JPH04263495A - Flexible wiring board - Google Patents

Flexible wiring board

Info

Publication number
JPH04263495A
JPH04263495A JP2358191A JP2358191A JPH04263495A JP H04263495 A JPH04263495 A JP H04263495A JP 2358191 A JP2358191 A JP 2358191A JP 2358191 A JP2358191 A JP 2358191A JP H04263495 A JPH04263495 A JP H04263495A
Authority
JP
Japan
Prior art keywords
main body
flexible wiring
wiring board
cover
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2358191A
Other languages
Japanese (ja)
Inventor
Yoshiatsu Kitagawa
北川 喜淳
Satoru Ito
覚 伊藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Priority to JP2358191A priority Critical patent/JPH04263495A/en
Publication of JPH04263495A publication Critical patent/JPH04263495A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0216Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0393Flexible materials

Landscapes

  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structure Of Printed Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

PURPOSE:To enable a flexible wiring board which is used for wiring in a small space and can be built in a product as it is bent to be surely shielded and enhanced in strength without providing additional processes. CONSTITUTION:Covers 5a and 5b which cover the front and the rear of a main body 4 of a flexible wiring board 1 are formed into one piece together with the main body 4 so as to be bendable, a pattern 6 is formed on each of the covers 5a and 5b and connected to an earth pattern 3 formed on the main body 4, and the covers 5a and 5b are bonded to the main body 4 as they are bent covering the front and the rear side of the main body 4.

Description

【発明の詳細な説明】[Detailed description of the invention]

【0001】0001

【産業上の利用分野】本発明はフレキシブル配線板に関
するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to flexible wiring boards.

【0002】0002

【従来の技術】硬質プリント配線板間の接続あるいは可
動部や狭い空間での配線用としてフレキシブル配線板が
カメラ、プリンター、オーディオ機器をはじめとして民
生用機器、産業用機器を問わず採用されている。図4に
示すようにフレキシブル配線板11はポリイミド、ポリ
エステル等可撓性の耐熱性樹脂からなるベースフィルム
12と、ベースフィルム12上に接着された銅箔をパタ
ーン加工した導体パターン13と、その表面を覆うカバ
ーレイ14とから構成されている。カバーレイ14には
ベースフィルムと同質材料の絶縁フィルムに接着剤を塗
布したもの又は熱硬化性の液状レジストが使用されてい
る。
[Prior Art] Flexible wiring boards are used in cameras, printers, audio equipment, and other consumer and industrial equipment to connect rigid printed wiring boards or for wiring in moving parts or in narrow spaces. . As shown in FIG. 4, the flexible wiring board 11 includes a base film 12 made of a flexible heat-resistant resin such as polyimide or polyester, a conductor pattern 13 formed by patterning copper foil bonded onto the base film 12, and the surface thereof. It is composed of a coverlay 14 that covers the. The coverlay 14 is made of an insulating film made of the same material as the base film and coated with an adhesive, or a thermosetting liquid resist.

【0003】0003

【発明が解決しようとする課題】フレキシブル配線板は
狭い空間での配線に使用されるため、折り曲げられた状
態で製品に組み込まれる。従って、フレキシブル配線板
に形成された各種信号線のパターンが交差して重なった
状態に配置されることにより交差部でクロストークが発
生したり、配線部分がノイズをひろい易いという問題が
ある。又、フレキシブル配線板は可撓性を高めるため、
薄く形成されているので強度が弱いという問題がある。
Since flexible wiring boards are used for wiring in narrow spaces, they are assembled into products in a folded state. Therefore, when the various signal line patterns formed on the flexible wiring board are arranged in such a manner that they intersect and overlap, there are problems in that crosstalk occurs at the intersections, and the wiring portions tend to pick up noise. In addition, in order to increase the flexibility of flexible wiring boards,
Since it is formed thinly, there is a problem that its strength is weak.

【0004】本発明は前記の問題点に鑑みてなされたも
のであって、その目的は配線部分のシールドを確実に行
うことができるとともに強度を高めることができ、しか
も作成に余分な工程を設ける必要のないフレキシブル配
線板を提供することにある。
The present invention has been made in view of the above-mentioned problems, and its purpose is to be able to reliably shield the wiring portion and increase the strength, while requiring no extra manufacturing steps. The purpose is to provide an unnecessary flexible wiring board.

