JPS5848499A - Electronic circuit - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION With regard to electronic circuits formed on flexible printed wiring boards, the electronic circuits are shielded from electromagnetic noise. Various electronic devices have come to be installed in automobiles and other vehicles. Therefore, for safety reasons, especially for electronic equipment installed in automobiles, etc., it is necessary to securely shield it from being affected by electromagnetic noise from outside the equipment! In the past, each electronic device was installed in a metal box for shielding, and each circuit of the electronic device was installed in a block made of a metal plate. However, in the conventional method, the weight of the metal box and metal plate for shielding increases, which increases the weight of the entire car. Since there are some electronic devices for which it is impossible to shield, it is definitely possible to shield the conventional technique 11 or even reduce the weight of the entire single unit, which has been requested in recent years. The goal is to achieve this in the garden. Honji @ is the above-mentioned drawbacks of the conventional technology. The can part is reliably shielded to avoid heat and the overall weight is reduced! I am hesitant to provide an electronic Omuro tube. The real truth that will disturb the target audience wAO
Yusei is a flexible print arrangement! Electronic components are arranged on the printed wiring of [, and the printed wiring Ff! - An electronic circuit made by bonding a metal plate and tube with a base IIO piece mlam hoe layer interposed between them.The above pudding) 1m! -Flexible material made by gluing copper foil to one side of the O-piece gold strip on the other side of the base! 1 Feng Film Association, said copper w1t
-Forward-moving print placement towards the outside-〇 Glue from above the electronic parts and make 9 and 1 * mold ・The following is the real @O implementation flt1
This will be explained in detail based on 111.

As shown in FIGS. 1 and 2, the electronic circuit of this embodiment has a printed circuit board 1 which is foldable. This binding film is formed of a flexible insulating film 1.
About half of II (right hand in the figure)! ! INK print arrangement 12 is printed. This print arrangement is 12Kt!
Printed parts 3 are arranged by printing, and chip parts 4 and the like are mounted by 71 soldering or the like. Further, on the back side of the insulating film 1, that is, on the opposite side to the printed wiring 2, a metal plate 7 is bonded with an adhesive 6 with an insulating layer St interposed therebetween.
/%, 6.

On the other hand, the remaining half of the insulating film 1 (the left half in the figure) is folded (1111) to cover the printed wiring, so this left half of the insulating film 101Ft
The copper plate S is glued and the copper sis is connected to the reference potential of the print wiring on the front side 2. Furthermore, the insulating film i #i on the left half is shown in Figure 3. 11 from the top of the chip component 4 is folded so that all the Im notes of the pattern arrangement 12 are included! By adhesive 6! ! *In the figure, * indicates a connector. In this case, since the printed circuit board is formed of 7) V-shaped insulating films and lumens, it can be folded and sealed as desired.

Therefore, the electronic circuit formed on the printed layout Il is shielded by the metal plate 7 on the back side, and the entire circuit is shielded from above the chip component 4 via the insulating film 11 on the front # side. ] Definitely shielded.

Incidentally, in addition to the above embodiment, the case where the copper flN bonded to the insulating film covering the printed wiring mt is one side of the steel foil has been described, but the invention is not limited to this. state (
In this case, the insulating film will be easier to fold and the overall weight will be lighter. , the printed layout iI can be printed and there is no need to form it integrally with the insulating film, and a separate insulating film with copper foil bonded to the back side may be bonded over the chip component, and the same effect pipe performance can be achieved. As described above with reference to the embodiments, according to the present invention, printing layout I! An insulating layer tube is attached to the seat surface of the printed wiring board of the electronic circuit on which electronic components are arranged, and a metal plate is glued therebetween. - By gluing and covering the printed circuit board with a flexible insulating film, it is possible to reliably shield the electronic circuit from electromagnetic noise, light, ′
By using a flexible insulating film, it is possible to reduce the overall weight.0 Furthermore, since the insulating film that covers the print placement can be deformed at will, it is possible to reduce the weight of the entire print. Any electronic circuit can be reliably shielded.

[Brief explanation of the drawing]

- Figures 1 to 3 are related to an embodiment of real #4, Figure 1 is a flat Em diagram showing the schematic structure of a printed wiring board, and Figure 2 is a cross section taken along the arrows X-X in Figure 1. Figure 3 is a cross-sectional view showing a shielded electronic circuit tube. In the figure, 1 is an insulating film, 2 is a printed wiring, 3 is a printed component, 4 is a chip component, 5 is an insulating layer, and 6 is an adhesive. 7 is a metal plate, 8 is a copper foil, 9F! It is a connector ◎ Patent applicant Sumitomo Electric Industries Co., Ltd. Representative Patent attorney Shibe Mitsuishi (and one other person)

Claims (1)

[Claims] (1) Printed layout of flexible printed layout board! The IK electronic components are arranged and the metal 4 [t11! The electronic circuit KsP9/% is made of a printed circuit board.
A flexible insulating film 5 made by gluing the adjustment to one aio4klIj was glued from above the electronic component O of the printed wiring toward the outside of the steel II board 1 *Electronic path with mold. -) The 1118 film that is attached to the other side of the printed circuit board is integrally formed with the printed circuit board, and this J!
Nine copper foils are adhered to the fusion film and printed.
2. The electronic circuit according to claim 1, wherein the electronic circuit is connected to a reference telegraph of a road and is connected to a reference telegraph. (3) The electronic circuit according to claim 2, characterized in that the copper foil is bonded to the insulating film and formed into a mesh shape.