FR2312916A1 - Machine de surfusion des depots d'etain-plomb pour circuits imprimes - Google Patents

Machine de surfusion des depots d'etain-plomb pour circuits imprimes

Info

Publication number
FR2312916A1
FR2312916A1 FR7516790A FR7516790A FR2312916A1 FR 2312916 A1 FR2312916 A1 FR 2312916A1 FR 7516790 A FR7516790 A FR 7516790A FR 7516790 A FR7516790 A FR 7516790A FR 2312916 A1 FR2312916 A1 FR 2312916A1
Authority
FR
France
Prior art keywords
lead alloy
printed circuit
electrolytic bath
liquid
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7516790A
Other languages
English (en)
Other versions
FR2312916B3 (fr
Inventor
Jean Julien Barrier
Paul Charles Lucien Gaulard
Olivier Andre Widen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Laboratoire Central de Telecommunications SA
Original Assignee
Laboratoire Central de Telecommunications SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Laboratoire Central de Telecommunications SA filed Critical Laboratoire Central de Telecommunications SA
Priority to FR7516790A priority Critical patent/FR2312916A1/fr
Publication of FR2312916A1 publication Critical patent/FR2312916A1/fr
Application granted granted Critical
Publication of FR2312916B3 publication Critical patent/FR2312916B3/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0776—Uses of liquids not otherwise provided for in H05K2203/0759 - H05K2203/0773
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3473—Plating of solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Chemically Coating (AREA)
FR7516790A 1975-05-29 1975-05-29 Machine de surfusion des depots d'etain-plomb pour circuits imprimes Granted FR2312916A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR7516790A FR2312916A1 (fr) 1975-05-29 1975-05-29 Machine de surfusion des depots d'etain-plomb pour circuits imprimes

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7516790A FR2312916A1 (fr) 1975-05-29 1975-05-29 Machine de surfusion des depots d'etain-plomb pour circuits imprimes

Publications (2)

Publication Number Publication Date
FR2312916A1 true FR2312916A1 (fr) 1976-12-24
FR2312916B3 FR2312916B3 (fr) 1978-12-29

Family

ID=9155839

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7516790A Granted FR2312916A1 (fr) 1975-05-29 1975-05-29 Machine de surfusion des depots d'etain-plomb pour circuits imprimes

Country Status (1)

Country Link
FR (1) FR2312916A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2536944A1 (fr) * 1982-11-26 1984-06-01 Osipov Anatoly Dispositif pour la refusion de revetements electrolytiques sur des plaques notamment a circuits imprimes

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2536944A1 (fr) * 1982-11-26 1984-06-01 Osipov Anatoly Dispositif pour la refusion de revetements electrolytiques sur des plaques notamment a circuits imprimes

Also Published As

Publication number Publication date
FR2312916B3 (fr) 1978-12-29

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