【0005】[0005]

【課題を解決するための手段】前記の目的を達成するた
め本発明においては、フレキシブル配線板の本体部の表
裏両面を覆うカバー部を折り曲げ可能に本体部と一体に
形成し、各カバー部にパターンを形成するとともにその
パターンを本体部に形成されたアースパターンに接続し
、前記カバー部を本体部の表裏両面を覆う状態に折り曲
げて本体部に接着した。
[Means for Solving the Problems] In order to achieve the above object, in the present invention, a cover portion covering both the front and back sides of the main body portion of a flexible wiring board is formed integrally with the main body portion so as to be foldable, and each cover portion is formed integrally with the main body portion. A pattern was formed and the pattern was connected to a ground pattern formed on the main body, and the cover was bent to cover both the front and back surfaces of the main body and adhered to the main body.

【0006】[0006]

【作用】フレキシブル配線板の各種信号線のパターンが
形成された本体部の表裏両面を覆うカバー部に形成され
たパターンがシールド層としての役割を果たし、フレキ
シブル配線板が折り曲げられた状態で製品に組み込まれ
、各種信号線のパターンが交差する状態で重なってもク
ロストークの発生が防止される。又、カバー部の存在に
よりフレキシブル配線板の強度が高くなり、フレキシブ
ル配線板を狭い収容箇所に折り曲げて組み込む場合に信
頼性が増す。
[Function] The pattern formed on the cover part that covers both the front and back sides of the main body part, on which patterns of various signal lines of the flexible wiring board are formed, serves as a shield layer, and the flexible wiring board is attached to the product in a bent state. This prevents crosstalk from occurring even if various signal line patterns overlap in a crossing state. Moreover, the presence of the cover portion increases the strength of the flexible wiring board, and increases reliability when the flexible wiring board is folded and assembled into a narrow accommodation location.

【0007】[0007]

【実施例】(実施例1)以下、本発明を具体化した第1
実施例を図1に従って説明する。図1(a)に示すよう
に、フレキシブル配線板1は信号線用パターン2及びア
ース線用パターン3が形成された本体部4に、本体部4
の表裏両面を覆うカバー部5が折り曲げ可能に一体に形
成されている。カバー部5は本体部4とほぼ同形状に形
成された2個のカバー部5a,5bが連結部5cを介し
て連続する状態に形成されている。各カバー部5a,5
bにはそのほぼ全面にシールド層を構成する格子状のパ
ターン6が形成されている。パターン6は本体部4に形
成されたアース線用パターン3に接続されている。カバ
ー部5は連結部5cにおいて折り曲げられ、図1(b)
に示すように本体部4の表裏両面を覆う状態に配置され
るとともに、両面テープ(図示せず)等により本体部4
に接着される。
[Example] (Example 1) Hereinafter, a first example embodying the present invention will be described.
An example will be explained according to FIG. As shown in FIG. 1(a), the flexible wiring board 1 has a main body 4 on which a signal line pattern 2 and a ground line pattern 3 are formed.
A cover part 5 that covers both the front and back sides of is formed integrally so as to be foldable. The cover portion 5 is formed in such a manner that two cover portions 5a and 5b formed in substantially the same shape as the main body portion 4 are continuous via a connecting portion 5c. Each cover part 5a, 5
A lattice pattern 6 constituting a shield layer is formed on almost the entire surface of b. The pattern 6 is connected to the ground wire pattern 3 formed on the main body part 4. The cover part 5 is bent at the connecting part 5c, as shown in FIG. 1(b).
As shown in FIG.
is glued to.

