JPS6215991Y2 - - Google Patents
Info
- Publication number
- JPS6215991Y2 JPS6215991Y2 JP1977120058U JP12005877U JPS6215991Y2 JP S6215991 Y2 JPS6215991 Y2 JP S6215991Y2 JP 1977120058 U JP1977120058 U JP 1977120058U JP 12005877 U JP12005877 U JP 12005877U JP S6215991 Y2 JPS6215991 Y2 JP S6215991Y2
- Authority
- JP
- Japan
- Prior art keywords
- heating
- plate
- reflow
- heat
- intermediate layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000010438 heat treatment Methods 0.000 claims description 39
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 12
- 229910000679 solder Inorganic materials 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 description 23
- 239000011521 glass Substances 0.000 description 16
- 239000000919 ceramic Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 238000002844 melting Methods 0.000 description 5
- 230000008018 melting Effects 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000001151 other effect Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
Landscapes
- Surface Heating Bodies (AREA)
- Control Of Resistance Heating (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1977120058U JPS6215991Y2 (ru) | 1977-09-06 | 1977-09-06 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1977120058U JPS6215991Y2 (ru) | 1977-09-06 | 1977-09-06 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5446055U JPS5446055U (ru) | 1979-03-30 |
JPS6215991Y2 true JPS6215991Y2 (ru) | 1987-04-22 |
Family
ID=29075898
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1977120058U Expired JPS6215991Y2 (ru) | 1977-09-06 | 1977-09-06 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6215991Y2 (ru) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4936747A (ru) * | 1972-08-09 | 1974-04-05 |
-
1977
- 1977-09-06 JP JP1977120058U patent/JPS6215991Y2/ja not_active Expired
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4936747A (ru) * | 1972-08-09 | 1974-04-05 |
Also Published As
Publication number | Publication date |
---|---|
JPS5446055U (ru) | 1979-03-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
IT1114116B (it) | Struttura circuitale raffreddata mediante conduzione e processo per la sua fabbricazione | |
JPH0277143A (ja) | 半導体装置およびその製造方法 | |
EP0998175A1 (en) | Method for soldering Dpak-type electronic components to circuit boards | |
JPS6215991Y2 (ru) | ||
JPS60260192A (ja) | 混成集積回路の製造方法 | |
JPH08236918A (ja) | 電子部品の実装方法 | |
JP2583142B2 (ja) | 熱電モジュールの製造方法 | |
JPH0677631A (ja) | チップ部品のアルミ基板への実装方法 | |
JP2570626B2 (ja) | 基板の接続構造及びその接続方法 | |
JPH022024A (ja) | サーマルヘッド | |
JPS61141199A (ja) | チツプ部品の実装方法 | |
JP2005072369A (ja) | 半導体装置の製造方法 | |
US7824111B2 (en) | Optical module | |
JP2004281646A (ja) | 電子部品の固着方法および固着装置 | |
JPH06196851A (ja) | 回路基板に金属部材を取り付けるはんだ付け方法 | |
JPH02135797A (ja) | アウターリードボンディング用ヒートツール構造及びボンディング装置 | |
JPH04273155A (ja) | パワー用混成集積回路の製造方法 | |
JPS59205731A (ja) | 半導体装置の製造方法 | |
SU927458A1 (ru) | Способ пайки полупроводниковых пластин с коммутационными шинами | |
JPS59198726A (ja) | Mic装置の製造方法 | |
JPS61117854A (ja) | 混成集積回路 | |
JPH01281760A (ja) | 半導体装置 | |
TW202401730A (zh) | 覆晶接合方法 | |
JPS6216040B2 (ru) | ||
JPH0513061U (ja) | 電力半導体装置 |