JPS6222825A - 封止用樹脂組成物 - Google Patents
封止用樹脂組成物Info
- Publication number
- JPS6222825A JPS6222825A JP16128685A JP16128685A JPS6222825A JP S6222825 A JPS6222825 A JP S6222825A JP 16128685 A JP16128685 A JP 16128685A JP 16128685 A JP16128685 A JP 16128685A JP S6222825 A JPS6222825 A JP S6222825A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- epoxy
- resin composition
- butadiene
- methyl methacrylate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011342 resin composition Substances 0.000 title claims description 23
- 238000007789 sealing Methods 0.000 title claims description 17
- 239000003822 epoxy resin Substances 0.000 claims abstract description 21
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 21
- 229920006026 co-polymeric resin Polymers 0.000 claims abstract description 14
- 229920003986 novolac Polymers 0.000 claims abstract description 14
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 claims abstract description 10
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000011256 inorganic filler Substances 0.000 claims abstract description 10
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 10
- 239000005011 phenolic resin Substances 0.000 claims abstract description 10
- 125000003700 epoxy group Chemical group 0.000 claims abstract description 6
- 229920001568 phenolic resin Polymers 0.000 claims abstract description 6
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims abstract description 5
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 3
- 239000010680 novolac-type phenolic resin Substances 0.000 claims description 8
- WWNGFHNQODFIEX-UHFFFAOYSA-N buta-1,3-diene;methyl 2-methylprop-2-enoate;styrene Chemical compound C=CC=C.COC(=O)C(C)=C.C=CC1=CC=CC=C1 WWNGFHNQODFIEX-UHFFFAOYSA-N 0.000 claims description 5
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical compound C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 claims description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 abstract description 16
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 abstract description 14
- 239000000203 mixture Substances 0.000 abstract description 14
- 229920005989 resin Polymers 0.000 abstract description 11
- 239000011347 resin Substances 0.000 abstract description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 10
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 abstract description 6
- 238000002156 mixing Methods 0.000 abstract description 6
- 239000000843 powder Substances 0.000 abstract description 6
- 239000000377 silicon dioxide Substances 0.000 abstract description 4
- 239000006087 Silane Coupling Agent Substances 0.000 abstract description 2
- 239000003086 colorant Substances 0.000 abstract description 2
- 239000003063 flame retardant Substances 0.000 abstract description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 abstract 1
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 239000012778 molding material Substances 0.000 description 8
- 239000003795 chemical substances by application Substances 0.000 description 5
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 4
- 238000011109 contamination Methods 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000005350 fused silica glass Substances 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 239000001993 wax Substances 0.000 description 2
- QSSXJPIWXQTSIX-UHFFFAOYSA-N 1-bromo-2-methylbenzene Chemical compound CC1=CC=CC=C1Br QSSXJPIWXQTSIX-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 241000218691 Cupressaceae Species 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 125000000113 cyclohexyl group Chemical class [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- CAYGQBVSOZLICD-UHFFFAOYSA-N hexabromobenzene Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1Br CAYGQBVSOZLICD-UHFFFAOYSA-N 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 239000004843 novolac epoxy resin Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 125000005480 straight-chain fatty acid group Chemical class 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 235000010215 titanium dioxide Nutrition 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16128685A JPS6222825A (ja) | 1985-07-23 | 1985-07-23 | 封止用樹脂組成物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16128685A JPS6222825A (ja) | 1985-07-23 | 1985-07-23 | 封止用樹脂組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6222825A true JPS6222825A (ja) | 1987-01-31 |