【0008】カバー部5はフレキシブル配線板1の一部
として作成され、カバー部5を作成するための余分な工
程は必要ではない。すなわち、カバー部5を含んだ全体
が一つのフレキシブル配線板としてパターン形成等が行
われる。従って、カバー部を本体部4と別に作成して、
本体部4に取り付ける場合に比較して加工の手間が少な
くなる。又、カバー部5a,5bに形成されたパターン
6がフレキシブル配線板1の一配線としてアース線用パ
ターン3に接続されているため、GNDに落とすのが容
易である。
[0008] The cover portion 5 is made as a part of the flexible wiring board 1, and no extra steps are required for making the cover portion 5. That is, pattern formation and the like are performed on the entire structure including the cover portion 5 as one flexible wiring board. Therefore, the cover part is made separately from the main body part 4,
Compared to the case where it is attached to the main body part 4, the processing effort is reduced. Moreover, since the pattern 6 formed on the cover parts 5a and 5b is connected to the ground wire pattern 3 as one wiring of the flexible wiring board 1, it is easy to connect it to GND.

【0009】前記のように形成されたフレキシブル配線
板1は本体部4の表裏両面を覆うカバー部5によって補
強されてその強度が高くなっているので、狭い空間に折
り曲げた状態で製品に組み付ける場合に傷付くことが防
止される。又、本体部4の表裏両側にシールド層として
のパターン6が存在するため、フレキシブル配線板1が
折り曲げられた状態で製品に組み込まれて信号線用パタ
ーン2が交差する状態となっても、信号線用パターン2
間のクロストークの発生が確実に防止される。又、フレ
キシブル配線板1がフレキシブル配線板1以外の他の配
線部の近くに配置された場合にも信号線用パターン2が
ノイズをひろったり、他の配線部のノイズの原因となる
ことが確実に防止される。
The flexible wiring board 1 formed as described above is reinforced by the cover part 5 that covers both the front and back sides of the main body part 4, increasing its strength, so that when it is assembled into a product in a bent state in a narrow space, will be prevented from being damaged. Furthermore, since the pattern 6 as a shield layer is present on both the front and back sides of the main body 4, even if the flexible wiring board 1 is assembled into a product in a folded state and the signal line patterns 2 intersect, the signal Line pattern 2
The occurrence of crosstalk between the two is reliably prevented. Furthermore, even if the flexible wiring board 1 is placed near other wiring parts other than the flexible wiring board 1, it is certain that the signal line pattern 2 will pick up noise or cause noise in other wiring parts. is prevented.

【0010】フレキシブル配線板を多層構造にしてシー
ルド層を両側に設けるとともに強度を高めるために本体
部4のベースフィルムやカバーレイを厚くした場合には
、可撓性が低下して狭い空間に収容するのが困難になる
。しかし、本発明ではカバー部5a,5bと本体部4と
は全面で完全に接着されているのではないので、カバー
部5a,5bで本体部4の両面を覆っていてもその可撓
性はあまり低下せず、狭い空間に折り曲げた状態で製品
に組み付けることができる。
When the flexible wiring board is made into a multilayer structure with shield layers on both sides and the base film and coverlay of the main body 4 are thickened to increase strength, the flexibility decreases and it cannot be accommodated in a narrow space. becomes difficult to do. However, in the present invention, the cover portions 5a, 5b and the main body portion 4 are not completely bonded over the entire surface, so even if the cover portions 5a, 5b cover both sides of the main body portion 4, their flexibility is limited. It does not deteriorate much and can be assembled into a product in a narrow space while being folded.

【0011】(実施例2)次に第2実施例を図2に従っ
て説明する。この実施例ではフレキシブル配線板1の形
状が前記実施例と異なっている。すなわち、フレキシブ
ル配線板1はその端部が直角に屈曲した形状に形成され
、両カバー部5a,5bが平行に配置された状態に形成
される代わりに、長手方向に1列に配置された状態に形
成されている。
(Embodiment 2) Next, a second embodiment will be explained with reference to FIG. In this embodiment, the shape of the flexible wiring board 1 is different from the previous embodiment. That is, the flexible wiring board 1 is formed with its end bent at right angles, and the cover parts 5a and 5b are arranged in one row in the longitudinal direction instead of being arranged in parallel. is formed.

