JPS6222268B2 - - Google Patents
Info
- Publication number
- JPS6222268B2 JPS6222268B2 JP12242883A JP12242883A JPS6222268B2 JP S6222268 B2 JPS6222268 B2 JP S6222268B2 JP 12242883 A JP12242883 A JP 12242883A JP 12242883 A JP12242883 A JP 12242883A JP S6222268 B2 JPS6222268 B2 JP S6222268B2
- Authority
- JP
- Japan
- Prior art keywords
- substrates
- ceramic substrate
- ceramic
- thickness direction
- cracks
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims abstract description 60
- 239000000919 ceramic Substances 0.000 claims abstract description 43
- 238000005336 cracking Methods 0.000 abstract description 5
- 239000004065 semiconductor Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/562—Protection against mechanical damage
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12242883A JPS5925251A (ja) | 1983-07-07 | 1983-07-07 | セラミツク基板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12242883A JPS5925251A (ja) | 1983-07-07 | 1983-07-07 | セラミツク基板 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14579478A Division JPS5572064A (en) | 1978-11-25 | 1978-11-25 | Ceramic substrate |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5925251A JPS5925251A (ja) | 1984-02-09 |
JPS6222268B2 true JPS6222268B2 (enrdf_load_stackoverflow) | 1987-05-16 |
Family
ID=14835589
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12242883A Granted JPS5925251A (ja) | 1983-07-07 | 1983-07-07 | セラミツク基板 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5925251A (enrdf_load_stackoverflow) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2740917B2 (ja) * | 1989-03-15 | 1998-04-15 | 京セラ株式会社 | セラミック基板 |
-
1983
- 1983-07-07 JP JP12242883A patent/JPS5925251A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5925251A (ja) | 1984-02-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101180247B (zh) | 陶瓷基板的制造方法以及陶瓷基板 | |
JPH081934B2 (ja) | ワ−クホルダ− | |
US4277528A (en) | Ceramic substrate | |
JPS6222268B2 (enrdf_load_stackoverflow) | ||
US20040038011A1 (en) | Integral-type ceramic circuit board and method of producing same | |
JP7444006B2 (ja) | セラミック電子部品 | |
JP7392616B2 (ja) | セラミック電子部品の製造方法 | |
JPH054819B2 (enrdf_load_stackoverflow) | ||
JPH07330445A (ja) | セラミックス基板の製造方法 | |
JP3310469B2 (ja) | セラミック電子回路基板の焼成装置および焼成方法 | |
US4456641A (en) | Ceramic substrate for semiconductor package | |
US7390449B2 (en) | Method of manufacturing ceramic material body | |
JP2581629Y2 (ja) | セラミック基板 | |
JP3574730B2 (ja) | 電子部品用セラミック基板及びチップ抵抗器 | |
US4472333A (en) | Ceramic substrate for semiconductor package and method of manufacture | |
JP3847210B2 (ja) | 分割溝を有するセラミックス基板とその製造方法 | |
JP3860709B2 (ja) | ガラスセラミック基板の製造方法 | |
JPS59119748A (ja) | 半導体パツケ−ジ用セラミツク基板 | |
JPH08213719A (ja) | チップ状電子部品用セラミック基板及びその製造方法 | |
JP3193626B2 (ja) | セラミック多層基板の製造方法 | |
JP5410724B2 (ja) | 配線基板の製造方法 | |
JP2006131437A (ja) | 積層パッケージ用着色セラミック焼結体 | |
JPH07326501A (ja) | 絶縁基板の製造に使用するセラミック製素材板の構造及びその製造方法 | |
KR0174520B1 (ko) | 적층형 세라믹 패키지의 제조방법 | |
JP3902603B2 (ja) | 多層セラミック基板の製造方法および拘束シート |