JPS6220263B2 - - Google Patents

Description

[Detailed description of the invention]

INDUSTRIAL APPLICATION FIELD The present invention relates to an inexpensive copper alloy with excellent heat resistance and conductivity, and more specifically, for example, resistors,
This invention relates to copper alloys suitable for terminal lead wires, lead frames, etc. of capacitors, silicon or germanium semiconductor components, etc. Prior art The bare wires of terminal lead wires for electronic equipment parts are as follows:
Conventionally, pure copper, copper-silver alloy, copper-cadmium alloy, etc. have been used. The lead wires are subjected to various heat treatments and unavoidable bending stress during the manufacturing process of electronic device parts, so they are softened and placed under conditions where they are easily bent. For example, lead wires used in resistors, capacitors, etc. undergo heat treatment at approximately 250°C during manufacturing processes such as brazing, molding, painting, and stabilization. Further, in the case of a semiconductor element, after the lead wires at both ends are heat-treated at 300 to 400° C. for about 10 minutes during soldering, the soldered portion is molded with synthetic resin. In particular, when the wire is pure copper wire, it has high electrical conductivity and thermal conductivity, but heat treatment at around 200°C recrystallizes and softens the bending strength, reducing the bending strength. During the process, bends occur in the wire. These electronic device parts are manufactured using automated mass production methods, so if the terminal lead wires become soft and bend, it can cause problems when mounting these electronic device parts on printed circuit boards. Become. Furthermore, if the lead wires that have been bent in this manner are manually sorted and corrected one by one, the advantages of automation are completely lost. Therefore, the lead wire has a material that does not easily soften even when subjected to heat treatment.
So-called heat resistance is required. In addition to the above-mentioned heat resistance, which is a characteristic required when manufacturing electronic device parts in a mass production method, the strands for this type of lead wire must have high electrical conductivity and excellent thermal conductivity. It is also necessary to meet requirements such as low cost. From this point of view, copper-silver alloys cannot be said to be fully satisfactory mainly in terms of price and heat resistance. Purpose of the invention The present invention has the following advantages in terms of heat resistance, conductivity, cost, etc.
The object of the present invention is to provide a copper alloy that fully satisfies the requirements for terminal lead wires, lead frames, etc. of electronic equipment parts. Structure of the Invention As a result of various researches to obtain an inexpensive copper alloy that has the high performance required for electronic device component materials, the inventor has achieved the objective by adjusting the amounts of indium and antimony added. They have discovered what can be achieved and have completed the present invention. That is, the present invention provides a heat-resistant and conductive material characterized in that the total content of indium and antimony is 0.02 to 0.15% by weight, each content is 0.006% by weight or more, and the balance is substantially copper. This relates to a copper alloy with excellent properties. In the present invention, the content of indium and antimony is each 0.006% by weight (hereinafter simply referred to as %).
The total amount shall be within the range of 0.02 to 0.15%. If the content of both is less than 0.02%, heat resistance cannot be sufficiently improved, and one
When it exceeds 0.15%, conductivity decreases.
Furthermore, if the content of either indium or antimony is less than 0.006%, heat resistance will not be sufficiently improved. Effects of the present invention The copper alloy of the present invention not only has excellent properties such as heat resistance, mechanical strength, electrical conductivity, and heat conductivity, but also has excellent formability, is easy to manufacture, and is inexpensive.
It is useful as a structural material for springs, radiator fins, etc., as well as wires for terminal lead wires and lead frames of electronic equipment parts. In order to obtain better moldability, it is desirable to use oxygen-free copper having an oxygen content of about 0.0001 to 0.005% by weight, for example. Embodiments Hereinafter, Examples, Comparative Examples, and Conventional Examples will be shown in order to further clarify the features of the present invention. A predetermined amount of indium, antimony, or silver was added to copper in a high frequency melting furnace to obtain a uniform molten metal. Next, the molten metal was poured into a carbon mold to obtain an ingot with a diameter of 130 mm and a length of 700 mm. The cast ingot was cut, surface-finished, and hot extruded to obtain a rough drawn wire with a diameter of 11 mm, which was then cold drawn to a diameter of 0.8 mm. After annealing the copper alloy wire with a diameter of 0.8 mm obtained above at 300°C for 1 hour, the bending strength and tensile strength were measured.
Heat resistance was determined. Furthermore, the conductivity of the copper alloy wire with a diameter of 0.8 mm obtained above was measured. These results are shown in Table 1.
Table 1 shows the results for pure copper and a copper-indium-antimony alloy outside the composition range of the present invention as a comparative example, and the results for a copper-silver alloy as a conventional example.

【table】

[Table] From the results of each example shown in Table 1, the copper alloy of the present invention has sufficient bending strength and tensile strength, and also maintains high electrical conductivity even after heat treatment at high temperatures. It is clear that there are. In other words, it is clear that the copper alloy of the present invention uses indium and antimony, which are extremely inexpensive compared to silver, but has superior performance to copper-silver alloys in terms of overall properties of heat resistance and conductivity. It is.

Claims (1)

[Claims] 1 The total content of indium and antimony is 0.02
~0.15% by weight and each content is 0.006
A copper alloy with excellent heat resistance and electrical conductivity, characterized in that at least % by weight, the balance is essentially copper.