JPH0229435U - - Google Patents

Info

Publication number
JPH0229435U
JPH0229435U JP10807588U JP10807588U JPH0229435U JP H0229435 U JPH0229435 U JP H0229435U JP 10807588 U JP10807588 U JP 10807588U JP 10807588 U JP10807588 U JP 10807588U JP H0229435 U JPH0229435 U JP H0229435U
Authority
JP
Japan
Prior art keywords
melting point
low
bonding
glass
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10807588U
Other languages
Japanese (ja)
Other versions
JPH052584Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10807588U priority Critical patent/JPH052584Y2/ja
Publication of JPH0229435U publication Critical patent/JPH0229435U/ja
Application granted granted Critical
Publication of JPH052584Y2 publication Critical patent/JPH052584Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Ceramic Products (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図aは本考案に係る接合材の一実施例を示
す断面図、第1図bはその一実施例を示す側面断
面図である。 1…接合材、2…芯材、3…被膜、4…プリン
ト基板、5…所望パターン、6…電子部品、7…
リード。
FIG. 1a is a sectional view showing an embodiment of the bonding material according to the present invention, and FIG. 1b is a side sectional view showing the embodiment. DESCRIPTION OF SYMBOLS 1... Bonding material, 2... Core material, 3... Film, 4... Printed circuit board, 5... Desired pattern, 6... Electronic component, 7...
Lead.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 球状のセラミツクス、ガラス或は樹脂芯材の表
面に低融点金属被膜或は低融点合金被膜を形成し
たことを特徴とする面間接合に好適な接合材。
A bonding material suitable for surface-to-plane bonding, characterized in that a low-melting point metal coating or a low-melting point alloy coating is formed on the surface of a spherical ceramic, glass, or resin core material.
JP10807588U 1988-08-17 1988-08-17 Expired - Lifetime JPH052584Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10807588U JPH052584Y2 (en) 1988-08-17 1988-08-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10807588U JPH052584Y2 (en) 1988-08-17 1988-08-17

Publications (2)

Publication Number Publication Date
JPH0229435U true JPH0229435U (en) 1990-02-26
JPH052584Y2 JPH052584Y2 (en) 1993-01-22

Family

ID=31343068

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10807588U Expired - Lifetime JPH052584Y2 (en) 1988-08-17 1988-08-17

Country Status (1)

Country Link
JP (1) JPH052584Y2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000269768A (en) * 1999-03-16 2000-09-29 Tdk Corp Piezoelectric resonance component

Also Published As

Publication number Publication date
JPH052584Y2 (en) 1993-01-22

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