JPS62154746A - 電子部品の接合方法 - Google Patents
電子部品の接合方法Info
- Publication number
- JPS62154746A JPS62154746A JP60294016A JP29401685A JPS62154746A JP S62154746 A JPS62154746 A JP S62154746A JP 60294016 A JP60294016 A JP 60294016A JP 29401685 A JP29401685 A JP 29401685A JP S62154746 A JPS62154746 A JP S62154746A
- Authority
- JP
- Japan
- Prior art keywords
- lsi
- bonding agent
- conductive particles
- pellet
- terminal parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H10W74/15—
-
- H10W90/724—
-
- H10W90/734—
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60294016A JPS62154746A (ja) | 1985-12-27 | 1985-12-27 | 電子部品の接合方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60294016A JPS62154746A (ja) | 1985-12-27 | 1985-12-27 | 電子部品の接合方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62154746A true JPS62154746A (ja) | 1987-07-09 |
| JPH0436574B2 JPH0436574B2 (cg-RX-API-DMAC10.html) | 1992-06-16 |
Family
ID=17802160
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60294016A Granted JPS62154746A (ja) | 1985-12-27 | 1985-12-27 | 電子部品の接合方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62154746A (cg-RX-API-DMAC10.html) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0228340A (ja) * | 1988-06-09 | 1990-01-30 | Fujitsu Ltd | 半導体チップの実装方法 |
| JPH03274789A (ja) * | 1990-03-23 | 1991-12-05 | Toshiba Corp | 実装回路ユニットの製造方法 |
| JPH03128937U (cg-RX-API-DMAC10.html) * | 1990-04-10 | 1991-12-25 | ||
| JPH07159197A (ja) * | 1993-12-02 | 1995-06-23 | Mitsubishi Steel Mfg Co Ltd | 磁気式エンコーダ用磁気抵抗効果センサー |
| JP2000113919A (ja) * | 1998-08-03 | 2000-04-21 | Sony Corp | 電気的接続装置と電気的接続方法 |
| DE4304747C2 (de) * | 1992-02-19 | 2001-01-25 | Shinetsu Polymer Co | Heißverschweißbare elektrische Anschlußfolie |
-
1985
- 1985-12-27 JP JP60294016A patent/JPS62154746A/ja active Granted
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0228340A (ja) * | 1988-06-09 | 1990-01-30 | Fujitsu Ltd | 半導体チップの実装方法 |
| JPH03274789A (ja) * | 1990-03-23 | 1991-12-05 | Toshiba Corp | 実装回路ユニットの製造方法 |
| JPH03128937U (cg-RX-API-DMAC10.html) * | 1990-04-10 | 1991-12-25 | ||
| DE4304747C2 (de) * | 1992-02-19 | 2001-01-25 | Shinetsu Polymer Co | Heißverschweißbare elektrische Anschlußfolie |
| JPH07159197A (ja) * | 1993-12-02 | 1995-06-23 | Mitsubishi Steel Mfg Co Ltd | 磁気式エンコーダ用磁気抵抗効果センサー |
| JP2000113919A (ja) * | 1998-08-03 | 2000-04-21 | Sony Corp | 電気的接続装置と電気的接続方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0436574B2 (cg-RX-API-DMAC10.html) | 1992-06-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |