JPS62211Y2 - - Google Patents
Info
- Publication number
- JPS62211Y2 JPS62211Y2 JP1980129435U JP12943580U JPS62211Y2 JP S62211 Y2 JPS62211 Y2 JP S62211Y2 JP 1980129435 U JP1980129435 U JP 1980129435U JP 12943580 U JP12943580 U JP 12943580U JP S62211 Y2 JPS62211 Y2 JP S62211Y2
- Authority
- JP
- Japan
- Prior art keywords
- reflective
- frame
- reflective frame
- emitting diode
- back plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011347 resin Substances 0.000 claims description 10
- 229920005989 resin Polymers 0.000 claims description 10
- 238000009792 diffusion process Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 210000000078 claw Anatomy 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910001111 Fine metal Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Illuminated Signs And Luminous Advertising (AREA)
Description
【考案の詳細な説明】
本案は生産歩留まりがよく廉価な発光ダイオー
ド表示器に関する。[Detailed Description of the Invention] The present invention relates to an inexpensive light emitting diode display with high production yield.
従来微小な発光ダイオードと反射窓で囲み数
字、文字等を表示する発光ダイオード表示器は、
第１図ａに示すような中空型と同図ｂに示すよう
な樹脂充填型がある。中空型は発光ダイオード１
０２に素子保護用薄膜コーテイングがあるだけ
で、光を光拡散シート１０８で散乱させ、表示面
一杯に均一に広げて表示するもので、生産もしや
すく耐久性もあるが、印刷配線基板１０６等高価
な部品を必要とするため価格を低下できない。一
方樹脂充填型の表示器ではリードフレーム２０１
の基板のかわりにしているので原材料費は廉価で
あるが、リードフレーム２０１のすきまから表示
器の裏側へ光が洩れる上、表示器を製造する時の
樹脂２０７が硬化するにあたり、発光ダイオード
２０２や金属細線２０３に応力が加わり剥離や断
線の事故が多発するので、生産歩留まりが悪かつ
た。 Conventional light-emitting diode displays display numbers, letters, etc. by surrounding small light-emitting diodes and reflective windows.
There are a hollow type as shown in FIG. 1a and a resin-filled type as shown in FIG. 1b. Hollow type has 1 light emitting diode
02 only has a thin film coating for element protection, and the light is scattered by the light diffusion sheet 108 and displayed evenly across the entire display surface, making it easy to produce and durable, but it requires expensive printed circuit boards 106 and other components. The price cannot be lowered because it requires special parts. On the other hand, in a resin-filled display, the lead frame 201
The raw material cost is low because it is used instead of the substrate of Since stress is applied to the thin metal wire 203 and accidents such as peeling and wire breakage occur frequently, the production yield is poor.
本案はこのような欠点をあらためるためになさ
れたもので、以下実施例に基づいて本案を詳細に
説明する。 The present invention has been developed to overcome these drawbacks, and the present invention will be described in detail below based on examples.
第２図は本案実施例の発光ダイオード表示器の
断面図ａと背面図ｂである。図に於て、１，１…
は銅、鉄等を主材とするリードフレーム（製造前
には連結棒で一体に保持されている）で、所望の
個所にGaP等の発光ダイオード２，２…が載置固
着してあり、金、アルミニウム等の金属細線３，
３…で配線が施こしてある。４は白色樹脂成形品
等からなる反射枠で、発光ダイオード２，２…を
囲み短冊状に開口して日字状等を構成する反射窓
５，５…を有している。６はリードフレーム１，
１…を反射枠４の裏面に押圧するよう反射枠内部
に収納された裏板で、７（背面図に図示せず）は
裏板６の周囲と反射枠４の裏面の周囲とを覆う樹
脂である。８は反射枠４の表面に接着剤９，９等
で貼着された光拡散シートである。 FIG. 2 is a cross-sectional view a and a back view b of the light emitting diode display according to the embodiment of the present invention. In the diagram, 1, 1...
is a lead frame mainly made of copper, iron, etc. (it is held together with connecting rods before manufacturing), and light emitting diodes 2, 2, etc. made of GaP etc. are mounted and fixed at desired locations. Fine metal wires such as gold and aluminum 3,
3. Wiring is done. Reference numeral 4 denotes a reflective frame made of a white resin molded product or the like, and has reflective windows 5, 5, etc. that surround the light emitting diodes 2, 2, and open in the form of strips to form a Japanese character shape. 6 is lead frame 1,
1 is a back plate housed inside the reflective frame so as to press it against the back surface of the reflective frame 4, and 7 (not shown in the rear view) is a resin that covers the periphery of the back plate 6 and the periphery of the back surface of the reflective frame 4. It is. Reference numeral 8 denotes a light diffusion sheet adhered to the surface of the reflective frame 4 with an adhesive 9, 9, or the like.
