JPS6223096Y2 - - Google Patents
Info
- Publication number
- JPS6223096Y2 JPS6223096Y2 JP1981058020U JP5802081U JPS6223096Y2 JP S6223096 Y2 JPS6223096 Y2 JP S6223096Y2 JP 1981058020 U JP1981058020 U JP 1981058020U JP 5802081 U JP5802081 U JP 5802081U JP S6223096 Y2 JPS6223096 Y2 JP S6223096Y2
- Authority
- JP
- Japan
- Prior art keywords
- sealing resin
- substrate
- resin
- bent piece
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011347 resin Substances 0.000 claims description 42
- 229920005989 resin Polymers 0.000 claims description 42
- 238000007789 sealing Methods 0.000 claims description 35
- 239000004065 semiconductor Substances 0.000 claims description 31
- 239000000758 substrate Substances 0.000 claims description 30
- 239000000853 adhesive Substances 0.000 description 12
- 230000001070 adhesive effect Effects 0.000 description 12
- 239000002184 metal Substances 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000004080 punching Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981058020U JPS6223096Y2 (US07534539-20090519-C00280.png) | 1981-04-20 | 1981-04-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981058020U JPS6223096Y2 (US07534539-20090519-C00280.png) | 1981-04-20 | 1981-04-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57170561U JPS57170561U (US07534539-20090519-C00280.png) | 1982-10-27 |
| JPS6223096Y2 true JPS6223096Y2 (US07534539-20090519-C00280.png) | 1987-06-12 |
Family
ID=29854459
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1981058020U Expired JPS6223096Y2 (US07534539-20090519-C00280.png) | 1981-04-20 | 1981-04-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6223096Y2 (US07534539-20090519-C00280.png) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2569008B2 (ja) * | 1986-04-25 | 1997-01-08 | 株式会社日立製作所 | 半導体装置 |
| WO2016016985A1 (ja) * | 2014-07-31 | 2016-02-04 | 三菱電機株式会社 | 半導体装置 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5216864B2 (US07534539-20090519-C00280.png) * | 1973-09-17 | 1977-05-12 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5038257U (US07534539-20090519-C00280.png) * | 1973-08-06 | 1975-04-21 | ||
| JPS51131174U (US07534539-20090519-C00280.png) * | 1975-04-15 | 1976-10-22 | ||
| JPS5535807Y2 (US07534539-20090519-C00280.png) * | 1975-07-22 | 1980-08-23 |
-
1981
- 1981-04-20 JP JP1981058020U patent/JPS6223096Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5216864B2 (US07534539-20090519-C00280.png) * | 1973-09-17 | 1977-05-12 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57170561U (US07534539-20090519-C00280.png) | 1982-10-27 |
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