JPS61195061U - - Google Patents
Info
- Publication number
- JPS61195061U JPS61195061U JP7833785U JP7833785U JPS61195061U JP S61195061 U JPS61195061 U JP S61195061U JP 7833785 U JP7833785 U JP 7833785U JP 7833785 U JP7833785 U JP 7833785U JP S61195061 U JPS61195061 U JP S61195061U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor package
- electric circuit
- terminals
- protruding
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 claims 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図及び第２図はこの考案の一実施例を示す
図で、第１図は斜視図、第２図は断面図、第３図
及び第４図は従来例を示す斜視図である。 ……半導体素子、……電気回路基板、…
…端子、……当り部。
図で、第１図は斜視図、第２図は断面図、第３図
及び第４図は従来例を示す斜視図である。 ……半導体素子、……電気回路基板、…
…端子、……当り部。
Claims (1)
- 半導体素子を実装すると共に裏面に端子を
垂下突設せる半導体パツケージにおいて、金属製
の電気回路基板の周辺部を下方に折曲して当り
部を形成して成ることを特徴とする半導体パツ
ケージ。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7833785U JPS61195061U (ja) | 1985-05-24 | 1985-05-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7833785U JPS61195061U (ja) | 1985-05-24 | 1985-05-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61195061U true JPS61195061U (ja) | 1986-12-04 |
Family
ID=30622224
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7833785U Pending JPS61195061U (ja) | 1985-05-24 | 1985-05-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61195061U (ja) |
-
1985
- 1985-05-24 JP JP7833785U patent/JPS61195061U/ja active Pending