JPS62191Y2 - - Google Patents
Info
- Publication number
- JPS62191Y2 JPS62191Y2 JP1983016597U JP1659783U JPS62191Y2 JP S62191 Y2 JPS62191 Y2 JP S62191Y2 JP 1983016597 U JP1983016597 U JP 1983016597U JP 1659783 U JP1659783 U JP 1659783U JP S62191 Y2 JPS62191 Y2 JP S62191Y2
- Authority
- JP
- Japan
- Prior art keywords
- potential
- circuit
- electron beam
- measured
- measurement
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000010894 electron beam technology Methods 0.000 claims description 24
- 239000004065 semiconductor Substances 0.000 claims description 17
- 238000005259 measurement Methods 0.000 claims description 13
- 230000001678 irradiating effect Effects 0.000 claims description 2
- 238000000034 method Methods 0.000 description 7
- 230000007274 generation of a signal involved in cell-cell signaling Effects 0.000 description 4
- 230000002159 abnormal effect Effects 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000011326 mechanical measurement Methods 0.000 description 2
- 238000010297 mechanical methods and process Methods 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Tests Of Electronic Circuits (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1659783U JPS58150839U (ja) | 1983-02-07 | 1983-02-07 | 電子ビ−ムを用いた測定装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1659783U JPS58150839U (ja) | 1983-02-07 | 1983-02-07 | 電子ビ−ムを用いた測定装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58150839U JPS58150839U (ja) | 1983-10-08 |
JPS62191Y2 true JPS62191Y2 (de) | 1987-01-07 |
Family
ID=30028960
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1659783U Granted JPS58150839U (ja) | 1983-02-07 | 1983-02-07 | 電子ビ−ムを用いた測定装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58150839U (de) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4974484A (de) * | 1972-11-17 | 1974-07-18 |
-
1983
- 1983-02-07 JP JP1659783U patent/JPS58150839U/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4974484A (de) * | 1972-11-17 | 1974-07-18 |
Also Published As
Publication number | Publication date |
---|---|
JPS58150839U (ja) | 1983-10-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4706019A (en) | Electron beam test probe system for analyzing integrated circuits | |
JP3534582B2 (ja) | パターン欠陥検査方法および検査装置 | |
KR100775437B1 (ko) | 패턴검사장치및그방법 | |
US20090189075A1 (en) | Inspection method and inspection system using charged particle beam | |
JPH11326247A (ja) | 基板検査装置およびこれを備えた基板検査システム並びに基板検査方法 | |
JPH09320505A (ja) | 電子線式検査方法及びその装置並びに半導体の製造方法及びその製造ライン | |
JP2001127125A (ja) | 半導体デバイスパターンの欠陥検査・不良解析方法、半導体デバイスパターンの欠陥検査・不良解析システム、および、半導体デバイスパターンの検査装置 | |
JPH10134757A (ja) | マルチビーム検査装置 | |
US5053699A (en) | Scanning electron microscope based parametric testing method and apparatus | |
US5045783A (en) | Method for testing a printed circuit board with a particle probe | |
JPH11154695A (ja) | 集積回路の故障箇所特定方法および故障箇所特定装置 | |
JP3330382B2 (ja) | 集積回路の試験・修復装置 | |
JPS62191Y2 (de) | ||
JPH03146951A (ja) | 集束イオンビーム装置におけるアパーチャー検査方法 | |
JP2002139464A (ja) | 半導体装置の検査方法および検査装置 | |
JP2000077019A (ja) | 電子顕微鏡 | |
JPS6089050A (ja) | ストロボ走査電子顕微鏡 | |
JP2978971B2 (ja) | 荷電粒子ビーム装置及び荷電粒子ビーム位置決め方法 | |
JPH0815173B2 (ja) | 半導体集積回路の動作評価方法 | |
JP2000304827A (ja) | 非接触導通検査方法及びその装置 | |
JPS6164135A (ja) | 半導体解析装置 | |
JPH0725724Y2 (ja) | マイクロパッド | |
JPS61156627A (ja) | 試料電圧測定装置 | |
JP2557847B2 (ja) | 半導体集積回路の動作解析方法及び動作解析装置 | |
JPH0417250A (ja) | 電子ビーム装置 |