JPS62186438U - - Google Patents
Info
- Publication number
- JPS62186438U JPS62186438U JP1986076071U JP7607186U JPS62186438U JP S62186438 U JPS62186438 U JP S62186438U JP 1986076071 U JP1986076071 U JP 1986076071U JP 7607186 U JP7607186 U JP 7607186U JP S62186438 U JPS62186438 U JP S62186438U
- Authority
- JP
- Japan
- Prior art keywords
- heat storage
- storage material
- electrical component
- temperature
- electrical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005338 heat storage Methods 0.000 claims description 4
- 239000011232 storage material Substances 0.000 claims description 4
- 230000008018 melting Effects 0.000 claims 2
- 238000002844 melting Methods 0.000 claims 2
- 239000000203 mixture Substances 0.000 claims 1
- 239000000843 powder Substances 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Description
第１図はこの考案の一実施例による電気機器を
示す断面図、第２図ａ，ｂはこの考案の他の実施
例による電気機器を示すそれぞれ平面図および断
面図、第３図は従来の電気機器を一部切欠いて内
部を示す斜視図である。
図において、１はチツプ、２はリード線、３は
パツケージ、４は相変化型蓄熱材、７はシリコー
ンウエハ、８はモリブデン、９は銅である。なお
、各図中同一符号は同一または相当部分を示すも
のとする。
FIG. 1 is a sectional view showing an electrical device according to one embodiment of the invention, FIGS. 2a and b are a plan view and a sectional view showing electrical equipment according to another embodiment of the invention, and FIG. FIG. 2 is a partially cutaway perspective view showing the inside of the electrical device. In the figure, 1 is a chip, 2 is a lead wire, 3 is a package, 4 is a phase change type heat storage material, 7 is a silicon wafer, 8 is molybdenum, and 9 is copper. Note that the same reference numerals in each figure indicate the same or corresponding parts.
Claims (1)
上記電気部品の定格時の温度より高く上記電気部
品の最高許容温度以下である相変化型蓄熱材を封
入した電気機器。 (2) 相変化型蓄熱材の融点は、４０℃〜１５０
℃である実用新案登録請求の範囲第１項記載の電
気機器。 (3) 相変化型蓄熱材は、熱良導性の微粉体を分
散混合したものである実用新案登録請求の範囲第
１項または第２項記載の電気機器。[Scope of Claim for Utility Model Registration] (1) A phase-change heat storage material whose melting point is higher than the rated temperature of the electrical component and below the maximum allowable temperature of the electrical component is placed in a container that seals the electrical component. Enclosed electrical equipment. (2) The melting point of the phase change type heat storage material is 40°C to 150°C.
The electric device according to claim 1 of the utility model registration claim, which has a temperature of .degree. (3) The electrical device according to claim 1 or 2, wherein the phase change heat storage material is a mixture of dispersed fine powder with good thermal conductivity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986076071U JPS62186438U (en) | 1986-05-20 | 1986-05-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986076071U JPS62186438U (en) | 1986-05-20 | 1986-05-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62186438U true JPS62186438U (en) | 1987-11-27 |
Family
ID=30922809
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986076071U Pending JPS62186438U (en) | 1986-05-20 | 1986-05-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62186438U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013258403A (en) * | 2012-06-08 | 2013-12-26 | Kojun Seimitsu Kogyo Kofun Yugenkoshi | Electronic device |
-
1986
- 1986-05-20 JP JP1986076071U patent/JPS62186438U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013258403A (en) * | 2012-06-08 | 2013-12-26 | Kojun Seimitsu Kogyo Kofun Yugenkoshi | Electronic device |
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