JPS6222449B2 - - Google Patents
Info
- Publication number
- JPS6222449B2 JPS6222449B2 JP54092947A JP9294779A JPS6222449B2 JP S6222449 B2 JPS6222449 B2 JP S6222449B2 JP 54092947 A JP54092947 A JP 54092947A JP 9294779 A JP9294779 A JP 9294779A JP S6222449 B2 JPS6222449 B2 JP S6222449B2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- metallized
- bonding
- grounding
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W70/60—
-
- H10W72/5449—
-
- H10W72/5522—
-
- H10W90/754—
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9294779A JPS5617049A (en) | 1979-07-20 | 1979-07-20 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9294779A JPS5617049A (en) | 1979-07-20 | 1979-07-20 | Semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5617049A JPS5617049A (en) | 1981-02-18 |
| JPS6222449B2 true JPS6222449B2 (cg-RX-API-DMAC10.html) | 1987-05-18 |
Family
ID=14068658
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9294779A Granted JPS5617049A (en) | 1979-07-20 | 1979-07-20 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5617049A (cg-RX-API-DMAC10.html) |
-
1979
- 1979-07-20 JP JP9294779A patent/JPS5617049A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5617049A (en) | 1981-02-18 |
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