JPS6221545U - - Google Patents
Info
- Publication number
- JPS6221545U JPS6221545U JP1985112778U JP11277885U JPS6221545U JP S6221545 U JPS6221545 U JP S6221545U JP 1985112778 U JP1985112778 U JP 1985112778U JP 11277885 U JP11277885 U JP 11277885U JP S6221545 U JPS6221545 U JP S6221545U
- Authority
- JP
- Japan
- Prior art keywords
- package
- integrated circuit
- semiconductor integrated
- terminal
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案による半導体集積回路用パツケ
ージの一実施例の斜視図、第２図は第１図のＸ―
Ｘ′線に沿つた断面図である。 １……パツケージ、７……パツケージ端子穴、
８……実装用パツケージ端子、９……端子接触部
。
ージの一実施例の斜視図、第２図は第１図のＸ―
Ｘ′線に沿つた断面図である。 １……パツケージ、７……パツケージ端子穴、
８……実装用パツケージ端子、９……端子接触部
。
Claims (1)
- 複数の実装用パツケージ端子を備えた半導体集
積回路用パツケージにおいて、上記実装用パツケ
ージ端子と電気的に接続された端子接触部を有し
、上記端子接触部はパツケージ端子穴内にあつて
外部から接触可能に設けられていることを特徴と
する半導体集積回路用パツケージ。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985112778U JPS6221545U (ja) | 1985-07-23 | 1985-07-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985112778U JPS6221545U (ja) | 1985-07-23 | 1985-07-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6221545U true JPS6221545U (ja) | 1987-02-09 |
Family
ID=30993968
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985112778U Pending JPS6221545U (ja) | 1985-07-23 | 1985-07-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6221545U (ja) |
-
1985
- 1985-07-23 JP JP1985112778U patent/JPS6221545U/ja active Pending