JPS62214632A - 混成集積回路 - Google Patents
混成集積回路Info
- Publication number
- JPS62214632A JPS62214632A JP61057439A JP5743986A JPS62214632A JP S62214632 A JPS62214632 A JP S62214632A JP 61057439 A JP61057439 A JP 61057439A JP 5743986 A JP5743986 A JP 5743986A JP S62214632 A JPS62214632 A JP S62214632A
- Authority
- JP
- Japan
- Prior art keywords
- oxide film
- copper plate
- layer
- metal substrate
- resin layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W90/724—
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61057439A JPS62214632A (ja) | 1986-03-14 | 1986-03-14 | 混成集積回路 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61057439A JPS62214632A (ja) | 1986-03-14 | 1986-03-14 | 混成集積回路 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62214632A true JPS62214632A (ja) | 1987-09-21 |
| JPH0450744B2 JPH0450744B2 (cg-RX-API-DMAC10.html) | 1992-08-17 |
Family
ID=13055686
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61057439A Granted JPS62214632A (ja) | 1986-03-14 | 1986-03-14 | 混成集積回路 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62214632A (cg-RX-API-DMAC10.html) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5130274A (en) * | 1991-04-05 | 1992-07-14 | International Business Machines Corporation | Copper alloy metallurgies for VLSI interconnection structures |
| WO1995010172A1 (de) * | 1993-10-07 | 1995-04-13 | MTU MOTOREN- UND TURBINEN-UNION MüNCHEN GMBH | Metallkernleiterplatte zum einschieben in das gehäuse eines elektronikgerätes |
| JP2012099782A (ja) * | 2010-11-02 | 2012-05-24 | Samsung Electro-Mechanics Co Ltd | 放熱基板 |
| JP2018533197A (ja) * | 2015-07-17 | 2018-11-08 | ロジャーズ ジャーマニー ゲーエムベーハーRogers Germany GmbH | 電気回路基板および同型の基板の製造方法 |
| CN110113880A (zh) * | 2018-12-29 | 2019-08-09 | 广东生益科技股份有限公司 | 金属基覆铜箔层压板及其制备方法 |
-
1986
- 1986-03-14 JP JP61057439A patent/JPS62214632A/ja active Granted
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5130274A (en) * | 1991-04-05 | 1992-07-14 | International Business Machines Corporation | Copper alloy metallurgies for VLSI interconnection structures |
| WO1995010172A1 (de) * | 1993-10-07 | 1995-04-13 | MTU MOTOREN- UND TURBINEN-UNION MüNCHEN GMBH | Metallkernleiterplatte zum einschieben in das gehäuse eines elektronikgerätes |
| US5677514A (en) * | 1993-10-07 | 1997-10-14 | Mtu Motoren- Und Turbinen-Union Muenchen Gmbh | Metal-core PC board for insertion into the housing of an electronic device |
| JP2012099782A (ja) * | 2010-11-02 | 2012-05-24 | Samsung Electro-Mechanics Co Ltd | 放熱基板 |
| JP2018533197A (ja) * | 2015-07-17 | 2018-11-08 | ロジャーズ ジャーマニー ゲーエムベーハーRogers Germany GmbH | 電気回路基板および同型の基板の製造方法 |
| CN110113880A (zh) * | 2018-12-29 | 2019-08-09 | 广东生益科技股份有限公司 | 金属基覆铜箔层压板及其制备方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0450744B2 (cg-RX-API-DMAC10.html) | 1992-08-17 |
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