JPS62186438U - - Google Patents
Info
- Publication number
- JPS62186438U JPS62186438U JP1986076071U JP7607186U JPS62186438U JP S62186438 U JPS62186438 U JP S62186438U JP 1986076071 U JP1986076071 U JP 1986076071U JP 7607186 U JP7607186 U JP 7607186U JP S62186438 U JPS62186438 U JP S62186438U
- Authority
- JP
- Japan
- Prior art keywords
- heat storage
- storage material
- electrical component
- temperature
- electrical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005338 heat storage Methods 0.000 claims description 4
- 239000011232 storage material Substances 0.000 claims description 4
- 230000008018 melting Effects 0.000 claims 2
- 238000002844 melting Methods 0.000 claims 2
- 239000000203 mixture Substances 0.000 claims 1
- 239000000843 powder Substances 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986076071U JPS62186438U (enrdf_load_html_response) | 1986-05-20 | 1986-05-20 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986076071U JPS62186438U (enrdf_load_html_response) | 1986-05-20 | 1986-05-20 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62186438U true JPS62186438U (enrdf_load_html_response) | 1987-11-27 |
Family
ID=30922809
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1986076071U Pending JPS62186438U (enrdf_load_html_response) | 1986-05-20 | 1986-05-20 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62186438U (enrdf_load_html_response) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013258403A (ja) * | 2012-06-08 | 2013-12-26 | Kojun Seimitsu Kogyo Kofun Yugenkoshi | 電子デバイス |
-
1986
- 1986-05-20 JP JP1986076071U patent/JPS62186438U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013258403A (ja) * | 2012-06-08 | 2013-12-26 | Kojun Seimitsu Kogyo Kofun Yugenkoshi | 電子デバイス |
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