JPS62144341A - 導体を電気的に断絶する方法及び装置 - Google Patents

導体を電気的に断絶する方法及び装置

Info

Publication number
JPS62144341A
JPS62144341A JP61295699A JP29569986A JPS62144341A JP S62144341 A JPS62144341 A JP S62144341A JP 61295699 A JP61295699 A JP 61295699A JP 29569986 A JP29569986 A JP 29569986A JP S62144341 A JPS62144341 A JP S62144341A
Authority
JP
Japan
Prior art keywords
film
substrate
composite
silver
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP61295699A
Other languages
English (en)
Japanese (ja)
Inventor
ピーター　エル　ヤング
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
OPTICAL MATEIRIARUZU Inc
Original Assignee
OPTICAL MATEIRIARUZU Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by OPTICAL MATEIRIARUZU Inc filed Critical OPTICAL MATEIRIARUZU Inc
Publication of JPS62144341A publication Critical patent/JPS62144341A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/067—Manufacture or treatment of conductive parts of the interconnections by modifying the pattern of conductive parts
    • H10W20/068—Manufacture or treatment of conductive parts of the interconnections by modifying the pattern of conductive parts by using a laser, e.g. laser cutting or laser direct writing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/49—Adaptable interconnections, e.g. fuses or antifuses
    • H10W20/493—Fuses, i.e. interconnections changeable from conductive to non-conductive
    • H10W20/494—Fuses, i.e. interconnections changeable from conductive to non-conductive changeable by the use of an external beam, e.g. laser beam or ion beam

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
JP61295699A 1985-12-11 1986-12-11 導体を電気的に断絶する方法及び装置 Pending JPS62144341A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/807,676 US4661214A (en) 1985-12-11 1985-12-11 Method and apparatus for electrically disconnecting conductors
US807676 1997-02-27

Publications (1)

Publication Number Publication Date
JPS62144341A true JPS62144341A (ja) 1987-06-27

Family

ID=25196929

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61295699A Pending JPS62144341A (ja) 1985-12-11 1986-12-11 導体を電気的に断絶する方法及び装置

Country Status (3)

Country Link
US (1) US4661214A (https=)
JP (1) JPS62144341A (https=)
DE (1) DE3641375A1 (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5124238A (en) * 1988-09-06 1992-06-23 The Boeing Company Fabrication of microelectronics using photosensitive polyimides
US5122440A (en) * 1988-09-06 1992-06-16 Chien Chung Ping Ultraviolet curing of photosensitive polyimides
US4974048A (en) * 1989-03-10 1990-11-27 The Boeing Company Integrated circuit having reroutable conductive paths
JPH0383398A (ja) * 1989-08-26 1991-04-09 Shinko Electric Ind Co Ltd 配線基板及びその製造方法
US5112448A (en) * 1989-11-28 1992-05-12 The Boeing Company Self-aligned process for fabrication of interconnect structures in semiconductor applications
US5102506A (en) * 1991-04-10 1992-04-07 The Boeing Company Zinc-based microfuse
GB2260219B (en) * 1991-10-01 1995-08-30 Northern Telecom Ltd Improvements in integrated circuits
US5963825A (en) * 1992-08-26 1999-10-05 Hyundai Electronics America Method of fabrication of semiconductor fuse with polysilicon plate
JPH07211715A (ja) * 1994-01-20 1995-08-11 Toshiba Corp 半導体装置の製造方法
US6734455B2 (en) * 2001-03-15 2004-05-11 Micron Technology, Inc. Agglomeration elimination for metal sputter deposition of chalcogenides
TWM362572U (en) * 2009-04-13 2009-08-01 Phytrex Technology Corp Signal convertor
US20140097003A1 (en) * 2012-10-05 2014-04-10 Tyco Electronics Amp Gmbh Electrical components and methods and systems of manufacturing electrical components

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3801366A (en) * 1971-02-16 1974-04-02 J Lemelson Method of making an electrical circuit
US4318978A (en) * 1976-11-05 1982-03-09 Corning Glass Works Photosensitive film and methods

Also Published As

Publication number Publication date
US4661214A (en) 1987-04-28
DE3641375A1 (de) 1987-06-19
DE3641375C2 (https=) 1990-10-04

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