JPS6220719B2 - - Google Patents

Info

Publication number
JPS6220719B2
JPS6220719B2 JP53150282A JP15028278A JPS6220719B2 JP S6220719 B2 JPS6220719 B2 JP S6220719B2 JP 53150282 A JP53150282 A JP 53150282A JP 15028278 A JP15028278 A JP 15028278A JP S6220719 B2 JPS6220719 B2 JP S6220719B2
Authority
JP
Japan
Prior art keywords
film
plating
electrolytic copper
copper plating
chemical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP53150282A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5577197A (en
Inventor
Kazuhiko Nakamura
Akira Endo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP15028278A priority Critical patent/JPS5577197A/ja
Publication of JPS5577197A publication Critical patent/JPS5577197A/ja
Publication of JPS6220719B2 publication Critical patent/JPS6220719B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP15028278A 1978-12-05 1978-12-05 Method of fabricating printed circuit board Granted JPS5577197A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15028278A JPS5577197A (en) 1978-12-05 1978-12-05 Method of fabricating printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15028278A JPS5577197A (en) 1978-12-05 1978-12-05 Method of fabricating printed circuit board

Publications (2)

Publication Number Publication Date
JPS5577197A JPS5577197A (en) 1980-06-10
JPS6220719B2 true JPS6220719B2 (enExample) 1987-05-08

Family

ID=15493558

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15028278A Granted JPS5577197A (en) 1978-12-05 1978-12-05 Method of fabricating printed circuit board

Country Status (1)

Country Link
JP (1) JPS5577197A (enExample)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5332869B2 (enExample) * 1972-05-18 1978-09-11

Also Published As

Publication number Publication date
JPS5577197A (en) 1980-06-10

Similar Documents

Publication Publication Date Title
US5235139A (en) Method for fabricating printed circuits
US4804615A (en) Method for manufacture of printed circuit boards
US6521328B1 (en) Copper etching compositions and products derived therefrom
JPS6343470B2 (enExample)
JPS6220719B2 (enExample)
JPS58202589A (ja) プリント回路板の製造方法
CA1152226A (en) Process for the manufacture of printed circuits
JPS586319B2 (ja) プリント配線板の製造方法
JPH05259614A (ja) プリント配線板の樹脂埋め法
JPH0219990B2 (enExample)
GB2118369A (en) Making printed circuit boards
JPS62598B2 (enExample)
EP0090900B1 (en) Process of manufacturing printed wiring boards and printed wiring boards manufactured by the same
JPS648478B2 (enExample)
JPS5924560B2 (ja) 印刷配線板の製造方法
JPH0352238B2 (enExample)
JPS62287694A (ja) 印刷配線板の製造方法
JPS59155994A (ja) 多層印刷配線板の製造方法
JPS6070797A (ja) 印刷配線板の製造方法
JPS5843920B2 (ja) 印刷配線板の製造方法
JPH0248155B2 (ja) Insatsuhaisenbannoseizohoho
JPS62599B2 (enExample)
JPH0370396B2 (enExample)
JPS63128789A (ja) 印刷配線板の製造方法
JPS6396994A (ja) 印刷配線板の製造方法