JPH0325407Y2 - - Google Patents
Info
- Publication number
- JPH0325407Y2 JPH0325407Y2 JP998387U JP998387U JPH0325407Y2 JP H0325407 Y2 JPH0325407 Y2 JP H0325407Y2 JP 998387 U JP998387 U JP 998387U JP 998387 U JP998387 U JP 998387U JP H0325407 Y2 JPH0325407 Y2 JP H0325407Y2
- Authority
- JP
- Japan
- Prior art keywords
- light
- substrate
- sheet
- processing chamber
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000853 adhesive Substances 0.000 claims description 18
- 230000001070 adhesive effect Effects 0.000 claims description 18
- 239000000758 substrate Substances 0.000 claims description 14
- 230000007246 mechanism Effects 0.000 claims description 9
- 239000004065 semiconductor Substances 0.000 claims description 9
- 239000011261 inert gas Substances 0.000 claims description 6
- 230000007723 transport mechanism Effects 0.000 claims description 3
- 239000000463 material Substances 0.000 claims 1
- 238000000034 method Methods 0.000 description 6
- 239000007789 gas Substances 0.000 description 5
- 230000001678 irradiating effect Effects 0.000 description 3
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP998387U JPH0325407Y2 (zh) | 1987-01-28 | 1987-01-28 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP998387U JPH0325407Y2 (zh) | 1987-01-28 | 1987-01-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63119243U JPS63119243U (zh) | 1988-08-02 |
JPH0325407Y2 true JPH0325407Y2 (zh) | 1991-06-03 |
Family
ID=30795818
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP998387U Expired JPH0325407Y2 (zh) | 1987-01-28 | 1987-01-28 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0325407Y2 (zh) |
-
1987
- 1987-01-28 JP JP998387U patent/JPH0325407Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS63119243U (zh) | 1988-08-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP3076179B2 (ja) | ダイシング装置 | |
TWI446426B (zh) | 紫外線照射方法及使用該方法之裝置 | |
TW575900B (en) | Wafer transfer apparatus | |
CN103700584A (zh) | 表面保护部件以及加工方法 | |
JP3993918B2 (ja) | 半導体装置の製造方法 | |
JP7042944B2 (ja) | 搬送装置、および基板処理システム | |
JP5312997B2 (ja) | 紫外線照射装置 | |
KR20180129643A (ko) | 웨이퍼의 가공 방법 | |
TWI829950B (zh) | 保護構件形成方法及保護構件形成裝置 | |
JP4324788B2 (ja) | ウェーハマウンタ | |
JP4488686B2 (ja) | 紫外線照射方法およびそれを用いた装置 | |
KR20060044663A (ko) | 초박 칩의 제조 프로세스 및 제조장치 | |
KR20040075699A (ko) | 절삭장치 | |
JPH0325407Y2 (zh) | ||
JP2005086074A (ja) | 半導体ウェーハの移し替え方法 | |
JP4302284B2 (ja) | 半導体ウェハの移載装置 | |
TWI613085B (zh) | 樹脂片貼著方法 | |
TW202236487A (zh) | 搬送裝置及基板之搬送方法 | |
KR102521704B1 (ko) | 처리 장치 | |
JPH06204335A (ja) | 紫外線照射装置 | |
JP2020119914A (ja) | 搬送装置および搬送方法 | |
JP2004063644A (ja) | 半導体ウェハの保護シート着脱方法及び半導体ウェハの保護シート着脱装置 | |
JP2023023594A (ja) | 基板処理装置 | |
JP2022135901A (ja) | 搬送装置及び基板の搬送方法 | |
JP2020191328A (ja) | 搬送機構及び板状物の搬送方法 |