ATE209T1 - DEVICE FOR APPLYING A LAYER OF SOLDER TO A CIRCUIT BOARD - Google Patents

DEVICE FOR APPLYING A LAYER OF SOLDER TO A CIRCUIT BOARD

Info

Publication number
ATE209T1
ATE209T1 AT79105039T AT79105039T ATE209T1 AT E209 T1 ATE209 T1 AT E209T1 AT 79105039 T AT79105039 T AT 79105039T AT 79105039 T AT79105039 T AT 79105039T AT E209 T1 ATE209 T1 AT E209T1
Authority
AT
Austria
Prior art keywords
solder
container
circuit board
slot
applying
Prior art date
Application number
AT79105039T
Other languages
German (de)
Inventor
Dieter Schmid
Original Assignee
Gebr. Schmid Gmbh & Co.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gebr. Schmid Gmbh & Co. filed Critical Gebr. Schmid Gmbh & Co.
Application granted granted Critical
Publication of ATE209T1 publication Critical patent/ATE209T1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Molten Solder (AREA)
  • Coating Apparatus (AREA)

Abstract

1. Apparatus for applying a metallic solder coating on a printed circuit board through contact of the printed circuit board with the liquid solder, having a first container (6) for receiving the liquid solder (7), a second container (9) which has a slot-shaped opening (35) extending horizontally in one wall (22, 23), an a pump (37) which pumps the liquid solder from the first container (6) into the second container (9) in a quantity such that the level (38) of solder in the second container (9) is above the openings (35), characterized in that a further slot-shaped opening (35) extending horizontally is provided in the wall (23) opposite the wall (22) with the slot-shaped opening (35) and both slot-shaped openings (35) are located in the feed plane of the printed circuit boards (21) fed horizontally.
AT79105039T 1978-12-28 1979-12-10 DEVICE FOR APPLYING A LAYER OF SOLDER TO A CIRCUIT BOARD ATE209T1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE2856460A DE2856460C3 (en) 1978-12-28 1978-12-28 Device for applying a layer of solder to a printed circuit board
EP79105039A EP0013359B1 (en) 1978-12-28 1979-12-10 Device for applying a layer of solder to a printed circuit

Publications (1)

Publication Number Publication Date
ATE209T1 true ATE209T1 (en) 1981-09-15

Family

ID=6058562

Family Applications (1)

Application Number Title Priority Date Filing Date
AT79105039T ATE209T1 (en) 1978-12-28 1979-12-10 DEVICE FOR APPLYING A LAYER OF SOLDER TO A CIRCUIT BOARD

Country Status (4)

Country Link
EP (1) EP0013359B1 (en)
JP (1) JPS5591191A (en)
AT (1) ATE209T1 (en)
DE (1) DE2856460C3 (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4277518A (en) * 1979-11-13 1981-07-07 Gyrex Corp. Solder-coating method
US4402800A (en) * 1981-10-02 1983-09-06 Ash James J Apparatus and method of treating tabs of printed circuit boards and the like
US4385967A (en) * 1981-10-07 1983-05-31 Chemcut Corporation Electroplating apparatus and method
ATE12195T1 (en) * 1981-10-22 1985-04-15 Siemens Ag DEVICE FOR APPLYING A LAYER OF SOLDER TO A CIRCUIT BOARD.
US4608941A (en) * 1985-01-10 1986-09-02 Teledyne Electro-Mechanisms Apparatus for soldering printed circuit panels
DE3536304A1 (en) * 1985-10-11 1987-04-16 Kaspar Eidenberg Process for tinning printed circuit boards and a device for carrying out this method
EP0256948B1 (en) * 1986-08-13 1990-10-03 Senju Metal Industry Co., Ltd. Fountain-type soldering apparatus
US4903631A (en) * 1988-05-27 1990-02-27 Teledyne Industries, Inc. System for soldering printed circuits
US5038706A (en) * 1988-05-27 1991-08-13 Teledyne Industries, Inc. Printed circuits board soldering apparatus
US5209782A (en) * 1988-05-27 1993-05-11 Teledyne Industries, Inc. System for soldering printed circuits
US5007369A (en) * 1988-05-27 1991-04-16 Teledyne Industries, Inc. Apparatus for solder coating printed circuit panels
JPH087654Y2 (en) * 1990-11-29 1996-03-04 神鋼メックス株式会社 Equipment for soldering printed circuit boards
DE4041272C2 (en) * 1990-12-21 1996-12-05 Siemens Ag Wave soldering device
DE102007035086B3 (en) * 2007-07-26 2008-10-30 Rena Sondermaschinen Gmbh Device e.g. for surface treatment of liquid, conveys in horizontal direction through container with device has transport plane arranged with sealing area and hydrostatic pressure

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1552976C2 (en) * 1966-08-31 1974-09-12 Siemens Ag, 1000 Berlin Und 8000 Muenchen Process for tinning soldering tails and for soldering the soldering tails to wires and apparatus for carrying out this process
US3593677A (en) * 1967-11-09 1971-07-20 Brown Engineering Co Soldering apparatus and method
FR2182706B1 (en) * 1972-05-04 1976-06-11 Chausson Usines Sa
DE2228218B1 (en) * 1972-06-09 1973-05-10 Siemens AG, 1000 Berlin u. 8000 München PROCESS FOR DIP SOLDERING CARRIER PLATES
US3924794A (en) * 1973-08-14 1975-12-09 Us Energy Solder leveling process
US3904102A (en) * 1974-06-05 1975-09-09 Western Electric Co Apparatus and method for soldering, fusing or brazing
CH607622A5 (en) * 1976-02-20 1978-09-29 Schleuniger K Dr & Co Wave-soldering apparatus
US4011980A (en) * 1976-03-25 1977-03-15 Western Electric Company, Inc. Flow-over mass soldering
DD127076A1 (en) * 1976-07-01 1977-09-07

Also Published As

Publication number Publication date
EP0013359A1 (en) 1980-07-23
JPS5591191A (en) 1980-07-10
DE2856460C3 (en) 1982-02-11
DE2856460B2 (en) 1981-06-11
DE2856460A1 (en) 1980-07-03
EP0013359B1 (en) 1981-08-12

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Legal Events

Date Code Title Description
REN Ceased due to non-payment of the annual fee