JPS6223452B2 - - Google Patents
Info
- Publication number
- JPS6223452B2 JPS6223452B2 JP4220979A JP4220979A JPS6223452B2 JP S6223452 B2 JPS6223452 B2 JP S6223452B2 JP 4220979 A JP4220979 A JP 4220979A JP 4220979 A JP4220979 A JP 4220979A JP S6223452 B2 JPS6223452 B2 JP S6223452B2
- Authority
- JP
- Japan
- Prior art keywords
- ion implantation
- ions
- ion
- photoresist film
- implantation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
Landscapes
- Physics & Mathematics (AREA)
- High Energy & Nuclear Physics (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4220979A JPS55134929A (en) | 1979-04-06 | 1979-04-06 | Ion implantation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4220979A JPS55134929A (en) | 1979-04-06 | 1979-04-06 | Ion implantation |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS55134929A JPS55134929A (en) | 1980-10-21 |
| JPS6223452B2 true JPS6223452B2 (enrdf_load_stackoverflow) | 1987-05-22 |
Family
ID=12629622
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4220979A Granted JPS55134929A (en) | 1979-04-06 | 1979-04-06 | Ion implantation |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS55134929A (enrdf_load_stackoverflow) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4821085A (en) * | 1985-05-01 | 1989-04-11 | Texas Instruments Incorporated | VLSI local interconnect structure |
| US6458430B1 (en) * | 1999-12-22 | 2002-10-01 | Axcelis Technologies, Inc. | Pretreatment process for plasma immersion ion implantation |
| JP4627964B2 (ja) * | 2002-10-24 | 2011-02-09 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| CN102315105A (zh) * | 2010-07-08 | 2012-01-11 | 中芯国际集成电路制造(上海)有限公司 | 半导体器件的制作方法 |
| JP5925745B2 (ja) * | 2013-10-15 | 2016-05-25 | 株式会社タイヨーパッケージ | 包装用箱及びその展開シート |
-
1979
- 1979-04-06 JP JP4220979A patent/JPS55134929A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS55134929A (en) | 1980-10-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4386968A (en) | Method of making semiconductor device structures by means of ion implantation under a partial pressure of oxygen | |
| JPH11317461A (ja) | デュアルゲートcmos素子用の窒素注入された極めて薄いゲート酸化物の形成方法 | |
| US5219773A (en) | Method of making reoxidized nitrided oxide MOSFETs | |
| EP0171111A2 (en) | Process to superpose two positive photoresist layers | |
| US4851691A (en) | Method for photoresist pretreatment prior to charged particle beam processing | |
| JPS5861643A (ja) | 半導体装置の製造方法 | |
| JPS6223452B2 (enrdf_load_stackoverflow) | ||
| JPS6256653B2 (enrdf_load_stackoverflow) | ||
| JP2000183068A (ja) | 半導体装置の製造方法 | |
| Galloway | VLSI processing, radiation, and hardening | |
| JP3420080B2 (ja) | 半導体装置の製造装置及びその製造方法 | |
| JPH01303727A (ja) | 不純物ゲッタリング方法 | |
| Downey et al. | Control of BF2 dissociation in high-current ion implantation | |
| JPS6057671A (ja) | 半導体装置の製造方法 | |
| GB2159662A (en) | Forming diffused junctions | |
| JP3293929B2 (ja) | 半導体装置の製造方法 | |
| JPH06151349A (ja) | 半導体装置の製造方法 | |
| JPH02133926A (ja) | 半導体装置の製造方法 | |
| JPS6358824A (ja) | 半導体装置の製造方法 | |
| JP2744022B2 (ja) | 半導体装置の製造方法 | |
| JP3213461B2 (ja) | 半導体装置の製造方法 | |
| Henderson et al. | Variable development response of resists using electron beam lithography: Methods and applications | |
| JPS6132433A (ja) | 半導体装置の製造方法 | |
| JPS60195928A (ja) | 半導体装置の製造方法 | |
| JPS60226174A (ja) | 金属硅化物の形成方法 |