JPS6222480B2 - - Google Patents

Info

Publication number

JPS6222480B2

JPS6222480B2 JP55027546A JP2754680A JPS6222480B2 JP S6222480 B2 JPS6222480 B2 JP S6222480B2 JP 55027546 A JP55027546 A JP 55027546A JP 2754680 A JP2754680 A JP 2754680A JP S6222480 B2 JPS6222480 B2 JP S6222480B2

Authority

JP

Japan

Prior art keywords

conductor layer

layer

forming

hole

printed wiring

Prior art date

1980-03-05

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Links

• Espacenet
• Global Dossier
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• 239000004020 conductor Substances 0.000 claims description 38
• 238000005530 etching Methods 0.000 claims description 22
• 238000004519 manufacturing process Methods 0.000 claims description 6
• 238000000034 method Methods 0.000 claims description 5
• 239000010410 layer Substances 0.000 description 34
• 239000011888 foil Substances 0.000 description 15
• 239000002184 metal Substances 0.000 description 15
• 229910052751 metal Inorganic materials 0.000 description 15
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
• 239000011889 copper foil Substances 0.000 description 9
• 238000005553 drilling Methods 0.000 description 7
• 229910000679 solder Inorganic materials 0.000 description 7
• 230000017525 heat dissipation Effects 0.000 description 5
• 239000000758 substrate Substances 0.000 description 4
• YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
• 239000011248 coating agent Substances 0.000 description 3
• 238000000576 coating method Methods 0.000 description 3
• 238000005476 soldering Methods 0.000 description 3
• ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 2
• WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
• 238000007747 plating Methods 0.000 description 2
• 239000004593 Epoxy Substances 0.000 description 1
• 239000000853 adhesive Substances 0.000 description 1
• 230000001070 adhesive effect Effects 0.000 description 1
• 239000012790 adhesive layer Substances 0.000 description 1
• BGTFCAQCKWKTRL-YDEUACAXSA-N chembl1095986 Chemical compound C1[C@@H](N)[C@@H](O)[C@H](C)O[C@H]1O[C@@H]([C@H]1C(N[C@H](C2=CC(O)=CC(O[C@@H]3[C@H]([C@@H](O)[C@H](O)[C@@H](CO)O3)O)=C2C=2C(O)=CC=C(C=2)[C@@H](NC(=O)[C@@H]2NC(=O)[C@@H]3C=4C=C(C(=C(O)C=4)C)OC=4C(O)=CC=C(C=4)[C@@H](N)C(=O)N[C@@H](C(=O)N3)[C@H](O)C=3C=CC(O4)=CC=3)C(=O)N1)C(O)=O)=O)C(C=C1)=CC=C1OC1=C(O[C@@H]3[C@H]([C@H](O)[C@@H](O)[C@H](CO[C@@H]5[C@H]([C@@H](O)[C@H](O)[C@@H](C)O5)O)O3)O[C@@H]3[C@H]([C@@H](O)[C@H](O)[C@@H](CO)O3)O[C@@H]3[C@H]([C@H](O)[C@@H](CO)O3)O)C4=CC2=C1 BGTFCAQCKWKTRL-YDEUACAXSA-N 0.000 description 1
• 230000002493 climbing effect Effects 0.000 description 1
• 238000010835 comparative analysis Methods 0.000 description 1
• 229960003280 cupric chloride Drugs 0.000 description 1
• 238000000151 deposition Methods 0.000 description 1
• 230000000694 effects Effects 0.000 description 1
• 239000000463 material Substances 0.000 description 1
• 230000035515 penetration Effects 0.000 description 1
• 239000011347 resin Substances 0.000 description 1
• 229920005989 resin Polymers 0.000 description 1
• 239000004065 semiconductor Substances 0.000 description 1
• 239000002904 solvent Substances 0.000 description 1