JPS6217856B2 - - Google Patents

Info

Publication number
JPS6217856B2
JPS6217856B2 JP54172611A JP17261179A JPS6217856B2 JP S6217856 B2 JPS6217856 B2 JP S6217856B2 JP 54172611 A JP54172611 A JP 54172611A JP 17261179 A JP17261179 A JP 17261179A JP S6217856 B2 JPS6217856 B2 JP S6217856B2
Authority
JP
Japan
Prior art keywords
wire
capillary
main pipe
gas
pipe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54172611A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5694757A (en
Inventor
Yoshikyo Asano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Sokuhan Co Ltd
Original Assignee
Tokyo Sokuhan Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Sokuhan Co Ltd filed Critical Tokyo Sokuhan Co Ltd
Priority to JP17261179A priority Critical patent/JPS5694757A/ja
Publication of JPS5694757A publication Critical patent/JPS5694757A/ja
Publication of JPS6217856B2 publication Critical patent/JPS6217856B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/0711—
    • H10W72/07141—
    • H10W72/07168—
    • H10W72/075—
    • H10W72/07502—
    • H10W72/07521—
    • H10W72/536—
    • H10W72/5363—

Landscapes

  • Wire Bonding (AREA)
JP17261179A 1979-12-28 1979-12-28 Wire bonding device Granted JPS5694757A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17261179A JPS5694757A (en) 1979-12-28 1979-12-28 Wire bonding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17261179A JPS5694757A (en) 1979-12-28 1979-12-28 Wire bonding device

Publications (2)

Publication Number Publication Date
JPS5694757A JPS5694757A (en) 1981-07-31
JPS6217856B2 true JPS6217856B2 (enExample) 1987-04-20

Family

ID=15945075

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17261179A Granted JPS5694757A (en) 1979-12-28 1979-12-28 Wire bonding device

Country Status (1)

Country Link
JP (1) JPS5694757A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6052030A (ja) * 1983-08-31 1985-03-23 Toshiba Corp ワイヤボンディング装置
US5031821A (en) * 1988-08-19 1991-07-16 Hitachi, Ltd. Semiconductor integrated circuit device, method for producing or assembling same, and producing or assembling apparatus for use in the method

Also Published As

Publication number Publication date
JPS5694757A (en) 1981-07-31

Similar Documents

Publication Publication Date Title
US6687988B1 (en) Method for forming pin-form wires and the like
KR960009982B1 (ko) 와이어 본딩 방법 및 와이어 본딩 장치 및 그 와이어 본딩 방법에 의해 생산되는 반도체 장치
US4387283A (en) Apparatus and method of forming aluminum balls for ball bonding
US4069961A (en) Contacting head for forming a wire connection on an integrated circuit
CN102054718B (zh) 用于导线键合机的自动导线进给系统
JPH0474859B2 (enExample)
TWI588922B (zh) 接合方法與接合裝置
US7025243B2 (en) Bondhead for wire bonding apparatus
JPS6217856B2 (enExample)
JPS60227432A (ja) ボンデイング用ワイヤのボ−ル形成装置
JPS58218131A (ja) ネイルヘツドワイヤボンダのワイヤ供給装置
JP3478510B2 (ja) ワイヤボンディング装置
JPS61229776A (ja) 細線の送給装置
JP2885242B1 (ja) ワイヤボンディング方法及び装置
JPH0143868Y2 (enExample)
JPH0320900B2 (enExample)
JPH03263844A (ja) ワイヤボンダにおけるキャピラリへのワイヤの挿通方法
JPH011244A (ja) ワイヤボンディング装置
JPH11233551A (ja) ワイヤボンディング装置
JPS6364053B2 (enExample)
JPS63289825A (ja) 半導体製造装置
JPH0310228B2 (enExample)
JPH10107059A (ja) ワイヤボンダ
KR0155153B1 (ko) 와이어 본딩방법 및 그 장치
JPS5823932B2 (ja) ワイヤボンデイングソウチ