このような形状の表示器は、次のようにして製
造される。まず相互に連結支持されたリードフレ
ーム１，１…を形成し、所望の個所に導電性接着
剤等で発光ダイオード２，２…を載置固着したあ
と、ワイヤボンド法等により金属細線３，３…で
配線を施こす。このリードフレーム１，１…を反
射枠４の裏面に当接する。この時必要に応じて反
射枠４の内壁に位置決め用の突起１０，１０…等
を設けてそれを利用するとよい。その後、裏板６
を反射枠４の爪１１，１１…に嵌合させ、リード
フレーム１，１を押圧し、仮固定とする。そして
発光ダイオード２，２…の点灯を確認したのち、
あらかじめ裏板６を切欠く事によつて出来た。裏
板６と反射枠４の壁とのすきま１２，１２…から
エポキシ等の樹脂７を流し込み、裏板６の周辺の
全て、又は特に裏板６と反射枠４の間にリード線
１，１…の脚や挟まつている部分を完全に樹脂封
止し、リードフレーム１，１…と裏板６とを反射
枠４の裏面に固定する。リードフレームの連結棒
はこの時、又は仮固定後切断除去する。その後接
着剤９のついた光拡散シート８を反射枠４の表面
に貼着して表示器を完成する。この工程におい
て、樹脂７が反射窓５，５に流れ込まないように
反射枠４の周囲に溝１３，１３を設けておくとよ
い。 A display device having such a shape is manufactured as follows. First, interconnected and supported lead frames 1, 1... are formed, and after mounting and fixing the light emitting diodes 2, 2... at desired locations with a conductive adhesive etc., thin metal wires 3, 3 are attached using a wire bonding method etc. ...Connect the wiring. The lead frames 1, 1, . . . are brought into contact with the back surface of the reflective frame 4. At this time, it is preferable to provide positioning protrusions 10, 10, etc. on the inner wall of the reflective frame 4 and utilize them as necessary. After that, back plate 6
are fitted into the claws 11, 11, . . . of the reflective frame 4, and the lead frames 1, 1 are pressed and temporarily fixed. After confirming that the light emitting diodes 2, 2... are lit,
It was made by cutting out the back plate 6 in advance. A resin 7 such as epoxy is poured into the gaps 12, 12, . The legs and sandwiched parts of... are completely sealed with resin, and the lead frames 1, 1... and the back plate 6 are fixed to the back surface of the reflective frame 4. The connecting rod of the lead frame is cut and removed at this time or after temporary fixing. Thereafter, a light diffusion sheet 8 with adhesive 9 is attached to the surface of the reflective frame 4 to complete the display. In this step, it is preferable to provide grooves 13, 13 around the reflective frame 4 so that the resin 7 does not flow into the reflective windows 5, 5.
尚、上述の工程において、裏板６を反射枠４の
爪１１，１１に嵌合させるかわりに、第３図に示
すように反射枠４に突出ピン１４を設けて、この
突出ピン１４の先端を溶着してもよい。又リード
線１，１…が反射窓５，５の内にいく分くい込む
ように成形、押圧して、基板６の反射窓５，５に
対応する位置に凹部１５を設けておくと、発光ダ
イオード２が反射窓５の焦点に位置するのでさら
に好ましい。 In the above process, instead of fitting the back plate 6 into the claws 11, 11 of the reflective frame 4, a protruding pin 14 is provided on the reflective frame 4 as shown in FIG. may be welded. Also, if the lead wires 1, 1... are formed and pressed so as to fit into the reflection windows 5, 5 to some extent, and a recess 15 is provided in the position corresponding to the reflection windows 5, 5 of the substrate 6, light emission can be achieved. It is further preferred that the diode 2 is located at the focal point of the reflective window 5.
