JPS62211Y2 - - Google Patents
Info
- Publication number
- JPS62211Y2 JPS62211Y2 JP1980129435U JP12943580U JPS62211Y2 JP S62211 Y2 JPS62211 Y2 JP S62211Y2 JP 1980129435 U JP1980129435 U JP 1980129435U JP 12943580 U JP12943580 U JP 12943580U JP S62211 Y2 JPS62211 Y2 JP S62211Y2
- Authority
- JP
- Japan
- Prior art keywords
- reflective
- frame
- reflective frame
- emitting diode
- back plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011347 resin Substances 0.000 claims description 10
- 229920005989 resin Polymers 0.000 claims description 10
- 238000009792 diffusion process Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 210000000078 claw Anatomy 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910001111 Fine metal Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Illuminated Signs And Luminous Advertising (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1980129435U JPS62211Y2 (fr) | 1980-09-10 | 1980-09-10 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1980129435U JPS62211Y2 (fr) | 1980-09-10 | 1980-09-10 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5753664U JPS5753664U (fr) | 1982-03-29 |
JPS62211Y2 true JPS62211Y2 (fr) | 1987-01-07 |
Family
ID=29489786
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1980129435U Expired JPS62211Y2 (fr) | 1980-09-10 | 1980-09-10 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62211Y2 (fr) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61252673A (ja) * | 1985-05-01 | 1986-11-10 | Toshiba Corp | 半導体発光表示装置 |
US7264378B2 (en) * | 2002-09-04 | 2007-09-04 | Cree, Inc. | Power surface mount light emitting die package |
JP5979533B2 (ja) * | 2012-02-29 | 2016-08-24 | パナソニックIpマネジメント株式会社 | 発光装置及び照明器具 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS557974U (fr) * | 1978-07-01 | 1980-01-19 |
-
1980
- 1980-09-10 JP JP1980129435U patent/JPS62211Y2/ja not_active Expired
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS557974U (fr) * | 1978-07-01 | 1980-01-19 |
Also Published As
Publication number | Publication date |
---|---|
JPS5753664U (fr) | 1982-03-29 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS62211Y2 (fr) | ||
JP2948412B2 (ja) | 側面発光型の半導体発光素子を製造する方法 | |
JPH09237514A (ja) | 背面照明装置 | |
JPS58118297A (ja) | 識別カ−ドの製造方法 | |
CN209449020U (zh) | 一种直接将弹片固定在线路板上的线路板 | |
JPS6022383Y2 (ja) | 発光ダイオ−ド表示器 | |
JPH0513738A (ja) | オンチツプレンズ付固体撮像装置 | |
CN111867245A (zh) | 一种MiniLed基板、模组以及模组制作方法 | |
JPS6050346B2 (ja) | 半導体装置の製造方法 | |
JP2506452Y2 (ja) | 側面発光表示装置 | |
JPS5915509Y2 (ja) | 発光表示装置 | |
JPH0128545Y2 (fr) | ||
JPS609827Y2 (ja) | 発光ダイオ−ド表示器 | |
CN215073528U (zh) | 一种新型的触摸pcba固定结构 | |
JP3055810U (ja) | ダイオード側面型バックライト装置 | |
JPH05166949A (ja) | 樹脂封止半導体装置のパッケージのマーキング方法 | |
JPS5925283A (ja) | 光半導体装置 | |
JPS603794B2 (ja) | 発光表示装置 | |
JPH0620159B2 (ja) | 光半導体装置の製造方法 | |
JP2661152B2 (ja) | Icカード用モジュールの製造方法 | |
JPH09213116A (ja) | 背面照明装置 | |
JP3068528U (ja) | 光信号を利用したマイクロフォン | |
JPS5824463Y2 (ja) | 混成集積回路のパッケ−ジ構造 | |
JPS5896783A (ja) | 発光ダイオ−ド | |
JPH0648890Y2 (ja) | 発光ダイオ−ド表示装置 |