| JPH0513185B2 JPH0513185B2 (enrdf_load_stackoverflow) | 1993-02-19 |
Family
ID=15732219
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16128685A Granted JPS6222825A (ja) | 1985-07-23 | 1985-07-23 | 封止用樹脂組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6222825A (enrdf_load_stackoverflow) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02110127A (ja) * | 1988-10-19 | 1990-04-23 | Toshiba Chem Corp | 封止用樹脂組成物 |
| US5043211A (en) * | 1987-03-31 | 1991-08-27 | Kabushiki Kaisha Toshiba | Epoxy resin composition and a resin-sealed semiconductor device |
| US5068267A (en) * | 1988-09-13 | 1991-11-26 | Kabushiki Kaisha Toshiba | Semiconductor device encapsulant consisting of epoxy resin composition |
| AU634210B2 (en) * | 1989-03-02 | 1993-02-18 | Rohm And Haas Company | Epoxy encapsulant compositions and low stress additive systems |
| US5258426A (en) * | 1989-02-23 | 1993-11-02 | Kabushiki Kaisha Toshiba | Semiconductor device encapsulant |
| EP0325022B1 (en) * | 1988-01-06 | 1994-04-27 | Kabushiki Kaisha Toshiba | Rubber-modified phenolic resin composition and method of manufacturing the same |
| WO2005078013A1 (ja) * | 2004-02-16 | 2005-08-25 | Mitsubishi Rayon Co., Ltd. | 樹脂用改質剤及びこれを用いた樹脂組成物、成形品 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58108220A (ja) * | 1981-12-21 | 1983-06-28 | Mitsubishi Gas Chem Co Inc | 半導体封止用エポキシ樹脂組成物 |
| JPS5975922A (ja) * | 1982-10-23 | 1984-04-28 | Denki Kagaku Kogyo Kk | エポキシ樹脂系成形材料 |
| JPS601220A (ja) * | 1983-06-17 | 1985-01-07 | Denki Kagaku Kogyo Kk | 半導体封止用エポキシ樹脂組成物 |
| JPS61208856A (ja) * | 1985-03-14 | 1986-09-17 | Nitto Electric Ind Co Ltd | 半導体装置 |
-
1985
- 1985-07-23 JP JP16128685A patent/JPS6222825A/ja active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58108220A (ja) * | 1981-12-21 | 1983-06-28 | Mitsubishi Gas Chem Co Inc | 半導体封止用エポキシ樹脂組成物 |
| JPS5975922A (ja) * | 1982-10-23 | 1984-04-28 | Denki Kagaku Kogyo Kk | エポキシ樹脂系成形材料 |
| JPS601220A (ja) * | 1983-06-17 | 1985-01-07 | Denki Kagaku Kogyo Kk | 半導体封止用エポキシ樹脂組成物 |
| JPS61208856A (ja) * | 1985-03-14 | 1986-09-17 | Nitto Electric Ind Co Ltd | 半導体装置 |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5043211A (en) * | 1987-03-31 | 1991-08-27 | Kabushiki Kaisha Toshiba | Epoxy resin composition and a resin-sealed semiconductor device |
| EP0325022B1 (en) * | 1988-01-06 | 1994-04-27 | Kabushiki Kaisha Toshiba | Rubber-modified phenolic resin composition and method of manufacturing the same |
| US5068267A (en) * | 1988-09-13 | 1991-11-26 | Kabushiki Kaisha Toshiba | Semiconductor device encapsulant consisting of epoxy resin composition |
| JPH02110127A (ja) * | 1988-10-19 | 1990-04-23 | Toshiba Chem Corp | 封止用樹脂組成物 |
| US5258426A (en) * | 1989-02-23 | 1993-11-02 | Kabushiki Kaisha Toshiba | Semiconductor device encapsulant |
| AU634210B2 (en) * | 1989-03-02 | 1993-02-18 | Rohm And Haas Company | Epoxy encapsulant compositions and low stress additive systems |
| WO2005078013A1 (ja) * | 2004-02-16 | 2005-08-25 | Mitsubishi Rayon Co., Ltd. | 樹脂用改質剤及びこれを用いた樹脂組成物、成形品 |
| JPWO2005078013A1 (ja) * | 2004-02-16 | 2007-10-18 | 三菱レイヨン株式会社 | 樹脂用改質剤及びこれを用いた樹脂組成物、成形品 |
| KR100805505B1 (ko) * | 2004-02-16 | 2008-02-20 | 미츠비시 레이온 가부시키가이샤 | 수지용 개질제 및 이것을 이용한 수지 조성물, 및 성형품 |
| JP5069857B2 (ja) * | 2004-02-16 | 2012-11-07 | 三菱レイヨン株式会社 | 樹脂用改質剤及びこれを用いた樹脂組成物、成形品 |
| US9206310B2 (en) | 2004-02-16 | 2015-12-08 | Mitsubishi Rayon Co., Ltd. | Modifier for resin and resin composition using the same and formed article |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0513185B2 (enrdf_load_stackoverflow) | 1993-02-19 |
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