JPS62166507A - Aging of solid electrolyte capacitor - Google Patents
Aging of solid electrolyte capacitorInfo
- Publication number
- JPS62166507A JPS62166507A JP933286A JP933286A JPS62166507A JP S62166507 A JPS62166507 A JP S62166507A JP 933286 A JP933286 A JP 933286A JP 933286 A JP933286 A JP 933286A JP S62166507 A JPS62166507 A JP S62166507A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- aging
- capacitor
- case
- liquid phase
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 title claims description 31
- 230000032683 aging Effects 0.000 title claims description 12
- 239000007784 solid electrolyte Substances 0.000 title description 2
- 229910000679 solder Inorganic materials 0.000 claims description 30
- 238000000034 method Methods 0.000 claims description 13
- 239000007791 liquid phase Substances 0.000 claims description 11
- 239000007787 solid Substances 0.000 claims description 11
- 150000001875 compounds Chemical class 0.000 claims description 8
- 238000002844 melting Methods 0.000 claims description 8
- 230000008018 melting Effects 0.000 claims description 8
- 239000004065 semiconductor Substances 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 230000002431 foraging effect Effects 0.000 claims description 4
- 238000009835 boiling Methods 0.000 claims description 3
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 150000003839 salts Chemical class 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 229910000765 intermetallic Inorganic materials 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 235000019441 ethanol Nutrition 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 150000002484 inorganic compounds Chemical class 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
Landscapes
- Conductive Materials (AREA)
- Primary Cells (AREA)
- Electric Double-Layer Capacitors Or The Like (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
（イ１ 産業上の利用分野
本発明は、固体電解コンデンサのエージング方法に関す
るものである。DETAILED DESCRIPTION OF THE INVENTION (1) Industrial Application Field The present invention relates to a method for aging solid electrolytic capacitors.
ｃ口）従来の技術
ＴＯＮＱと称される７、７．８．８−テトラシアノキノ
ジメタンの錯塩からなる有機半導体を溶融し、それをコ
ンデンサ素子に含浸後、冷却して固体電解質を形成する
方法は特開昭５７−１７３９２８号公報などに開示され
ている。c) Conventional technology An organic semiconductor consisting of a complex salt of 7,7.8.8-tetracyanoquinodimethane called TONQ is melted, impregnated into a capacitor element, and then cooled to form a solid electrolyte. The method is disclosed in JP-A-57-173928 and other publications.
上述した方法によシ形成される固体電解コンデンサは、
有機半導体をコンデンサに含浸し、冷却同化後、エポキ
シ樹脂等を用いて封口している。The solid electrolytic capacitor formed by the method described above is
Capacitors are impregnated with organic semiconductors, cooled and assimilated, and then sealed using epoxy resin or the like.
この固体電解コンデンサによれば、ＴＯＮＱ塩のコンデ
ンサ素子への含浸率が高まり、かつＴ。According to this solid electrolytic capacitor, the impregnation rate of TONQ salt into the capacitor element is increased, and T.
ＮＱ塩本来の優れた性質を活かすことができ、コンデン
サ特性の向上が図れる〇
一般に固体電解コンデンサにおいて初期不良の除去と漏
れ電流特性等の改善のため、素子の外装後に定格電圧の
ｔＯ〜２．０倍の電圧を８５〜１５０℃の温度範囲内で
印加するいわゆるエージング処理が行なわれている。Capacitor characteristics can be improved by making use of the excellent properties inherent in NQ salt. In general, in solid electrolytic capacitors, in order to eliminate initial defects and improve leakage current characteristics, etc., after packaging the device, the rated voltage is reduced to tO~2. A so-called aging process is performed in which a voltage of 0x is applied within a temperature range of 85 to 150°C.
（／１ 発明が解決しようとする問題点ところで、有機
半導体を含浸してなる固体電解コンデンサの漏れ電流低
減には、通常数時間以上の電圧印加が必要である。しか
も、コンデンサ素子に有機半導体を融解法にて含浸し、
アルミニウム、真ちゅう、銅などを用いた金属ケースに
収納した固体′１解コンデンサでは、陰極端子とケース
とかほぼ短絡状態である。従って溶融ノ・ンダ槽中に、
ケースの一部を接触させ、コンデンサの隠見られる。(/1 Problem to be solved by the invention) By the way, reducing the leakage current of a solid electrolytic capacitor impregnated with an organic semiconductor usually requires voltage application for several hours or more. Impregnated by melting method,
In a solid-state capacitor housed in a metal case made of aluminum, brass, copper, etc., the cathode terminal and the case are almost in a short-circuited state. Therefore, in the melting tank,
Part of the case is touching and the capacitor is hidden.
しかしながら、８５〜１５０℃の低融点／Ｓンダを用い
てエージングすると、コンデンサ引き上げ時にケースの
側面および底面にハンダ付着する。However, when the capacitor is aged using a low melting point/solder of 85 to 150° C., solder adheres to the side and bottom surfaces of the case when the capacitor is pulled up.
