) 1985-09-30
JPS6223460B2 true JPS6223460B2 (enrdf_load_stackoverflow) 1987-05-22

Family

ID=17352741

Family Applications (1)

Application Number Title Priority Date Filing Date
JP26078884A Granted JPS60192350A (ja) 1984-12-12 1984-12-12 半導体集積回路装置

Country Status (1)

Country Link
JP (1) JPS60192350A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63164776U (enrdf_load_stackoverflow) * 1987-04-15 1988-10-27

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5947474B2 (ja) * 1975-10-31 1984-11-19 株式会社東芝 ハンドウタイソウチ

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63164776U (enrdf_load_stackoverflow) * 1987-04-15 1988-10-27

Also Published As

Publication number Publication date
JPS60192350A (ja) 1985-09-30

Similar Documents

Publication Publication Date Title
JP3139781B2 (ja) 半導体装置およびその製造方法
US5128745A (en) Semiconductor device with thin film resistor
US4710398A (en) Semiconductor device and manufacturing method thereof
JP2001217242A (ja) 半導体装置およびその製造方法
EP0216017B1 (en) Method of manufacturing a semiconductor device including forming a multi-level interconnection layer
JPH07307385A (ja) 半導体素子の多層金属配線の形成方法
US5414404A (en) Semiconductor device having a thin-film resistor
US4816895A (en) Integrated circuit device with an improved interconnection line
JPS5839380B2 (ja) 半導体集積回路装置
JPS6223460B2 (enrdf_load_stackoverflow)
KR940002757B1 (ko) 바이폴라형 반도체장치
US6927494B2 (en) Local interconnect
JPS5863150A (ja) 半導体装置の製造方法
JP2950045B2 (ja) 半導体装置の製造方法
JPH0786209A (ja) 半導体装置の製造方法
JP2998454B2 (ja) 半導体装置の製造方法
KR0146206B1 (ko) 반도체 장치용 금속 배선 및 그 제조방법
JP2557281B2 (ja) 半導体装置
JPH0917868A (ja) 半導体集積回路装置の配線接続構造及びその製造方法
JPH0338832A (ja) 半導体装置の配線構造
JPH0547764A (ja) 半導体装置とその製造方法
JPH0697299A (ja) 半導体装置
JP3329148B2 (ja) 配線形成方法
US5599737A (en) Conductive runner fabrication
JPH07161723A (ja) 金属パターンの形成方法