【0012】なお、本発明は前記両実施例に限定される
ものではなく、例えば、図3に示すように本体部4の両
側にカバー部5a,5bを形成してもよい。この場合は
アース線用パターン3を2個設け、各カバー部5a,5
bに形成されたパターン6をそれぞれ別のアース線用パ
ターン3に接続した状態に形成される。又、複数のカバ
ー部5で本体部4を覆うようにしてもよく、フレキシブ
ル配線板が長い場合や形状が複雑な場合に有効となる。 又、パターン6を格子状ではなくベタパターンにしても
よいが、格子状の方が可撓性に富む。さらには、本体部
4を両面配線にしたり、本体部4に電子部品を装着する
ためのパッドを設けて電子部品を実装してその上をカバ
ー部で覆うようにしてもよい。
It should be noted that the present invention is not limited to the two embodiments described above; for example, cover portions 5a and 5b may be formed on both sides of the main body portion 4 as shown in FIG. In this case, two ground wire patterns 3 are provided, and each cover part 5a, 5
The patterns 6 formed in b are connected to different ground wire patterns 3, respectively. Further, the main body part 4 may be covered with a plurality of cover parts 5, which is effective when the flexible wiring board is long or has a complicated shape. Further, the pattern 6 may be a solid pattern instead of a grid pattern, but a grid pattern is more flexible. Furthermore, the main body part 4 may be wired on both sides, or a pad for mounting an electronic component may be provided on the main body part 4, the electronic component may be mounted, and the top may be covered with a cover part.

【0013】[0013]

【発明の効果】以上詳述したように本発明によれば、本
体部の表裏両面を覆うように設けられたカバー部に形成
されたパターンがシールド層として働き、配線部分のシ
ールドを確実に行うことができるとともに強度を高める
ことができるのでフレキシブル配線板の信頼性が向上す
る。又、カバー部の作成のために余分な工程を設ける必
要がなく、加工の手間が従来のフレキシブル配線板の場
合とほとんど同じでよいという優れた効果を奏する。
[Effects of the Invention] As detailed above, according to the present invention, the pattern formed on the cover portion provided to cover both the front and back surfaces of the main body portion functions as a shield layer, and the wiring portion is reliably shielded. It is possible to improve the reliability of the flexible wiring board since it is possible to increase the strength and improve the reliability of the flexible wiring board. Further, there is an excellent effect that there is no need to provide an extra process for creating the cover part, and the processing time and effort is almost the same as in the case of conventional flexible wiring boards.

【図面の簡単な説明】[Brief explanation of the drawing]

【図1】第1実施例のフレキシブル配線板を示し、(a
)はカバー部を展開した状態を示す平面図、(b)はカ
バー部で本体部を覆った状態を示す平面図である。
FIG. 1 shows a flexible wiring board of a first embodiment, (a
) is a plan view showing a state in which the cover part is unfolded, and (b) is a plan view showing a state in which the main body part is covered with the cover part.

【図2】第2実施例のフレキシブル配線板を示し、(a
)はカバー部を展開した状態を示す平面図、(b)はカ
バー部で本体部を覆った状態を示す平面図である。
FIG. 2 shows a flexible wiring board of a second embodiment, (a
) is a plan view showing a state in which the cover part is unfolded, and (b) is a plan view showing a state in which the main body part is covered with the cover part.

【図3】変更例のフレキシブル配線板のカバー部を展開
した状態の平面図である。
FIG. 3 is a plan view of a modified example of a flexible wiring board in an expanded state;

【図4】従来のフレキシブル配線板の断面図である。FIG. 4 is a sectional view of a conventional flexible wiring board.

【符号の説明】[Explanation of symbols]

1…フレキシブル配線板、2…信号線用パターン、3…
アース線用パターン、4…本体部、5…カバー部、5a
…カバー部、5b…カバー部、5c…連結部、6…パタ
ーン。
1...Flexible wiring board, 2...Signal line pattern, 3...
Ground wire pattern, 4...Main body part, 5...Cover part, 5a
...Cover part, 5b...Cover part, 5c...Connection part, 6...Pattern.

