JPS62230016A - Manufacture of terminal lead wires for electronic equipment parts - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

Detailed Description of the Invention (Field of Industrial Application) The present invention relates to a method for manufacturing copper alloy terminal lead wires used in resistors, capacitors, silicon or germanium semiconductor devices, etc., and particularly relates to a method for manufacturing copper alloy terminal lead wires used in resistors, capacitors, silicon or germanium semiconductor devices, etc. The present invention relates to a method for producing a terminal lead wire for an electronic device component, which maintains excellent a-mechanical properties even when one end is subjected to compression molding processing as a lead wire terminal or heat treated together with an element component.

(Prior Art) Pure copper wire, heat-resistant copper alloy wire, etc. are used for terminal lead wires for electronic device parts. These lead wires are used as terminal lead wires for components, so one end of the lead wire is compression molded (hereinafter referred to as header processing) and then cut into a fixed length using high-speed automated equipment for mass production.

Therefore, if the wire is hard, it will be difficult to process the header, causing cranks in the molding process, which will hinder the mass production process. Therefore, it is necessary to temper the hardness of the wire depending on the application.

Further, during the manufacturing process of electronic device parts, when or after the lead wire is attached to the element component, the lead wire is subjected to various heat treatments and unavoidable bending stress, so that the lead wire is softened and bent.

For example, lead wires used in resistors and capacitors undergo heat treatment at about 250° C. during manufacturing processes such as brazing, molding, painting, and stabilization. In addition, for semiconductor devices, the temperature is 300℃ to 40℃ for soldering between device parts and terminal lead wires.
After heat treatment at 0° C. for about 10 minutes, the soldered portion is molded with a synthetic resin material.

In particular, when the lead wire is made of pure copper, it has high electrical conductivity and thermal conductivity, but heat treatment at around 200°C recrystallizes and softens it, reducing its bending strength. , or the lead wire is bent during the plating process on the copper wire.

Therefore, pure copper wire cannot be used when undergoing high-temperature heat treatment.

Automated mass production methods are used to manufacture these electronic device parts, so if the terminal lead wires become softened and bent, it is no longer possible to manually sort out or correct the bends, which hinders automation. This also causes trouble when mounting the element components on a printed circuit board.

For this reason, heat-resistant copper alloy wires containing a small amount of elements such as Ag, Sn, and In are used as lead wires that undergo heat treatment at high temperatures.

After cold wire drawing, the alloy wire is subjected to continuous softening or hatch softening to improve the hardness of the wire, but variations in header workability and bending strength after high-temperature heat treatment have yet to be resolved. Therefore, even if the characteristics of the element parts are highly reliable, defects in the terminal lead wires still pose problems for automation.

(Problems to be Solved by the Invention) The characteristics that a lead wire that is suitable for the automatic production system of electronic device parts should have are: ■Good header workability;■
It has heat resistance against process heat treatment (400° C. x 10 minutes), it has an electrical conductivity of 0.95% or more and has good thermal conductivity for heat radiation, and (1) it has strong bending resistance against bending stress.

Regarding these required characteristics, it is preferable to use a heat-resistant and highly conductive copper alloy, and the alloy composition is Ag, Sn, In, Pb, Bi, Cr, Co.
, Ni, Fe, Zr.

A copper alloy wire to which one or more of elements such as Se, Te, HE, B, and TtSP is added in a range of 0.02 to 0.2 wt% is used. Regarding (2), there is a mutually contradictory relationship in that if the wire is made to have bending resistance, the wire becomes hard, which causes problems in header workability, and if the wire is made soft, the bending resistance decreases.

An object of the present invention is to solve this problem and provide a more stable manufacturing method for the copper alloy wire so that the wire has good hardness and bending resistance.

(Means for Solving the Invention) As a result of further investigation into a method of refining a wire rod that satisfies the above-mentioned required characteristics, the present inventors found that the tensile strength value of the copper alloy wire rod before heat treatment is 27 to 27. 35 kg/mm'' and an elongation value in the range of 7 to 32%, the present invention was completed by discovering that it has both header workability and bending resistance properties. It is something.

That is, the structure of the present invention is to cold-draw a copper alloy wire, completely anneale it, then cold-draw it with an area reduction in the range of 60 to 90%, and then completely draw the wire again. After annealing, it is characterized by cold wire drawing with an area reduction in the range of 2 to 20%.

Detailed Description of the Present Invention The copper alloy wire used in the present invention is made of Cu as a base material, and is coated with Ag, Sn, In, and Pbs Bi.

CrSCo. ,”NiSFe,,Zr,,Se,Te
.

