JPS6216752B2 - - Google Patents
Info
- Publication number
- JPS6216752B2 JPS6216752B2 JP5426681A JP5426681A JPS6216752B2 JP S6216752 B2 JPS6216752 B2 JP S6216752B2 JP 5426681 A JP5426681 A JP 5426681A JP 5426681 A JP5426681 A JP 5426681A JP S6216752 B2 JPS6216752 B2 JP S6216752B2
- Authority
- JP
- Japan
- Prior art keywords
- brazing
- brazing filler
- filler metal
- melting point
- content
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3006—Ag as the principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Ceramic Products (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5426681A JPS57171599A (en) | 1981-04-13 | 1981-04-13 | Low melting point cu-ag system alloy solder with excellent wetting property |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5426681A JPS57171599A (en) | 1981-04-13 | 1981-04-13 | Low melting point cu-ag system alloy solder with excellent wetting property |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7707786A Division JPS6224893A (ja) | 1986-04-03 | 1986-04-03 | ぬれ性の良好な低融点Ｃｕ−Ａｇ系合金ろう材 |
| JP7707686A Division JPS6224892A (ja) | 1986-04-03 | 1986-04-03 | めれ性の良好な低融点Ｃｕ−Ａｇ系合金ろう材 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57171599A JPS57171599A (en) | 1982-10-22 |
| JPS6216752B2 true JPS6216752B2 (c_deeref_Disk_and_Scratch_Disk_Pools_and_Their_Defaults.html) | 1987-04-14 |
Family
ID=12965760
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5426681A Granted JPS57171599A (en) | 1981-04-13 | 1981-04-13 | Low melting point cu-ag system alloy solder with excellent wetting property |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57171599A (c_deeref_Disk_and_Scratch_Disk_Pools_and_Their_Defaults.html) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4957271B2 (ja) * | 2007-01-31 | 2012-06-20 | Ｊｆｅスチール株式会社 | レーザブレージング法 |
| JP5645307B2 (ja) * | 2010-12-09 | 2014-12-24 | 日本発條株式会社 | 大気接合用ろう材、接合体、および、集電材料 |
| JP6728057B2 (ja) * | 2015-03-31 | 2020-07-22 | 日本発條株式会社 | 合金材料、コンタクトプローブおよび接続端子 |
| JP7014003B2 (ja) * | 2018-03-28 | 2022-02-01 | 住友金属鉱山株式会社 | はんだ接合電極およびはんだ接合電極の被膜形成用銅合金ターゲット |
| CN110964941A (zh) * | 2019-12-27 | 2020-04-07 | 东莞正丰科技有限公司 | 复合炭材料银基电接触材料及其制备方法 |
| CN116411215A (zh) * | 2021-12-29 | 2023-07-11 | 无锡市蓝格林金属材料科技有限公司 | 一种铜钯合金线材及其制备方法 |
-
1981
- 1981-04-13 JP JP5426681A patent/JPS57171599A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57171599A (en) | 1982-10-22 |