ATE209T1 - Vorrichtung zum aufbringen einer loetmittelschicht auf eine leiterplatte - Google Patents

Vorrichtung zum aufbringen einer loetmittelschicht auf eine leiterplatte

Info

Publication number
ATE209T1
ATE209T1 AT79105039T AT79105039T ATE209T1 AT E209 T1 ATE209 T1 AT E209T1 AT 79105039 T AT79105039 T AT 79105039T AT 79105039 T AT79105039 T AT 79105039T AT E209 T1 ATE209 T1 AT E209T1
Authority
AT
Austria
Prior art keywords
solder
container
circuit board
slot
applying
Prior art date
Application number
AT79105039T
Other languages
English (en)
Inventor
Dieter Schmid
Original Assignee
Gebr. Schmid Gmbh & Co.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gebr. Schmid Gmbh & Co. filed Critical Gebr. Schmid Gmbh & Co.
Application granted granted Critical
Publication of ATE209T1 publication Critical patent/ATE209T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)
  • Coating Apparatus (AREA)
AT79105039T 1978-12-28 1979-12-10 Vorrichtung zum aufbringen einer loetmittelschicht auf eine leiterplatte ATE209T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE2856460A DE2856460C3 (de) 1978-12-28 1978-12-28 Vorrichtung zum Aufbringen einer Lotschicht auf eine Leiterplatte
EP79105039A EP0013359B1 (de) 1978-12-28 1979-12-10 Vorrichtung zum Aufbringen einer Lötmittelschicht auf eine Leiterplatte

Publications (1)

Publication Number Publication Date
ATE209T1 true ATE209T1 (de) 1981-09-15

Family

ID=6058562

Family Applications (1)

Application Number Title Priority Date Filing Date
AT79105039T ATE209T1 (de) 1978-12-28 1979-12-10 Vorrichtung zum aufbringen einer loetmittelschicht auf eine leiterplatte

Country Status (4)

Country Link
EP (1) EP0013359B1 (de)
JP (1) JPS5591191A (de)
AT (1) ATE209T1 (de)
DE (1) DE2856460C3 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4277518A (en) * 1979-11-13 1981-07-07 Gyrex Corp. Solder-coating method
US4402800A (en) * 1981-10-02 1983-09-06 Ash James J Apparatus and method of treating tabs of printed circuit boards and the like
US4385967A (en) * 1981-10-07 1983-05-31 Chemcut Corporation Electroplating apparatus and method
ATE12195T1 (de) * 1981-10-22 1985-04-15 Siemens Ag Vorrichtung zum aufbringen einer lotschicht auf eine leiterplatte.
US4608941A (en) * 1985-01-10 1986-09-02 Teledyne Electro-Mechanisms Apparatus for soldering printed circuit panels
DE3536304A1 (de) * 1985-10-11 1987-04-16 Kaspar Eidenberg Verfahren zum verzinnen von leiterplatten und vorrichtung zum durchfuehren dieses verfahrens
DE3765359D1 (de) * 1986-08-13 1990-11-08 Senju Metal Industry Co Loetgeraet des springbrunnentyps.
US5209782A (en) * 1988-05-27 1993-05-11 Teledyne Industries, Inc. System for soldering printed circuits
US5007369A (en) * 1988-05-27 1991-04-16 Teledyne Industries, Inc. Apparatus for solder coating printed circuit panels
US5038706A (en) * 1988-05-27 1991-08-13 Teledyne Industries, Inc. Printed circuits board soldering apparatus
US4903631A (en) * 1988-05-27 1990-02-27 Teledyne Industries, Inc. System for soldering printed circuits
JPH087654Y2 (ja) * 1990-11-29 1996-03-04 神鋼メックス株式会社 プリント基板を半田処理する装置
DE4041272C2 (de) * 1990-12-21 1996-12-05 Siemens Ag Wellenlötvorrichtung
DE102007035086B3 (de) * 2007-07-26 2008-10-30 Rena Sondermaschinen Gmbh Vorrichtung und Verfahren zur Oberflächenbehandlung von Gut in Durchlaufanlagen

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1552976C2 (de) * 1966-08-31 1974-09-12 Siemens Ag, 1000 Berlin Und 8000 Muenchen Verfahren zum Verzinnen von Lötfahnen und zum Verlöten der Lötfahnen mit Drähten und Vorrichtung zur Durchführung dieses Verfahrens
US3593677A (en) * 1967-11-09 1971-07-20 Brown Engineering Co Soldering apparatus and method
FR2182706B1 (de) * 1972-05-04 1976-06-11 Chausson Usines Sa
DE2228218B1 (de) * 1972-06-09 1973-05-10 Siemens AG, 1000 Berlin u. 8000 München Verfahren zum tauchloeten von traegerplaettchen
US3924794A (en) * 1973-08-14 1975-12-09 Us Energy Solder leveling process
US3904102A (en) * 1974-06-05 1975-09-09 Western Electric Co Apparatus and method for soldering, fusing or brazing
CH607622A5 (en) * 1976-02-20 1978-09-29 Schleuniger K Dr & Co Wave-soldering apparatus
US4011980A (en) * 1976-03-25 1977-03-15 Western Electric Company, Inc. Flow-over mass soldering
DD127076A1 (de) * 1976-07-01 1977-09-07

Also Published As

Publication number Publication date
DE2856460B2 (de) 1981-06-11
DE2856460A1 (de) 1980-07-03
DE2856460C3 (de) 1982-02-11
JPS5591191A (en) 1980-07-10
EP0013359A1 (de) 1980-07-23
EP0013359B1 (de) 1981-08-12

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Legal Events

Date Code Title Description
REN Ceased due to non-payment of the annual fee