以上の如く本案は、反射窓を有する反射枠と反
射枠の表面に敷設された光拡散シートと、反射枠
の裏面に配置され反射窓に対応する位置に発光ダ
イオードを有したリードフレームと、リードフレ
ームを反射枠裏面に押圧する裏板と、裏板の周囲
と反射枠の裏面の周囲を覆う樹脂とを具備した発
光ダイオード表示器であるから、発光ダイオード
等力が加わると損傷しやすい個所には圧力が及ば
ない上、裏板によつて光洩れの遮断とリード線の
反固定ができるので作業がしやすく生産歩留まり
がよい。又高価となる部品がないので廉価にもな
る。さらに、表示器は外観が注目されるため重要
であるが、本考案においては裏板が反射枠側面等
から突出しないので、美観等を損なうこともな
い。 As described above, the present invention consists of a reflective frame having a reflective window, a light diffusion sheet laid on the surface of the reflective frame, a lead frame having a light emitting diode placed on the back side of the reflective frame at a position corresponding to the reflective window, and a lead This light emitting diode display is equipped with a back plate that presses the frame against the back surface of the reflective frame, and resin that covers the periphery of the back plate and the back surface of the reflective frame, so the light emitting diode display can be easily damaged in places where force is applied. In addition to not applying pressure, the back plate can block light leakage and prevent lead wires from being fixed, making work easier and improving production yields. Also, since there are no expensive parts, it is also inexpensive. Furthermore, the appearance of the display is important because it attracts attention, and in the present invention, the back plate does not protrude from the side surface of the reflective frame, so the appearance does not deteriorate.
第１図は従来の表示器の断面図、第２図は本案
の一実施例の発光ダイオード表示器の断面図ａと
背面図ｂ、第３図は本案の他の実施例の表示器要
部の断面図である。
１，１……リードフレーム、２，２……発光ダ
イオード、４……反射枠、５，５……反射窓、６
……裏板、７……樹脂、８……光拡散シート。
Fig. 1 is a cross-sectional view of a conventional display, Fig. 2 is a cross-sectional view a and rear view b of a light emitting diode display according to an embodiment of the present invention, and Fig. 3 is a main part of a display according to another embodiment of the present invention. FIG. 1, 1... Lead frame, 2, 2... Light emitting diode, 4... Reflective frame, 5, 5... Reflective window, 6
... Back plate, 7 ... Resin, 8 ... Light diffusion sheet.
Claims (1)
と、反射枠の裏面に配置され反射窓に対応する位
置に発光ダイオードを有したリードフレームと、
リードフレームを反射枠裏面に押圧し前記基板収
納部に収納固定された裏板と、裏板の周囲と反射
枠裏面とにかけて設けられた樹脂とを具備した事
を特徴とする発光ダイオード表示器。 a reflective frame having a board storage section on the back side of the reflective window; a lead frame having a light emitting diode arranged on the back side of the reflective frame at a position corresponding to the reflective window;
A light-emitting diode display device comprising: a back plate which presses a lead frame against the back surface of the reflective frame and is housed and fixed in the board storage part; and a resin provided around the back plate and the back surface of the reflective frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980129435U JPS62211Y2 (en) | 1980-09-10 | 1980-09-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980129435U JPS62211Y2 (en) | 1980-09-10 | 1980-09-10 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5753664U JPS5753664U (en) | 1982-03-29 |
| JPS62211Y2 true JPS62211Y2 (en) | 1987-01-07 |
Family
ID=29489786
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1980129435U Expired JPS62211Y2 (en) | 1980-09-10 | 1980-09-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62211Y2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61252673A (en) * | 1985-05-01 | 1986-11-10 | Toshiba Corp | Semiconductor light-emitting display device |
| US7264378B2 (en) * | 2002-09-04 | 2007-09-04 | Cree, Inc. | Power surface mount light emitting die package |
| JP5979533B2 (en) * | 2012-02-29 | 2016-08-24 | パナソニックＩｐマネジメント株式会社 | Light emitting device and lighting apparatus |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS557974U (en) * | 1978-07-01 | 1980-01-19 |
-
1980
- 1980-09-10 JP JP1980129435U patent/JPS62211Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS557974U (en) * | 1978-07-01 | 1980-01-19 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5753664U (en) | 1982-03-29 |
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