JPS6219939B2 - - Google Patents

Info

Publication number
JPS6219939B2
JPS6219939B2 JP54055901A JP5590179A JPS6219939B2 JP S6219939 B2 JPS6219939 B2 JP S6219939B2 JP 54055901 A JP54055901 A JP 54055901A JP 5590179 A JP5590179 A JP 5590179A JP S6219939 B2 JPS6219939 B2 JP S6219939B2
Authority
JP
Japan
Prior art keywords
solder
molten solder
vibrator
ultrasonic
horn
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54055901A
Other languages
English (en)
Japanese (ja)
Other versions
JPS55147473A (en
Inventor
Fumio Myashiro
Akira Yamada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP5590179A priority Critical patent/JPS55147473A/ja
Publication of JPS55147473A publication Critical patent/JPS55147473A/ja
Publication of JPS6219939B2 publication Critical patent/JPS6219939B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Molten Solder (AREA)
JP5590179A 1979-05-08 1979-05-08 Solder tank Granted JPS55147473A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5590179A JPS55147473A (en) 1979-05-08 1979-05-08 Solder tank

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5590179A JPS55147473A (en) 1979-05-08 1979-05-08 Solder tank

Publications (2)

Publication Number Publication Date
JPS55147473A JPS55147473A (en) 1980-11-17
JPS6219939B2 true JPS6219939B2 (cg-RX-API-DMAC7.html) 1987-05-01

Family

ID=13012009

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5590179A Granted JPS55147473A (en) 1979-05-08 1979-05-08 Solder tank

Country Status (1)

Country Link
JP (1) JPS55147473A (cg-RX-API-DMAC7.html)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52104757A (en) * 1976-03-01 1977-09-02 Hitachi Ltd Ultrasonic soldering method
JPS5426943A (en) * 1977-08-02 1979-02-28 Tamura Seisakusho Kk Soldering apparatus

Also Published As

Publication number Publication date
JPS55147473A (en) 1980-11-17

Similar Documents

Publication Publication Date Title
US4779790A (en) Job oriented method and apparatus utilizing molten solder for procedures such as soldering and desoldering
ATE12195T1 (de) Vorrichtung zum aufbringen einer lotschicht auf eine leiterplatte.
EP0336659B1 (en) Method and apparatus for applying flux to a substrate
US4871105A (en) Method and apparatus for applying flux to a substrate
US4072777A (en) Method and apparatus for forming a uniform solder wave
EP0119272B1 (en) Method and device for soldering printed board
EP0306976B1 (en) Automatic film processor
ATE209T1 (de) Vorrichtung zum aufbringen einer loetmittelschicht auf eine leiterplatte
US3536243A (en) Ultrasonic soldering apparatus
JPS6219939B2 (cg-RX-API-DMAC7.html)
JPS6315063B2 (cg-RX-API-DMAC7.html)
JP2687218B2 (ja) プリント基板のはんだ付け方法
JPH06112620A (ja) 配線の接続方法及び配線の接続構造
JPH0673520A (ja) アルミニウム帯板の連続はんだめっき方法
JPH01266792A (ja) プリント基板のはんだ付け方法および装置
JP2854940B2 (ja) 加熱装置
JPH01270391A (ja) 予備半田付方法
SU959943A1 (ru) Устройство дл лужени печатных плат
JPS6147695A (ja) 部分めつき,エツチング方法
SU563240A1 (ru) Устройство дл ультразвуковой пайки и лужени изделий волной припо
JPH11330341A (ja) ハンダコーティング装置
JPS6031016Y2 (ja) はんだ付装置
JPS61147966A (ja) はんだ付け方法
GB2159083A (en) Vapour phase soldering
JPS5940786Y2 (ja) フラックス装置