JPS6217380B2 - - Google Patents
Info
- Publication number
- JPS6217380B2 JPS6217380B2 JP54037146A JP3714679A JPS6217380B2 JP S6217380 B2 JPS6217380 B2 JP S6217380B2 JP 54037146 A JP54037146 A JP 54037146A JP 3714679 A JP3714679 A JP 3714679A JP S6217380 B2 JPS6217380 B2 JP S6217380B2
- Authority
- JP
- Japan
- Prior art keywords
- case
- power diode
- semiconductor element
- sleeve
- area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W78/00—
-
- H10W76/136—
-
- H10W90/00—
Landscapes
- Rectifiers (AREA)
- Synchronous Machinery (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR7809329A FR2421465A1 (fr) | 1978-03-30 | 1978-03-30 | Diode de puissance a element semi-conducteur destinee notamment a equiper un pont redresseur d'alternateur |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS54152475A JPS54152475A (en) | 1979-11-30 |
| JPS6217380B2 true JPS6217380B2 (cg-RX-API-DMAC10.html) | 1987-04-17 |
Family
ID=9206456
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3714679A Granted JPS54152475A (en) | 1978-03-30 | 1979-03-30 | Semiconductor element power diode |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPS54152475A (cg-RX-API-DMAC10.html) |
| DE (1) | DE2912189C2 (cg-RX-API-DMAC10.html) |
| FR (1) | FR2421465A1 (cg-RX-API-DMAC10.html) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3124692A1 (de) * | 1981-06-24 | 1983-01-13 | Robert Bosch Gmbh, 7000 Stuttgart | "halbleitergleichrichter" |
| US4792204A (en) * | 1987-06-08 | 1988-12-20 | Siemens Aktiengesellschaft | Process and apparatus for elimination of tolerance dependent variations of a selectable spacing between components in optical communication equipment |
| US4938054A (en) * | 1989-05-03 | 1990-07-03 | Gilbarco Inc. | Ultrasonic linear meter sensor for positive displacement meter |
| DE10141603A1 (de) * | 2001-08-24 | 2003-03-06 | Bosch Gmbh Robert | Verfahren zum Befestigen eines elektrischen Elements sowie Baueinheit mit danach befestigtem elektrischen Element |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1188210B (de) * | 1962-05-28 | 1965-03-04 | Siemens Ag | Halbleiterbauelement |
| DE1489688A1 (de) * | 1965-06-26 | 1969-12-11 | Bosch Gmbh Robert | Halbleiterbauelement |
| DE1564749A1 (de) * | 1966-10-27 | 1970-01-08 | Semikron Gleichrichterbau | Halbleiteranordnung |
| DE1614481A1 (de) * | 1967-04-03 | 1970-07-02 | Siemens Ag | Halbleiterbauelement |
| US3527971A (en) * | 1968-05-08 | 1970-09-08 | Applied Motors Inc | Apparatus for mounting brushes and diodes in a dynamoelectric machine |
| DE1944515A1 (de) * | 1969-09-02 | 1971-03-04 | Siemens Ag | Halbleiterbauelement mit Kunststoffuellung |
| GB1489603A (en) * | 1974-01-18 | 1977-10-26 | Lucas Electrical Ltd | Semi-conductor assemblies |
-
1978
- 1978-03-30 FR FR7809329A patent/FR2421465A1/fr active Granted
-
1979
- 1979-03-28 DE DE2912189A patent/DE2912189C2/de not_active Expired
- 1979-03-30 JP JP3714679A patent/JPS54152475A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| FR2421465A1 (fr) | 1979-10-26 |
| FR2421465B1 (cg-RX-API-DMAC10.html) | 1982-07-23 |
| JPS54152475A (en) | 1979-11-30 |
| DE2912189C2 (de) | 1984-12-13 |
| DE2912189A1 (de) | 1979-10-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4107727A (en) | Resin sealed semiconductor device | |
| US12003148B2 (en) | Rotary electric machine and manufacturing method for rotary electric machine | |
| US4538168A (en) | High power semiconductor package | |
| CN1879212B (zh) | 二极管 | |
| JPH0376026B2 (cg-RX-API-DMAC10.html) | ||
| US4270138A (en) | Enhanced thermal transfer package for a semiconductor device | |
| JPS6217380B2 (cg-RX-API-DMAC10.html) | ||
| US3178621A (en) | Sealed housing for electronic elements | |
| KR890001182A (ko) | 외부 테이프 자동 접합(tab) 반도체 패키지 | |
| US4007477A (en) | Assembly of a recessed heat sink and a semiconductor device sealed within the recess in the heat sink and thermally connected to the heat sink | |
| JP3668904B2 (ja) | 内燃機関用点火装置 | |
| JP2813621B2 (ja) | ねじ締めコネクタの製造方法 | |
| JPS6321340B2 (cg-RX-API-DMAC10.html) | ||
| US20020047357A1 (en) | Support plinth for a power diode in a motor vehicle alternator | |
| WO2017017749A1 (ja) | 半導体装置 | |
| JPS5915237Y2 (ja) | モ−タのブラシホルダステ− | |
| JPH01147837A (ja) | 半導体装置 | |
| JP4260760B2 (ja) | 内燃機関用点火装置 | |
| JPH0412677Y2 (cg-RX-API-DMAC10.html) | ||
| JPH0227558Y2 (cg-RX-API-DMAC10.html) | ||
| JP2678116B2 (ja) | 熱感知器及びその製造方法 | |
| JPS5982755A (ja) | 半導体装置 | |
| JPS6336689Y2 (cg-RX-API-DMAC10.html) | ||
| US3441657A (en) | Semiconductor lead assemblies | |
| JP2587843Y2 (ja) | 電解コンデンサ |