JPS62173797A - セラミック多層配線基板 - Google Patents
セラミック多層配線基板Info
- Publication number
- JPS62173797A JPS62173797A JP61015154A JP1515486A JPS62173797A JP S62173797 A JPS62173797 A JP S62173797A JP 61015154 A JP61015154 A JP 61015154A JP 1515486 A JP1515486 A JP 1515486A JP S62173797 A JPS62173797 A JP S62173797A
- Authority
- JP
- Japan
- Prior art keywords
- weight
- ceramic
- composition
- multilayer wiring
- ceramic multilayer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 title claims description 60
- 239000000758 substrate Substances 0.000 title description 16
- 239000000203 mixture Substances 0.000 claims description 47
- 239000000463 material Substances 0.000 claims description 29
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 229910052763 palladium Inorganic materials 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 28
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 23
- 239000004020 conductor Substances 0.000 description 19
- 238000010304 firing Methods 0.000 description 13
- 229910000679 solder Inorganic materials 0.000 description 12
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 10
- 239000011521 glass Substances 0.000 description 9
- 239000000843 powder Substances 0.000 description 6
- 239000003990 capacitor Substances 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000004458 analytical method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000000635 electron micrograph Methods 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000007772 electrode material Substances 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- 229910001252 Pd alloy Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000010953 base metal Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000005211 surface analysis Methods 0.000 description 2
- -1 titanium tin barium borate Chemical compound 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 241000286209 Phasianidae Species 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000000921 elemental analysis Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
Landscapes
- Compositions Of Oxide Ceramics (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61015154A JPS62173797A (ja) | 1986-01-27 | 1986-01-27 | セラミック多層配線基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61015154A JPS62173797A (ja) | 1986-01-27 | 1986-01-27 | セラミック多層配線基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62173797A true JPS62173797A (ja) | 1987-07-30 |
| JPH0447476B2 JPH0447476B2 (enrdf_load_stackoverflow) | 1992-08-04 |
Family
ID=11880878
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61015154A Granted JPS62173797A (ja) | 1986-01-27 | 1986-01-27 | セラミック多層配線基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62173797A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01231398A (ja) * | 1988-03-11 | 1989-09-14 | Matsushita Electric Ind Co Ltd | セラミック多層配線基板とその製造方法 |
| EP1153896A1 (en) | 2000-04-26 | 2001-11-14 | Matsushita Electric Industrial Co., Ltd. | Dielectric ceramic composition, method for producing the same and device for communication apparatus using the same |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5717474A (en) * | 1980-06-30 | 1982-01-29 | Nippon Electric Co | Multilayer ceramic substrate |
| JPS58156552A (ja) * | 1982-03-11 | 1983-09-17 | Nec Corp | 絶縁性セラミツクペ−スト用無機組成物 |
| JPS599992A (ja) * | 1982-07-08 | 1984-01-19 | 株式会社日立製作所 | 多層配線基板の製造方法 |
| JPS60257195A (ja) * | 1984-06-01 | 1985-12-18 | 鳴海製陶株式会社 | ハイブリツド基板及びその製造方法 |
-
1986
- 1986-01-27 JP JP61015154A patent/JPS62173797A/ja active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5717474A (en) * | 1980-06-30 | 1982-01-29 | Nippon Electric Co | Multilayer ceramic substrate |
| JPS58156552A (ja) * | 1982-03-11 | 1983-09-17 | Nec Corp | 絶縁性セラミツクペ−スト用無機組成物 |
| JPS599992A (ja) * | 1982-07-08 | 1984-01-19 | 株式会社日立製作所 | 多層配線基板の製造方法 |
| JPS60257195A (ja) * | 1984-06-01 | 1985-12-18 | 鳴海製陶株式会社 | ハイブリツド基板及びその製造方法 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01231398A (ja) * | 1988-03-11 | 1989-09-14 | Matsushita Electric Ind Co Ltd | セラミック多層配線基板とその製造方法 |
| EP1153896A1 (en) | 2000-04-26 | 2001-11-14 | Matsushita Electric Industrial Co., Ltd. | Dielectric ceramic composition, method for producing the same and device for communication apparatus using the same |
| US6579817B2 (en) | 2000-04-26 | 2003-06-17 | Matsushita Electric Industrial Co., Ltd. | Dielectric ceramic composition and method for producing the same, and device for communication apparatus using the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0447476B2 (enrdf_load_stackoverflow) | 1992-08-04 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |