JPS6216223B2 - - Google Patents

Info

Publication number
JPS6216223B2
JPS6216223B2 JP59186075A JP18607584A JPS6216223B2 JP S6216223 B2 JPS6216223 B2 JP S6216223B2 JP 59186075 A JP59186075 A JP 59186075A JP 18607584 A JP18607584 A JP 18607584A JP S6216223 B2 JPS6216223 B2 JP S6216223B2
Authority
JP
Japan
Prior art keywords
resin
weight
particles
alumina
spherical silica
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP59186075A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6164756A (ja
Inventor
Michio Ito
Yasuaki Shinohara
Yoshiaki Kurata
Kakuichi Murakami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Corp
Original Assignee
Nippon Steel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Corp filed Critical Nippon Steel Corp
Priority to JP18607584A priority Critical patent/JPS6164756A/ja
Publication of JPS6164756A publication Critical patent/JPS6164756A/ja
Publication of JPS6216223B2 publication Critical patent/JPS6216223B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
JP18607584A 1984-09-05 1984-09-05 無機充填熱硬化性樹脂組成物 Granted JPS6164756A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18607584A JPS6164756A (ja) 1984-09-05 1984-09-05 無機充填熱硬化性樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18607584A JPS6164756A (ja) 1984-09-05 1984-09-05 無機充填熱硬化性樹脂組成物

Publications (2)

Publication Number Publication Date
JPS6164756A JPS6164756A (ja) 1986-04-03
JPS6216223B2 true JPS6216223B2 (https=) 1987-04-11

Family

ID=16181943

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18607584A Granted JPS6164756A (ja) 1984-09-05 1984-09-05 無機充填熱硬化性樹脂組成物

Country Status (1)

Country Link
JP (1) JPS6164756A (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0651778B2 (ja) * 1986-11-11 1994-07-06 住友ベークライト株式会社 高熱伝導性エポキシ樹脂成形材料
JPH0681273U (ja) * 1993-04-30 1994-11-22 株式会社ミツル製作所 釣り用浮き
EP0780436A4 (en) * 1995-07-10 2000-04-19 Toray Industries EPOXY RESIN COMPOSITION

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53102361A (en) * 1977-02-18 1978-09-06 Toray Silicone Co Ltd Thermosetting resin composition
JPS6031845B2 (ja) * 1977-06-21 1985-07-24 日本合成化学工業株式会社 品質の改善されたポリビニルアルコ−ルの製造方法
JPS58138740A (ja) * 1982-02-15 1983-08-17 Denki Kagaku Kogyo Kk 樹脂組成物
JPS60210643A (ja) * 1983-11-30 1985-10-23 Denki Kagaku Kogyo Kk 充填剤及びその組成物

Also Published As

Publication number Publication date
JPS6164756A (ja) 1986-04-03

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