JPS6216009B2 - - Google Patents

Info

Publication number
JPS6216009B2
JPS6216009B2 JP15259480A JP15259480A JPS6216009B2 JP S6216009 B2 JPS6216009 B2 JP S6216009B2 JP 15259480 A JP15259480 A JP 15259480A JP 15259480 A JP15259480 A JP 15259480A JP S6216009 B2 JPS6216009 B2 JP S6216009B2
Authority
JP
Japan
Prior art keywords
circuit
integrated circuit
wafer
pad
integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP15259480A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5776854A (en
Inventor
Yukio Minato
Katsu Sanada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP15259480A priority Critical patent/JPS5776854A/ja
Publication of JPS5776854A publication Critical patent/JPS5776854A/ja
Publication of JPS6216009B2 publication Critical patent/JPS6216009B2/ja
Granted legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/316Testing of analog circuits
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544Marks applied to semiconductor devices or parts
    • H01L2223/54473Marks applied to semiconductor devices or parts for use after dicing
    • H01L2223/5448Located on chip prior to dicing and remaining on chip after dicing

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Semiconductor Integrated Circuits (AREA)
JP15259480A 1980-10-30 1980-10-30 Semiconductor device Granted JPS5776854A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15259480A JPS5776854A (en) 1980-10-30 1980-10-30 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15259480A JPS5776854A (en) 1980-10-30 1980-10-30 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS5776854A JPS5776854A (en) 1982-05-14
JPS6216009B2 true JPS6216009B2 (ru) 1987-04-10

Family

ID=15543842

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15259480A Granted JPS5776854A (en) 1980-10-30 1980-10-30 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5776854A (ru)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5996833U (ja) * 1982-12-20 1984-06-30 クラリオン株式会社 半導体装置
JPS59115642U (ja) * 1983-01-26 1984-08-04 日本電気アイシ−マイコンシステム株式会社 半導体ウエフア
JPS59159948U (ja) * 1983-04-12 1984-10-26 日本電気株式会社 集積回路装置
JPS59215717A (ja) * 1983-05-24 1984-12-05 Nec Corp 半導体集積回路装置の製造方法
JPH07120696B2 (ja) * 1986-02-26 1995-12-20 富士通株式会社 半導体装置の製造方法
JPH03273502A (ja) * 1990-03-23 1991-12-04 Matsushita Electric Ind Co Ltd 回転ヘッド装置

Also Published As

Publication number Publication date
JPS5776854A (en) 1982-05-14

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