しかも、その付着ハンダは固化すると超音波洗浄等を施
しても容易に剥がせないため、以後の工程に支障をきた
すなどの問題があり、このノ〜ンダを用いたエージング
法は実用には向かないものであったＯ
（ロ）問題点を解決するための手段
本発明は、有機半導体を用いた固体電解コンデンサのエ
ージング方法に係り、溶融ハンダの表面に１５０℃以下
の融点を持ち２００℃以上の沸点を有する非金属化合物
の液相を設けた溶融ハンダ槽に、コンデンサの金属ケー
スの一部を浸漬し、ハンダと金属ケースを接触させると
共に、コンデンサの陽極端子とハンダに電圧を印加する
ことを特徴とする。Moreover, once the adhering solder has solidified, it cannot be easily removed even with ultrasonic cleaning, which poses problems such as interfering with subsequent processes, and this aging method using solder is not practical. The present invention relates to a method for aging a solid electrolytic capacitor using an organic semiconductor, in which the surface of molten solder has a melting point of 150°C or less and 200°C or more. A part of the metal case of the capacitor is immersed in a molten solder bath containing a liquid phase of a non-metallic compound having a boiling point of It is characterized by
（ホ）作 用
非金属化合物からなる液相を設けると、ケースを七〇液
相に浸漬時、ケース外面に非金属化合物が一様に付着し
、さらにその部分がハンダに浸漬されるため、エージン
グ終了後、コンデンサを引き上げ時に、ケースのハンダ
付着を防止できる。(E) Effect If a liquid phase consisting of a nonmetallic compound is provided, when the case is immersed in the liquid phase, the nonmetallic compound will uniformly adhere to the outer surface of the case, and that part will be immersed in the solder. This prevents solder from adhering to the case when pulling up the capacitor after aging.
（へ）実施例
以下、本発明のエージング方法を実施例に基いて説明す
る。(f) Examples Hereinafter, the aging method of the present invention will be explained based on examples.
まず、本発明が適用される固体電解コンデンサ（１０１
を簡単に説明する。陰極用アルミニウム箔と化成済の陽
極用アルミニウム箔とをマニラ紙からなるセパレータを
介して巻取りた通常のアルミニウム電解コンデンサ用巻
回素子を準備し、それを約２６０℃まで予熱しておく。First, a solid electrolytic capacitor (101
Explain briefly. An ordinary winding element for an aluminum electrolytic capacitor is prepared by winding an aluminum foil for a cathode and an aluminum foil for an anode which has been chemically treated with a separator made of Manila paper interposed therebetween, and is preheated to about 260°C.
有機半導体としてＴＯＮ Ｑの錯塩であるｎ−ブチルも
インキツリウム・ＴＣｔＮＱの粉末を適度の加圧下でア
ルミニウムからなる金属ケースにつめ、これを２６０〜
３００℃に加熱して溶融液化し、このケース内に上述の
如く準備されて予熱されている素子を挿入し、急速冷却
する。これにより有機半導体がセパレータに含浸した状
態で固化し、それが固体電解コンデンサの電解費として
作用する。その後、ケースを樹脂により封口して固体電
解コンデンサα０）が得られる。As an organic semiconductor, n-butyl, which is a complex salt of TON
It is heated to 300° C. to melt and liquefy, and the element prepared and preheated as described above is inserted into this case and rapidly cooled. As a result, the organic semiconductor is solidified while being impregnated into the separator, which acts as an electrolytic material for the solid electrolytic capacitor. Thereafter, the case is sealed with resin to obtain a solid electrolytic capacitor α0).
このようにして形成されたコンデンサα０）テ本発明に
よるエージング処理を施す。The capacitor α0) thus formed is subjected to an aging treatment according to the present invention.
本発明では、溶融ハンダ槽Ｈ１内にスズ（Ｓｎ）１５．
５％、鉛（Ｐｂ）３２９６、ビスマス（Ｂ１）５２．５
％からなる低融点ハンダ（２１を収納し、このハンダ（
２）の表面に、１５０℃以下の融点を持ち２００”Ｃ以
上の沸点を有する非金属化合物の液相（３）を設ける。In the present invention, tin (Sn) 15.
5%, lead (Pb) 3296, bismuth (B1) 52.5
% low melting point solder (21) is stored, and this solder (
A liquid phase (3) of a nonmetallic compound having a melting point of 150° C. or lower and a boiling point of 200″C or higher is provided on the surface of 2).
この液相（３）となる非金属化合物としてはグリセリン
、トリエタノールアミン、アゼライン酸、ステアリン酸
などの有機化合物、有機溶剤や有機酸、またはシリコン
オイルなどの無機化合物が用いられる、また液相（３）
の厚みとしては、０゜５〜２．０鮎程度である。As the nonmetallic compound that becomes this liquid phase (3), organic compounds such as glycerin, triethanolamine, azelaic acid, and stearic acid, organic solvents and organic acids, or inorganic compounds such as silicone oil are used. 3)
The thickness is about 0°5 to 2.0°.