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】  フレキシブル配線板(1)の本体部(
4)の表裏両面を覆うカバー部(5a,5b)を折り曲
げ可能に本体部(4)と一体に形成し、各カバー部(5
a,5b)にパターン(6)を形成するとともにそのパ
ターン(6)を本体部(4)に形成されたアース線用パ
ターン(3)に接続し、前記カバー部(5a,5b)を
本体部(4)の表裏両面を覆う状態に折り曲げて本体部
(4)に接着したことを特徴とするフレキシブル配線板
[Claim 1] The main body of the flexible wiring board (1) (
The cover parts (5a, 5b) covering both the front and back sides of 4) are foldably formed integrally with the main body part (4), and each cover part (5)
a, 5b), and connect the pattern (6) to the ground wire pattern (3) formed on the main body part (4), and connect the cover part (5a, 5b) to the main body part. A flexible wiring board characterized by being bent to cover both the front and back sides of (4) and bonded to the main body (4).
JP2358191A 1991-02-18 1991-02-18 Flexible wiring board Pending JPH04263495A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2358191A JPH04263495A (en) 1991-02-18 1991-02-18 Flexible wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2358191A JPH04263495A (en) 1991-02-18 1991-02-18 Flexible wiring board

Publications (1)

Publication Number Publication Date
JPH04263495A true JPH04263495A (en) 1992-09-18

Family

ID=12114539

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2358191A Pending JPH04263495A (en) 1991-02-18 1991-02-18 Flexible wiring board

Country Status (1)

Country Link
JP (1) JPH04263495A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5777275A (en) * 1995-09-25 1998-07-07 Mitsubishi Denki Kabushiki Kaisha Bendable circuit board having improved resistance to bending strain and increased element mounting area
US6153834A (en) * 1998-04-02 2000-11-28 Motorola, Inc. Flexible circuit with tabs for connection to battery cells
JP2001305397A (en) * 2000-02-08 2001-10-31 Framatome Connectors Internatl Electrooptical connecting module
JP2008028276A (en) * 2006-07-25 2008-02-07 Nec Saitama Ltd Flexible printed board, electronic equipment with the same mounted thereon, and method for folding up the same
JP2009176901A (en) * 2008-01-23 2009-08-06 Casio Hitachi Mobile Communications Co Ltd Flexible circuit board and electronic equipment
JP2015174207A (en) * 2014-03-18 2015-10-05 セイコーエプソン株式会社 robot
WO2019069935A1 (en) * 2017-10-06 2019-04-11 シナプティクス・ジャパン合同会社 Integrated circuit device and electronic equipment
JP2019071401A (en) * 2017-10-06 2019-05-09 シナプティクス・ジャパン合同会社 Integrated circuit device and electronic device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5819415B2 (en) * 1977-03-09 1983-04-18 株式会社ソディック Electrical discharge machining method and equipment

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5819415B2 (en) * 1977-03-09 1983-04-18 株式会社ソディック Electrical discharge machining method and equipment

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5777275A (en) * 1995-09-25 1998-07-07 Mitsubishi Denki Kabushiki Kaisha Bendable circuit board having improved resistance to bending strain and increased element mounting area
CN1123279C (en) * 1995-09-25 2003-10-01 三菱电机株式会社 Printed-circuit board
US6153834A (en) * 1998-04-02 2000-11-28 Motorola, Inc. Flexible circuit with tabs for connection to battery cells
JP2001305397A (en) * 2000-02-08 2001-10-31 Framatome Connectors Internatl Electrooptical connecting module
JP2008028276A (en) * 2006-07-25 2008-02-07 Nec Saitama Ltd Flexible printed board, electronic equipment with the same mounted thereon, and method for folding up the same
US8115103B2 (en) 2006-07-25 2012-02-14 Nec Corporation Flexible printed board, electronic apparatus mounted with this, and folding method for flexible printed board
JP2009176901A (en) * 2008-01-23 2009-08-06 Casio Hitachi Mobile Communications Co Ltd Flexible circuit board and electronic equipment
JP2015174207A (en) * 2014-03-18 2015-10-05 セイコーエプソン株式会社 robot
WO2019069935A1 (en) * 2017-10-06 2019-04-11 シナプティクス・ジャパン合同会社 Integrated circuit device and electronic equipment
JP2019071401A (en) * 2017-10-06 2019-05-09 シナプティクス・ジャパン合同会社 Integrated circuit device and electronic device
CN111448650A (en) * 2017-10-06 2020-07-24 辛纳普蒂克斯公司 Integrated circuit device and electronic apparatus

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