JPS6214800U - - Google Patents
Info
- Publication number
- JPS6214800U JPS6214800U JP10539485U JP10539485U JPS6214800U JP S6214800 U JPS6214800 U JP S6214800U JP 10539485 U JP10539485 U JP 10539485U JP 10539485 U JP10539485 U JP 10539485U JP S6214800 U JPS6214800 U JP S6214800U
- Authority
- JP
- Japan
- Prior art keywords
- coating resin
- ics
- transistors
- gold
- silver
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 2
- 239000011248 coating agent Substances 0.000 claims 2
- 238000000576 coating method Methods 0.000 claims 2
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 229920006254 polymer film Polymers 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
Description
第１図は本考案の一実施例の断面図、第２図は
従来の一例の断面図である。
１……セラミツクス基板、２……機能部品、３
……リードフレーム、４……エポキシ樹脂、５…
…プリントボード、６……金属遮蔽ケース、６′
……金属遮蔽ケース内空隙、７……遮蔽金属膜。
FIG. 1 is a sectional view of an embodiment of the present invention, and FIG. 2 is a sectional view of a conventional example. 1...Ceramics substrate, 2...Functional parts, 3
...Lead frame, 4...Epoxy resin, 5...
...Printed board, 6...Metal shielding case, 6'
...Gap in the metal shielding case, 7...Shielding metal film.
Claims (1)
機能部品と蒸着高分子膜でなる被覆樹脂を有し、
該被覆樹脂の表面に直接にアルミニウム、金、銀
、ニツケルなどの高導電率の金属皮膜を形成して
なる混成集積回路。 It has a ceramic substrate, functional parts such as transistors and ICs, and a coating resin made of a vapor-deposited polymer film.
A hybrid integrated circuit formed by forming a highly conductive metal film such as aluminum, gold, silver, or nickel directly on the surface of the coating resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10539485U JPS6214800U (en) | 1985-07-10 | 1985-07-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10539485U JPS6214800U (en) | 1985-07-10 | 1985-07-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6214800U true JPS6214800U (en) | 1987-01-29 |
Family
ID=30979782
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10539485U Pending JPS6214800U (en) | 1985-07-10 | 1985-07-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6214800U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04211189A (en) * | 1990-03-22 | 1992-08-03 | Canon Inc | Circuit board and its manufacture |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5848499A (en) * | 1981-09-17 | 1983-03-22 | 住友電気工業株式会社 | Electronic circuit |
| JPS612393A (en) * | 1984-06-15 | 1986-01-08 | 株式会社東芝 | Method of shielding electronic circuit |
-
1985
- 1985-07-10 JP JP10539485U patent/JPS6214800U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5848499A (en) * | 1981-09-17 | 1983-03-22 | 住友電気工業株式会社 | Electronic circuit |
| JPS612393A (en) * | 1984-06-15 | 1986-01-08 | 株式会社東芝 | Method of shielding electronic circuit |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04211189A (en) * | 1990-03-22 | 1992-08-03 | Canon Inc | Circuit board and its manufacture |
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