ATE209T1 - DEVICE FOR APPLYING A LAYER OF SOLDER TO A CIRCUIT BOARD - Google Patents
DEVICE FOR APPLYING A LAYER OF SOLDER TO A CIRCUIT BOARDInfo
- Publication number
- ATE209T1 ATE209T1 AT79105039T AT79105039T ATE209T1 AT E209 T1 ATE209 T1 AT E209T1 AT 79105039 T AT79105039 T AT 79105039T AT 79105039 T AT79105039 T AT 79105039T AT E209 T1 ATE209 T1 AT E209T1
- Authority
- AT
- Austria
- Prior art keywords
- solder
- container
- circuit board
- slot
- applying
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Molten Solder (AREA)
- Coating Apparatus (AREA)
Abstract
1. Apparatus for applying a metallic solder coating on a printed circuit board through contact of the printed circuit board with the liquid solder, having a first container (6) for receiving the liquid solder (7), a second container (9) which has a slot-shaped opening (35) extending horizontally in one wall (22, 23), an a pump (37) which pumps the liquid solder from the first container (6) into the second container (9) in a quantity such that the level (38) of solder in the second container (9) is above the openings (35), characterized in that a further slot-shaped opening (35) extending horizontally is provided in the wall (23) opposite the wall (22) with the slot-shaped opening (35) and both slot-shaped openings (35) are located in the feed plane of the printed circuit boards (21) fed horizontally.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2856460A DE2856460C3 (en) | 1978-12-28 | 1978-12-28 | Device for applying a layer of solder to a printed circuit board |
EP79105039A EP0013359B1 (en) | 1978-12-28 | 1979-12-10 | Device for applying a layer of solder to a printed circuit |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE209T1 true ATE209T1 (en) | 1981-09-15 |
Family
ID=6058562
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT79105039T ATE209T1 (en) | 1978-12-28 | 1979-12-10 | DEVICE FOR APPLYING A LAYER OF SOLDER TO A CIRCUIT BOARD |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP0013359B1 (en) |
JP (1) | JPS5591191A (en) |
AT (1) | ATE209T1 (en) |
DE (1) | DE2856460C3 (en) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4277518A (en) * | 1979-11-13 | 1981-07-07 | Gyrex Corp. | Solder-coating method |
US4402800A (en) * | 1981-10-02 | 1983-09-06 | Ash James J | Apparatus and method of treating tabs of printed circuit boards and the like |
US4385967A (en) * | 1981-10-07 | 1983-05-31 | Chemcut Corporation | Electroplating apparatus and method |
EP0078900B1 (en) * | 1981-10-22 | 1985-03-20 | Siemens-Albis Aktiengesellschaft | Device for the dispersion of a solder layer on a printed-circuit board |
US4608941A (en) * | 1985-01-10 | 1986-09-02 | Teledyne Electro-Mechanisms | Apparatus for soldering printed circuit panels |
DE3536304A1 (en) * | 1985-10-11 | 1987-04-16 | Kaspar Eidenberg | Process for tinning printed circuit boards and a device for carrying out this method |
EP0256948B1 (en) * | 1986-08-13 | 1990-10-03 | Senju Metal Industry Co., Ltd. | Fountain-type soldering apparatus |
US5209782A (en) * | 1988-05-27 | 1993-05-11 | Teledyne Industries, Inc. | System for soldering printed circuits |
US5038706A (en) * | 1988-05-27 | 1991-08-13 | Teledyne Industries, Inc. | Printed circuits board soldering apparatus |
US4903631A (en) * | 1988-05-27 | 1990-02-27 | Teledyne Industries, Inc. | System for soldering printed circuits |
US5007369A (en) * | 1988-05-27 | 1991-04-16 | Teledyne Industries, Inc. | Apparatus for solder coating printed circuit panels |
JPH087654Y2 (en) * | 1990-11-29 | 1996-03-04 | 神鋼メックス株式会社 | Equipment for soldering printed circuit boards |
DE4041272C2 (en) * | 1990-12-21 | 1996-12-05 | Siemens Ag | Wave soldering device |
DE102007035086B3 (en) * | 2007-07-26 | 2008-10-30 | Rena Sondermaschinen Gmbh | Device e.g. for surface treatment of liquid, conveys in horizontal direction through container with device has transport plane arranged with sealing area and hydrostatic pressure |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1552976C2 (en) * | 1966-08-31 | 1974-09-12 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Process for tinning soldering tails and for soldering the soldering tails to wires and apparatus for carrying out this process |
US3593677A (en) * | 1967-11-09 | 1971-07-20 | Brown Engineering Co | Soldering apparatus and method |
FR2182706B1 (en) * | 1972-05-04 | 1976-06-11 | Chausson Usines Sa | |
DE2228218B1 (en) * | 1972-06-09 | 1973-05-10 | Siemens AG, 1000 Berlin u. 8000 München | PROCESS FOR DIP SOLDERING CARRIER PLATES |
US3924794A (en) * | 1973-08-14 | 1975-12-09 | Us Energy | Solder leveling process |
US3904102A (en) * | 1974-06-05 | 1975-09-09 | Western Electric Co | Apparatus and method for soldering, fusing or brazing |
CH607622A5 (en) * | 1976-02-20 | 1978-09-29 | Schleuniger K Dr & Co | Wave-soldering apparatus |
US4011980A (en) * | 1976-03-25 | 1977-03-15 | Western Electric Company, Inc. | Flow-over mass soldering |
DD127076A1 (en) * | 1976-07-01 | 1977-09-07 |
-
1978
- 1978-12-28 DE DE2856460A patent/DE2856460C3/en not_active Expired
-
1979
- 1979-12-10 AT AT79105039T patent/ATE209T1/en not_active IP Right Cessation
- 1979-12-10 EP EP79105039A patent/EP0013359B1/en not_active Expired
- 1979-12-28 JP JP17394279A patent/JPS5591191A/en active Pending
Also Published As
Publication number | Publication date |
---|---|
DE2856460B2 (en) | 1981-06-11 |
EP0013359B1 (en) | 1981-08-12 |
DE2856460C3 (en) | 1982-02-11 |
DE2856460A1 (en) | 1980-07-03 |
EP0013359A1 (en) | 1980-07-23 |
JPS5591191A (en) | 1980-07-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
REN | Ceased due to non-payment of the annual fee |