JPS62196855A - 半導体搭載用基板 - Google Patents

半導体搭載用基板

Info

Publication number
JPS62196855A
JPS62196855A JP61037966A JP3796686A JPS62196855A JP S62196855 A JPS62196855 A JP S62196855A JP 61037966 A JP61037966 A JP 61037966A JP 3796686 A JP3796686 A JP 3796686A JP S62196855 A JPS62196855 A JP S62196855A
Authority
JP
Japan
Prior art keywords
substrate
conductor
semiconductor
hole
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61037966A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0513381B2 (cg-RX-API-DMAC7.html
Inventor
Yoshinori Takasaki
義徳 高崎
Katsumi Mabuchi
勝美 馬渕
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Priority to JP61037966A priority Critical patent/JPS62196855A/ja
Publication of JPS62196855A publication Critical patent/JPS62196855A/ja
Publication of JPH0513381B2 publication Critical patent/JPH0513381B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP61037966A 1986-02-22 1986-02-22 半導体搭載用基板 Granted JPS62196855A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61037966A JPS62196855A (ja) 1986-02-22 1986-02-22 半導体搭載用基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61037966A JPS62196855A (ja) 1986-02-22 1986-02-22 半導体搭載用基板

Publications (2)

Publication Number Publication Date
JPS62196855A true JPS62196855A (ja) 1987-08-31
JPH0513381B2 JPH0513381B2 (cg-RX-API-DMAC7.html) 1993-02-22

Family

ID=12512305

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61037966A Granted JPS62196855A (ja) 1986-02-22 1986-02-22 半導体搭載用基板

Country Status (1)

Country Link
JP (1) JPS62196855A (cg-RX-API-DMAC7.html)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5051755A (en) * 1988-07-12 1991-09-24 Victor Company Of Japan, Ltd. Thermal printing apparatus
JPH0621257U (ja) * 1991-12-12 1994-03-18 日本ミクロン株式会社 表面実装用プラスチックピングリットアレー
JP2002175022A (ja) * 2000-12-06 2002-06-21 Stanley Electric Co Ltd Ｌｅｄ表示器

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6194359U (cg-RX-API-DMAC7.html) * 1984-11-27 1986-06-18
JPS6215840A (ja) * 1985-07-12 1987-01-24 Matsushita Electric Works Ltd 電子素子用チツプキヤリア

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6194359U (cg-RX-API-DMAC7.html) * 1984-11-27 1986-06-18
JPS6215840A (ja) * 1985-07-12 1987-01-24 Matsushita Electric Works Ltd 電子素子用チツプキヤリア

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5051755A (en) * 1988-07-12 1991-09-24 Victor Company Of Japan, Ltd. Thermal printing apparatus
US5319391A (en) * 1988-07-12 1994-06-07 Victor Company Of Japan, Ltd. Thermal printing apparatus
JPH0621257U (ja) * 1991-12-12 1994-03-18 日本ミクロン株式会社 表面実装用プラスチックピングリットアレー
JP2002175022A (ja) * 2000-12-06 2002-06-21 Stanley Electric Co Ltd Ｌｅｄ表示器

Also Published As

Publication number Publication date
JPH0513381B2 (cg-RX-API-DMAC7.html) 1993-02-22

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Legal Events

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Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term