DE3641375C2 - - Google Patents
Info
- Publication number
- DE3641375C2 DE3641375C2 DE3641375A DE3641375A DE3641375C2 DE 3641375 C2 DE3641375 C2 DE 3641375C2 DE 3641375 A DE3641375 A DE 3641375A DE 3641375 A DE3641375 A DE 3641375A DE 3641375 C2 DE3641375 C2 DE 3641375C2
- Authority
- DE
- Germany
- Prior art keywords
- film
- substrate according
- substrate
- silver
- halide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/01—Manufacture or treatment
- H10W20/031—Manufacture or treatment of conductive parts of the interconnections
- H10W20/067—Manufacture or treatment of conductive parts of the interconnections by modifying the pattern of conductive parts
- H10W20/068—Manufacture or treatment of conductive parts of the interconnections by modifying the pattern of conductive parts by using a laser, e.g. laser cutting or laser direct writing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
- H10W20/49—Adaptable interconnections, e.g. fuses or antifuses
- H10W20/493—Fuses, i.e. interconnections changeable from conductive to non-conductive
- H10W20/494—Fuses, i.e. interconnections changeable from conductive to non-conductive changeable by the use of an external beam, e.g. laser beam or ion beam
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Electroplating Methods And Accessories (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US06/807,676 US4661214A (en) | 1985-12-11 | 1985-12-11 | Method and apparatus for electrically disconnecting conductors |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE3641375A1 DE3641375A1 (de) | 1987-06-19 |
| DE3641375C2 true DE3641375C2 (https=) | 1990-10-04 |
Family
ID=25196929
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19863641375 Granted DE3641375A1 (de) | 1985-12-11 | 1986-12-04 | Verfahren zum unterbrechen elektrischer leiter auf einem substrat, dafuer geeignetes substrat sowie eine anwendung des verfahrens |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US4661214A (https=) |
| JP (1) | JPS62144341A (https=) |
| DE (1) | DE3641375A1 (https=) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5124238A (en) * | 1988-09-06 | 1992-06-23 | The Boeing Company | Fabrication of microelectronics using photosensitive polyimides |
| US5122440A (en) * | 1988-09-06 | 1992-06-16 | Chien Chung Ping | Ultraviolet curing of photosensitive polyimides |
| US4974048A (en) * | 1989-03-10 | 1990-11-27 | The Boeing Company | Integrated circuit having reroutable conductive paths |
| JPH0383398A (ja) * | 1989-08-26 | 1991-04-09 | Shinko Electric Ind Co Ltd | 配線基板及びその製造方法 |
| US5112448A (en) * | 1989-11-28 | 1992-05-12 | The Boeing Company | Self-aligned process for fabrication of interconnect structures in semiconductor applications |
| US5102506A (en) * | 1991-04-10 | 1992-04-07 | The Boeing Company | Zinc-based microfuse |
| GB2260219B (en) * | 1991-10-01 | 1995-08-30 | Northern Telecom Ltd | Improvements in integrated circuits |
| US5963825A (en) * | 1992-08-26 | 1999-10-05 | Hyundai Electronics America | Method of fabrication of semiconductor fuse with polysilicon plate |
| JPH07211715A (ja) * | 1994-01-20 | 1995-08-11 | Toshiba Corp | 半導体装置の製造方法 |
| US6734455B2 (en) * | 2001-03-15 | 2004-05-11 | Micron Technology, Inc. | Agglomeration elimination for metal sputter deposition of chalcogenides |
| TWM362572U (en) * | 2009-04-13 | 2009-08-01 | Phytrex Technology Corp | Signal convertor |
| US20140097003A1 (en) * | 2012-10-05 | 2014-04-10 | Tyco Electronics Amp Gmbh | Electrical components and methods and systems of manufacturing electrical components |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3801366A (en) * | 1971-02-16 | 1974-04-02 | J Lemelson | Method of making an electrical circuit |
| US4318978A (en) * | 1976-11-05 | 1982-03-09 | Corning Glass Works | Photosensitive film and methods |
-
1985
- 1985-12-11 US US06/807,676 patent/US4661214A/en not_active Expired - Fee Related
-
1986
- 1986-12-04 DE DE19863641375 patent/DE3641375A1/de active Granted
- 1986-12-11 JP JP61295699A patent/JPS62144341A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| US4661214A (en) | 1987-04-28 |
| JPS62144341A (ja) | 1987-06-27 |
| DE3641375A1 (de) | 1987-06-19 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| OP8 | Request for examination as to paragraph 44 patent law | ||
| D2 | Grant after examination | ||
| 8364 | No opposition during term of opposition | ||
| 8339 | Ceased/non-payment of the annual fee |