JPS6222449B2 - - Google Patents

Info

Publication number
JPS6222449B2
JPS6222449B2 JP54092947A JP9294779A JPS6222449B2 JP S6222449 B2 JPS6222449 B2 JP S6222449B2 JP 54092947 A JP54092947 A JP 54092947A JP 9294779 A JP9294779 A JP 9294779A JP S6222449 B2 JPS6222449 B2 JP S6222449B2
Authority
JP
Japan
Prior art keywords
lead
metallized
bonding
grounding
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54092947A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5617049A (en
Inventor
Katsuhiko Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP9294779A priority Critical patent/JPS5617049A/ja
Publication of JPS5617049A publication Critical patent/JPS5617049A/ja
Publication of JPS6222449B2 publication Critical patent/JPS6222449B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/60
    • H10W72/5449
    • H10W72/5522
    • H10W90/754

Landscapes

  • Die Bonding (AREA)
JP9294779A 1979-07-20 1979-07-20 Semiconductor device Granted JPS5617049A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9294779A JPS5617049A (en) 1979-07-20 1979-07-20 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9294779A JPS5617049A (en) 1979-07-20 1979-07-20 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS5617049A JPS5617049A (en) 1981-02-18
JPS6222449B2 true JPS6222449B2 (cg-RX-API-DMAC10.html) 1987-05-18

Family

ID=14068658

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9294779A Granted JPS5617049A (en) 1979-07-20 1979-07-20 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5617049A (cg-RX-API-DMAC10.html)

Also Published As

Publication number Publication date
JPS5617049A (en) 1981-02-18

Similar Documents

Publication Publication Date Title
US8067823B2 (en) Chip scale package having flip chip interconnect on die paddle
US5384488A (en) Configuration and method for positioning semiconductor device bond pads using additional process layers
JPH09260552A (ja) 半導体チップの実装構造
US20020114133A1 (en) Cavity-down tape ball grid array package assembly with grounded heat sink and method of fabricating the same
JPS61274333A (ja) 半導体装置
JP2569400B2 (ja) 樹脂封止型半導体装置の製造方法
JPS6222449B2 (cg-RX-API-DMAC10.html)
JP2646989B2 (ja) チップキャリア
JP3394480B2 (ja) 半導体装置
JPH0590486A (ja) 半導体装置
US10840179B2 (en) Electronic devices with bond pads formed on a molybdenum layer
JPH05347324A (ja) 半導体パッケージ
JPS62196839A (ja) ハイブリツド型半導体装置
JPH03274755A (ja) 樹脂封止半導体装置とその製造方法
KR100362501B1 (ko) 반도체장치
JPH09252020A (ja) 半導体装置およびその製造方法
JPH0414503B2 (cg-RX-API-DMAC10.html)
JPS639749B2 (cg-RX-API-DMAC10.html)
JPS5928049B2 (ja) 半導体装置のリ−ド接続方法
JPH0481859B2 (cg-RX-API-DMAC10.html)
JP4575928B2 (ja) 半導体装置
JP2783089B2 (ja) セラミック型半導体装置
JPH03178140A (ja) 樹脂封止型半導体装置
KR100337458B1 (ko) 반도체패키지의 제조 방법
JPS6322615B2 (cg-RX-API-DMAC10.html)