It has an alloy composition in which one or more of elements such as HE, B, Ti, and P are added in an amount of 0.02 to 0.2 wt% relative to Cu.

In the present invention, after wire-drawing a rough drawn copper alloy wire, the wire is first annealed, and the wire is drawn again with an area reduction rate in the range of 60 to 90%, and then the wire is secondarily annealed to reduce the area reduction. When wire drawing is performed in the range of area ratio 2 to 20%, mechanical properties such as tensile strength, 27 to 3
It has an elongation of 5 kg/mm" and can be tempered into a wire having a tensile strength of 7 to 32%.

In the above, after the primary annealing, wire drawing is performed with an area reduction rate in the range of 60 to 90%, because if the area reduction rate is less than 60%, the resulting copper alloy wire will not be hardened and it will be difficult to attach it to element parts. This is because the lead wires are subjected to heat treatment at 400° C. for XIO minutes in the actual production process, and the lead wires are bent in various steps. On the other hand, if it exceeds 90%, the resulting copper alloy wire becomes too hard, making it difficult to process the header of the terminal lead wire, and creating a crank in the header process, which is not preferable.

Next, after secondary annealing, wire drawing is performed with an area reduction rate of 2 to 20%.If the area reduction rate is less than 2%, the resulting copper alloy wire will not be hardened and will not be attached to the element parts. This is because the lead wires are subjected to heat treatment at 400° C. for IO minutes in the actual production process, and the lead wires are bent in various steps. On the contrary, 20%
When exceeding , the resulting copper alloy wire becomes too hard,
This is because the processability of the terminal lead wire becomes poor, and the header processed portion is undesirably cranked.

(Examples) Next, the present invention will be explained in more detail with reference to Examples, Comparative Examples, and Reference Examples, but the present invention is not limited only to these Examples.

As shown in Tables 1 and 2, Cu-0,1A g
, Cu-0,05S n, Cu-0,13I
n.

Three types of heat-resistant, highly conductive copper alloy rough drawn wires were manufactured, and after each was subjected to cold wire drawing, primary annealing and secondary annealing were performed at 400°C for 3 hours for the former, and at 380°C for 3 hours for the latter.
As batch annealing for several hours, wire drawing was carried out using the wave front ratios shown in Tables 1 and 2 to produce wire rods with a wire diameter of 0.8 mmφ.

Then, the wire rod was subjected to header processing using a high-speed automatic ladder processing machine, and the suitability of header processing and whether or not cracks were generated in the hengoku-processed portion were investigated. Furthermore, lead wires are attached to electronic device element parts and subjected to heat treatment at 400°C for 10 minutes in the actual production process. We investigated whether this would cause problems in production. These results are also listed in Tables 1 and 2.

As can be seen from the results, Examples 1 to 27 showed good results because the header workability, that is, the softness of the wire rod, was properly tempered, and the bending resistance after heat treatment was also good. Since the hardness of the wire is appropriately tempered, it is suitable for the production process of element parts, and the lead wire is not bent.

In Comparative Examples 28 to 42, the softness and hardness of the wire rods were not properly tempered, so even if the header workability was good, the bending resistance after heat treatment was unfavorable, and the opposite was true. It can be seen that neither of these materials can be tempered into a suitable wire material.

In Reference Examples 43 to 5I, the wire rod was only subjected to secondary annealing, that is,
Since thermal refining does not require primary annealing, some wire rods satisfy both header workability and bending resistance after heat treatment, but there are cases where either one is lacking, so thermal refining is used in wire refining methods. The scope will be limited.

Next, in this example, batch annealing was performed, but it goes without saying that continuous wire drawing and softening equipment can be used for annealing.

(Effects of the Invention) The lead wire manufactured by the present invention not only has excellent reliability in bending strength against high-temperature heat treatment, but also has excellent mechanical properties, high electrical conductivity, good thermal conductivity, and header processability. Because it is excellent in quality, easy to manufacture, and inexpensive, it is used as a terminal lead wire for electronic equipment parts such as semiconductor elements such as silicon and germanium, resistors, capacitors, switches, connectors, and coil parts, which are manufactured using automatic production methods. This has a remarkable effect.

Patent applicant: TAC Electric Wire Co., Ltd. Japan Mining Line Co., Ltd.

Claims (1)

[Claims] After completely annealing the copper alloy wire, the area reduction rate is 60-90%
A terminal lead wire for electronic device parts, characterized in that the wire is cold-drawn in a range of 2 to 20%, and then the wire is completely annealed again, and then cold-drawn to a reduction in area of 2 to 20%. Production method.