JPS62202534A - ワイヤボンデイング用キヤピラリ− - Google Patents

ワイヤボンデイング用キヤピラリ−

Info

Publication number
JPS62202534A
JPS62202534A JP61044964A JP4496486A JPS62202534A JP S62202534 A JPS62202534 A JP S62202534A JP 61044964 A JP61044964 A JP 61044964A JP 4496486 A JP4496486 A JP 4496486A JP S62202534 A JPS62202534 A JP S62202534A
Authority
JP
Japan
Prior art keywords
capillary
alumina
purity
wire bonding
less
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61044964A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0316779B2 (enrdf_load_stackoverflow
Inventor
Hiroyuki Miura
宏之 三浦
Masaki Hayashi
正樹 林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=12706169&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JPS62202534(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP61044964A priority Critical patent/JPS62202534A/ja
Publication of JPS62202534A publication Critical patent/JPS62202534A/ja
Publication of JPH0316779B2 publication Critical patent/JPH0316779B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H01L2224/78302—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP61044964A 1986-02-28 1986-02-28 ワイヤボンデイング用キヤピラリ− Granted JPS62202534A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61044964A JPS62202534A (ja) 1986-02-28 1986-02-28 ワイヤボンデイング用キヤピラリ−

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61044964A JPS62202534A (ja) 1986-02-28 1986-02-28 ワイヤボンデイング用キヤピラリ−

Publications (2)

Publication Number Publication Date
JPS62202534A true JPS62202534A (ja) 1987-09-07
JPH0316779B2 JPH0316779B2 (enrdf_load_stackoverflow) 1991-03-06

Family

ID=12706169

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61044964A Granted JPS62202534A (ja) 1986-02-28 1986-02-28 ワイヤボンデイング用キヤピラリ−

Country Status (1)

Country Link
JP (1) JPS62202534A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02101754A (ja) * 1988-10-11 1990-04-13 Hitachi Ltd ボンディング方法及びボンディング装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02101754A (ja) * 1988-10-11 1990-04-13 Hitachi Ltd ボンディング方法及びボンディング装置

Also Published As

Publication number Publication date
JPH0316779B2 (enrdf_load_stackoverflow) 1991-03-06

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term