JPS6220699B2 - - Google Patents

Info

Publication number
JPS6220699B2
JPS6220699B2 JP54083591A JP8359179A JPS6220699B2 JP S6220699 B2 JPS6220699 B2 JP S6220699B2 JP 54083591 A JP54083591 A JP 54083591A JP 8359179 A JP8359179 A JP 8359179A JP S6220699 B2 JPS6220699 B2 JP S6220699B2
Authority
JP
Japan
Prior art keywords
cap
semiconductor device
sealed
glass
seam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54083591A
Other languages
English (en)
Japanese (ja)
Other versions
JPS568853A (en
Inventor
Katsuhiko Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP8359179A priority Critical patent/JPS568853A/ja
Publication of JPS568853A publication Critical patent/JPS568853A/ja
Publication of JPS6220699B2 publication Critical patent/JPS6220699B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements

Landscapes

  • Non-Volatile Memory (AREA)
  • Light Receiving Elements (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
JP8359179A 1979-07-02 1979-07-02 Semiconductor device Granted JPS568853A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8359179A JPS568853A (en) 1979-07-02 1979-07-02 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8359179A JPS568853A (en) 1979-07-02 1979-07-02 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS568853A JPS568853A (en) 1981-01-29
JPS6220699B2 true JPS6220699B2 (cg-RX-API-DMAC7.html) 1987-05-08

Family

ID=13806725

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8359179A Granted JPS568853A (en) 1979-07-02 1979-07-02 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS568853A (cg-RX-API-DMAC7.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0248198U (cg-RX-API-DMAC7.html) * 1988-09-30 1990-04-03

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6894853B2 (en) * 2002-05-10 2005-05-17 Texas Instruments Incorporated Stress relieved frame

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0248198U (cg-RX-API-DMAC7.html) * 1988-09-30 1990-04-03

Also Published As

Publication number Publication date
JPS568853A (en) 1981-01-29

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