このように、ハンダ（２）表面に非金属化合物の液相（
３）を設けた溶融ハンダ槽（１）に、コンデンサα■の
ケースＣ１１ｌの一部を浸漬し、ハンダ（２）とケース
＋１１＋とを接触させる。このとき、ハンダ（２）は１
２５℃に加熱している。また、ケースαＶを液相（３）
に浸漬したとき、ケース（１１１外面に非金属化合物が
一様に付着される。そして、各コンデンサ（１１・・・
の陽極端子（１２を導電板（５１に溶接を施し、この導
電板（５）とハンダ（２１とを電源（６）に接続し、陽
極端子（１２とハンダ（２）に電圧を印加する。そして
、１２５℃の温度で所定時間エージング処理を行なう。In this way, the liquid phase of the nonmetallic compound (
A part of the case C11l of the capacitor α■ is immersed in the molten solder tank (1) provided with the solder (2) and the case +11+. At this time, solder (2) is 1
It is heated to 25°C. In addition, case αV is liquid phase (3)
When the capacitors (11...
The anode terminal (12) is welded to the conductive plate (51), the conductive plate (5) and the solder (21) are connected to a power source (6), and a voltage is applied to the anode terminal (12) and the solder (2). Then, aging treatment is performed at a temperature of 125° C. for a predetermined period of time.
通常はハンダ（２）に浸漬後、５時間エージングを行な
う。Usually, after immersion in solder (2), aging is performed for 5 hours.
エージング終了後、コンデンサ（１０）を溶融ノ）ンダ
槽（１）より引き上げると、ケース旧）にハンダの付着
はなかった。After aging, when the capacitor (10) was pulled out of the melting solder tank (1), there was no solder attached to the old case.
また、この非金属化合物の液相（３）を設けることによ
り、ハンダ表面は空気による酸化劣化がない。Further, by providing the liquid phase (3) of this non-metallic compound, the solder surface is free from oxidative deterioration due to air.
尚、非金属化合物としてアゼライン酸を用いた場合には
、コンデンサ（Ｌαを引き上げる時に、アゼライン酸が
固化し、ケース（１１１に付着するので、後工程として
エチルアルコール等の溶媒による洗浄が必要である。In addition, when azelaic acid is used as a nonmetallic compound, when pulling up the capacitor (Lα), the azelaic acid solidifies and adheres to the case (111), so cleaning with a solvent such as ethyl alcohol is required as a post-process. .
（ト）発明の詳細
な説明したように、本発明法によれば、ケースにハンダ
が付着するのを防止できるので、ハンダを用いてエージ
ングを行なうことが可能となる。また、液相によりハン
ダ表０面の酸化劣化を防止でき、酸化ハンダの除去が不
要となｔ）、ＩＳンダの消耗もほとんどなくなる。(g) As described in detail, according to the method of the present invention, it is possible to prevent solder from adhering to the case, so that aging can be performed using solder. In addition, the liquid phase prevents oxidative deterioration of the solder surface, eliminating the need to remove oxidized solder, and almost eliminating wear of the IS solder.
第１図は本発明のエージング方法を示す構成図である。
１・・・溶融ハンダ槽、 ２・・・ハンダ、 ３・
・・非金属化合物の液相、 １０・・・コンデンサ、
１１−・・ケース、 １２・・・陽極端子。FIG. 1 is a block diagram showing the aging method of the present invention. 1... Molten solder bath, 2... Solder, 3.
...Liquid phase of nonmetallic compound, 10...Capacitor,
11-...Case, 12...Anode terminal.
Claims (1)
ス内に収納した固体電解コンデンサのエージング方法で
あって、溶融ハンダの表面に１５０℃以下の融点を持ち
２００℃以上の沸点を有する非金属化合物の液相を設け
た溶融ハンダ槽に、前記金属ケースの一部を浸漬し、ハ
ンダと金属ケースを接触させると共に、前記コンデンサ
の陽極端子とハンダに電圧を印加してエージングするこ
とを特徴とする固体電解コンデンサのエージング方法。(1) A method for aging a solid electrolytic capacitor in which a capacitor element impregnated with an organic semiconductor is housed in a metal case, in which a nonmetallic compound having a melting point of 150°C or lower and a boiling point of 200°C or higher is coated on the surface of molten solder. A solid state characterized in that a part of the metal case is immersed in a molten solder tank provided with a liquid phase, the solder and the metal case are brought into contact, and a voltage is applied to the anode terminal of the capacitor and the solder for aging. Aging method for electrolytic capacitors.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP933286A JPS62166507A (en) | 1986-01-20 | 1986-01-20 | Aging of solid electrolyte capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP933286A JPS62166507A (en) | 1986-01-20 | 1986-01-20 | Aging of solid electrolyte capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62166507A true JPS62166507A (en) | 1987-07-23 |
Family
ID=11717514
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP933286A Pending JPS62166507A (en) | 1986-01-20 | 1986-01-20 | Aging of solid electrolyte capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62166507A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9945710B2 (en) | 2016-08-25 | 2018-04-17 | Musasino Co., Ltd. | High liquid-level alarm device |
-
1986
- 1986-01-20 JP JP933286A patent/JPS62166507A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9945710B2 (en) | 2016-08-25 | 2018-04-17 | Musasino Co., Ltd. | High liquid-level alarm device |
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