JPS62206772A - 回路の接続構造体 - Google Patents

回路の接続構造体

Info

Publication number
JPS62206772A
JPS62206772A JP61049465A JP4946586A JPS62206772A JP S62206772 A JPS62206772 A JP S62206772A JP 61049465 A JP61049465 A JP 61049465A JP 4946586 A JP4946586 A JP 4946586A JP S62206772 A JPS62206772 A JP S62206772A
Authority
JP
Japan
Prior art keywords
particles
circuit
connection
conductive
conductive particles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61049465A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0340899B2 (OSRAM
Inventor
功 塚越
豊 山口
中島　敦夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP61049465A priority Critical patent/JPS62206772A/ja
Priority to US07/013,904 priority patent/US4740657A/en
Priority to EP87301263A priority patent/EP0242025B1/en
Priority to DE8787301263T priority patent/DE3770318D1/de
Publication of JPS62206772A publication Critical patent/JPS62206772A/ja
Publication of JPH0340899B2 publication Critical patent/JPH0340899B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29399—Coating material

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
  • Wire Bonding (AREA)
  • Non-Insulated Conductors (AREA)
JP61049465A 1986-02-14 1986-03-06 回路の接続構造体 Granted JPS62206772A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP61049465A JPS62206772A (ja) 1986-03-06 1986-03-06 回路の接続構造体
US07/013,904 US4740657A (en) 1986-02-14 1987-02-12 Anisotropic-electroconductive adhesive composition, method for connecting circuits using the same, and connected circuit structure thus obtained
EP87301263A EP0242025B1 (en) 1986-02-14 1987-02-13 Anisotropic-electroconductive adhesive composition, method for connecting circuits using the same, and connected circuit structure thus obtained
DE8787301263T DE3770318D1 (de) 1986-02-14 1987-02-13 Anisotrope elektrizitaetsleitende klebstoffzusammensetzung, verfahren zum verbinden von stromkreisen und die so erhaltenen stromkreise.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61049465A JPS62206772A (ja) 1986-03-06 1986-03-06 回路の接続構造体

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP13590394A Division JPH0793157B2 (ja) 1994-06-17 1994-06-17 回路の接続構造体

Publications (2)

Publication Number Publication Date
JPS62206772A true JPS62206772A (ja) 1987-09-11
JPH0340899B2 JPH0340899B2 (OSRAM) 1991-06-20

Family

ID=12831886

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61049465A Granted JPS62206772A (ja) 1986-02-14 1986-03-06 回路の接続構造体

Country Status (1)

Country Link
JP (1) JPS62206772A (OSRAM)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62243668A (ja) * 1986-04-16 1987-10-24 Matsushita Electric Ind Co Ltd 異方導電性接着剤
JPS6447084U (OSRAM) * 1987-09-16 1989-03-23
JPH0329207A (ja) * 1988-12-05 1991-02-07 Hitachi Chem Co Ltd 回路接続用組成物及びこれを用いた接続方法並びに半導体チップの接続構造
JPH03120778A (ja) * 1989-10-03 1991-05-22 Mitsubishi Electric Corp 液晶表示装置
US5162087A (en) * 1990-09-03 1992-11-10 Soken Chemical & Engineering Co., Ltd. Anisotropic conductive adhesive compositions
JP2008270846A (ja) * 2003-10-03 2008-11-06 Fuji Electric Device Technology Co Ltd 半導体装置の製造方法
US10177465B2 (en) 2014-10-29 2019-01-08 Dexerials Corporation Electrically conductive material

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5057458A (OSRAM) * 1973-09-19 1975-05-19
JPS57111366A (en) * 1981-05-20 1982-07-10 Seikosha Co Ltd Electrically conductive adhesive
JPS58182685A (ja) * 1982-04-20 1983-10-25 セイコーエプソン株式会社 表示体パネル
JPS5917534A (ja) * 1982-07-20 1984-01-28 Seiko Epson Corp 液晶パネルの上下導通方法
JPS6084718A (ja) * 1983-10-14 1985-05-14 日立化成工業株式会社 導電異方性接着シ−ト
JPS60117504A (ja) * 1983-11-28 1985-06-25 日立化成工業株式会社 高電流回路接続用導電異方性接着シ−ト
JPS60262489A (ja) * 1984-06-11 1985-12-25 ソニ−ケミカル株式会社 連結シ−ト
JPS628407A (ja) * 1985-07-04 1987-01-16 藤倉化成株式会社 異方導電性シ−ト状物の製造方法
JPS62115679A (ja) * 1985-11-15 1987-05-27 富士高分子工業株式会社 電気接続体

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5057458A (OSRAM) * 1973-09-19 1975-05-19
JPS57111366A (en) * 1981-05-20 1982-07-10 Seikosha Co Ltd Electrically conductive adhesive
JPS58182685A (ja) * 1982-04-20 1983-10-25 セイコーエプソン株式会社 表示体パネル
JPS5917534A (ja) * 1982-07-20 1984-01-28 Seiko Epson Corp 液晶パネルの上下導通方法
JPS6084718A (ja) * 1983-10-14 1985-05-14 日立化成工業株式会社 導電異方性接着シ−ト
JPS60117504A (ja) * 1983-11-28 1985-06-25 日立化成工業株式会社 高電流回路接続用導電異方性接着シ−ト
JPS60262489A (ja) * 1984-06-11 1985-12-25 ソニ−ケミカル株式会社 連結シ−ト
JPS628407A (ja) * 1985-07-04 1987-01-16 藤倉化成株式会社 異方導電性シ−ト状物の製造方法
JPS62115679A (ja) * 1985-11-15 1987-05-27 富士高分子工業株式会社 電気接続体

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62243668A (ja) * 1986-04-16 1987-10-24 Matsushita Electric Ind Co Ltd 異方導電性接着剤
JPS6447084U (OSRAM) * 1987-09-16 1989-03-23
JPH0329207A (ja) * 1988-12-05 1991-02-07 Hitachi Chem Co Ltd 回路接続用組成物及びこれを用いた接続方法並びに半導体チップの接続構造
JPH03120778A (ja) * 1989-10-03 1991-05-22 Mitsubishi Electric Corp 液晶表示装置
US5162087A (en) * 1990-09-03 1992-11-10 Soken Chemical & Engineering Co., Ltd. Anisotropic conductive adhesive compositions
JP2008270846A (ja) * 2003-10-03 2008-11-06 Fuji Electric Device Technology Co Ltd 半導体装置の製造方法
US10177465B2 (en) 2014-10-29 2019-01-08 Dexerials Corporation Electrically conductive material

Also Published As

Publication number Publication date
JPH0340899B2 (OSRAM) 1991-06-20

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