KR100345163B1 - 볼 그리드 어레이 패키지 - Google Patents
볼 그리드 어레이 패키지 Download PDFInfo
- Publication number
- KR100345163B1 KR100345163B1 KR1020000045484A KR20000045484A KR100345163B1 KR 100345163 B1 KR100345163 B1 KR 100345163B1 KR 1020000045484 A KR1020000045484 A KR 1020000045484A KR 20000045484 A KR20000045484 A KR 20000045484A KR 100345163 B1 KR100345163 B1 KR 100345163B1
- Authority
- KR
- South Korea
- Prior art keywords
- paddle
- exposed
- grid array
- semiconductor chip
- lead frame
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73215—Layer and wire connectors
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
Claims (3)
- 중앙의 패들과, 상기 패들의 적어도 어느 한 측면으로부터 연장되고 밑면에는 돌출부를 갖는 리드를 포함하고, 상기 리드는 패들보다 하부에 위치하는 리드 프레임;상기 리드 프레임의 패들 밑면에, 본드 패드가 외곽을 따라 배치된 표면이 상기 본드 패드가 위로 노출되도록 접착되고, 상기 리드 프레임의 돌출부 밑면보다 돌출되지 않는 두께를 갖는 반도체 칩;상기 반도체 칩의 본드 패드와 리드의 표면을 전기적으로 연결하면서, 상기 패들의 표면보다 돌출되지 않는 금속 와이어;상기 돌출부의 밑면만이 노출되도록, 전체 결과물을 봉지하는 봉지제; 및상기 봉지제로부터 노출된 돌출부 밑면에 마운트된 솔더 볼을 포함하는 것을 특징으로 하는 볼 그리드 어레이 패키지.
- 제 1 항에 있어서, 상기 봉지제의 표면은 리드 프레임의 패들 표면과 동일 평면을 이루는 것을 특징으로 하는 볼 그리드 어레이 패키지.
- 제 1 항 또는 제 2 항에 있어서, 상기 돌출부의 밑면은 반도체 칩의 밑면과 동일 평면을 이루는 것을 특징으로 하는 볼 그리드 어레이 패키지.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020000045484A KR100345163B1 (ko) | 2000-08-05 | 2000-08-05 | 볼 그리드 어레이 패키지 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020000045484A KR100345163B1 (ko) | 2000-08-05 | 2000-08-05 | 볼 그리드 어레이 패키지 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20020012057A KR20020012057A (ko) | 2002-02-15 |
KR100345163B1 true KR100345163B1 (ko) | 2002-07-24 |
Family
ID=19681924
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020000045484A KR100345163B1 (ko) | 2000-08-05 | 2000-08-05 | 볼 그리드 어레이 패키지 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR100345163B1 (ko) |
-
2000
- 2000-08-05 KR KR1020000045484A patent/KR100345163B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
KR20020012057A (ko) | 2002-02-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100477020B1 (ko) | 멀티 칩 패키지 | |
US7274088B2 (en) | Flip-chip semiconductor package with lead frame as chip carrier and fabrication method thereof | |
US7008824B2 (en) | Method of fabricating mounted multiple semiconductor dies in a package | |
JPH08116016A (ja) | リードフレーム及び半導体装置 | |
JP2006318996A (ja) | リードフレームおよび樹脂封止型半導体装置 | |
JP2001015668A (ja) | 樹脂封止型半導体パッケージ | |
US6774479B2 (en) | Electronic device having a semiconductor chip on a semiconductor chip connection plate and a method for producing the electronic device | |
JPH05335474A (ja) | 樹脂封止半導体装置 | |
JP4611569B2 (ja) | リードフレーム及び半導体装置の製造方法 | |
KR100379089B1 (ko) | 리드프레임 및 이를 이용한 반도체패키지 | |
KR100345163B1 (ko) | 볼 그리드 어레이 패키지 | |
JPH0697349A (ja) | 樹脂封止型半導体装置とその製造方法 | |
US7009304B2 (en) | Resin-sealed semiconductor device | |
KR100370480B1 (ko) | 반도체 패키지용 리드 프레임 | |
KR100345164B1 (ko) | 스택 패키지 | |
JP2885786B1 (ja) | 半導体装置の製法および半導体装置 | |
KR100214857B1 (ko) | 멀티 칩 패키지 | |
KR19980058402A (ko) | 솔더 범프를 이용한 스택 패키지 | |
KR100345162B1 (ko) | 볼 그리드 어레이 패키지 | |
KR100364842B1 (ko) | 반도체 패키지 및 그의 제조 방법 | |
US20030037947A1 (en) | Chip scale package with a small surface mounting area | |
KR20030055834A (ko) | 리드프레임을 이용하는 볼 그리드 어레이형 반도체 칩패키지와 적층 패키지 | |
JP3082562U (ja) | マルチーチップパッケージ | |
KR20020012053A (ko) | 볼 그리드 어레이 패키지 | |
KR20060131191A (ko) | 칩 스택 패키지 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20130704 Year of fee payment: 12 |
|
FPAY | Annual fee payment |
Payment date: 20140704 Year of fee payment: 13 |
|
FPAY | Annual fee payment |
Payment date: 20150623 Year of fee payment: 14 |
|
FPAY | Annual fee payment |
Payment date: 20160624 Year of fee payment: 15 |
|
FPAY | Annual fee payment |
Payment date: 20170628 Year of fee payment: 16 |
|
FPAY | Annual fee payment |
Payment date: 20180627 Year of fee payment: 17 |
|
FPAY | Annual fee payment |
Payment date: 20190626 Year of fee payment: 18 |