JPS62194741U - - Google Patents

Info

Publication number
JPS62194741U
JPS62194741U JP8253286U JP8253286U JPS62194741U JP S62194741 U JPS62194741 U JP S62194741U JP 8253286 U JP8253286 U JP 8253286U JP 8253286 U JP8253286 U JP 8253286U JP S62194741 U JPS62194741 U JP S62194741U
Authority
JP
Japan
Prior art keywords
sheet
light
chips
processing device
ultraviolet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8253286U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8253286U priority Critical patent/JPS62194741U/ja
Publication of JPS62194741U publication Critical patent/JPS62194741U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Adhesives Or Adhesive Processes (AREA)
JP8253286U 1986-06-02 1986-06-02 Pending JPS62194741U (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8253286U JPS62194741U (zh) 1986-06-02 1986-06-02

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8253286U JPS62194741U (zh) 1986-06-02 1986-06-02

Publications (1)

Publication Number Publication Date
JPS62194741U true JPS62194741U (zh) 1987-12-11

Family

ID=30935278

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8253286U Pending JPS62194741U (zh) 1986-06-02 1986-06-02

Country Status (1)

Country Link
JP (1) JPS62194741U (zh)

Similar Documents

Publication Publication Date Title
US7557904B2 (en) Wafer holding mechanism
KR102644784B1 (ko) 웨이퍼 생성 장치 및 반송 트레이
TW200514188A (en) Mounting device and mounting method
CN101032843B (zh) 晶片分割方法
TWI634671B (zh) 舉離方法
JPH10116801A (ja) 基板分割方法及びその基板分割を用いた発光素子製造 方法
TW201633443A (zh) 加工裝置的工作夾台
JP2007173268A (ja) ウエーハの分割方法
TWI813850B (zh) 卡盤台
JP4655406B2 (ja) 面発光式吸着テーブル
JPS62194741U (zh)
JPH07283174A (ja) ダイシング装置
JPH031172Y2 (zh)
JP4302284B2 (ja) 半導体ウェハの移載装置
JP4102101B2 (ja) 撮像ユニット
JPH0616529B2 (ja) 粘着シ−ト処理装置
JPH06204335A (ja) 紫外線照射装置
JPH062269Y2 (ja) 粘着シート処理装置
JPH0616528B2 (ja) 粘着シ−ト処理装置
JP7356289B2 (ja) 紫外線照射装置及び環状凸部除去装置
KR102670602B1 (ko) 웨이퍼의 가공 방법
JP3169952B2 (ja) 紫外線照射方法及び装置
JPS61226933A (ja) マウント装置
JPS63119242U (zh)
JPH0325407Y2 (zh)