JPS62144335A - 半導体装置の封止方法 - Google Patents

半導体装置の封止方法

Info

Publication number
JPS62144335A
JPS62144335A JP28516185A JP28516185A JPS62144335A JP S62144335 A JPS62144335 A JP S62144335A JP 28516185 A JP28516185 A JP 28516185A JP 28516185 A JP28516185 A JP 28516185A JP S62144335 A JPS62144335 A JP S62144335A
Authority
JP
Japan
Prior art keywords
semiconductor device
ultraviolet
resin
potting
curing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP28516185A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0380341B2 (enExample
Inventor
Einosuke Adachi
栄之資 足立
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP28516185A priority Critical patent/JPS62144335A/ja
Publication of JPS62144335A publication Critical patent/JPS62144335A/ja
Publication of JPH0380341B2 publication Critical patent/JPH0380341B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP28516185A 1985-12-18 1985-12-18 半導体装置の封止方法 Granted JPS62144335A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP28516185A JPS62144335A (ja) 1985-12-18 1985-12-18 半導体装置の封止方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP28516185A JPS62144335A (ja) 1985-12-18 1985-12-18 半導体装置の封止方法

Publications (2)

Publication Number Publication Date
JPS62144335A true JPS62144335A (ja) 1987-06-27
JPH0380341B2 JPH0380341B2 (enExample) 1991-12-24

Family

ID=17687874

Family Applications (1)

Application Number Title Priority Date Filing Date
JP28516185A Granted JPS62144335A (ja) 1985-12-18 1985-12-18 半導体装置の封止方法

Country Status (1)

Country Link
JP (1) JPS62144335A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0189753U (enExample) * 1987-12-07 1989-06-13
JPH0449639A (ja) * 1990-06-18 1992-02-19 Sharp Corp 半導体パッケージの封止方法及び封止装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0189753U (enExample) * 1987-12-07 1989-06-13
JPH0449639A (ja) * 1990-06-18 1992-02-19 Sharp Corp 半導体パッケージの封止方法及び封止装置

Also Published As

Publication number Publication date
JPH0380341B2 (enExample) 1991-12-24

Similar Documents

Publication Publication Date Title
US5960260A (en) Semiconductor device, its manufacturing method, and dicing adhesive element therefor
KR101388753B1 (ko) Ｆｌｉｐ 칩 패키징 내에 몰딩된 언더필을 위한 장치 및 방법
CN101241921B (zh) 光学器件及其制造方法、以及摄像模块和内窥镜模块
US8252408B2 (en) Electronic device and method of manufacturing the electronic device
US12230512B2 (en) Resin molded product production method, molding die, and resin molding apparatus
CA1232372A (en) Method for encapsulating semiconductor components mounted on a carrier tape
KR19990078327A (ko) 열저항력이뛰어난고체촬상장치및그제조방법
JPH07297324A (ja) 半導体装置およびその製造方法
JPS62144335A (ja) 半導体装置の封止方法
JP2617402B2 (ja) 半導体装置、電子回路装置、およびそれらの製造方法
JP2001176902A (ja) 樹脂封止方法
JPS63283054A (ja) ピン保持部付リードフレームの製造方法
JPH08330339A (ja) 光学装置の製造方法
US20050266602A1 (en) Encapsulated chip and method of fabrication thereof
JPH10135254A (ja) 半導体装置の製造方法及び半導体装置
JP3619128B2 (ja) 光半導体装置の製造方法
JPS62128534A (ja) 半導体装置の封止方法
TW201232849A (en) Methodology of forming optical lens for semiconductor light emitting device
JP3484633B2 (ja) 電子部品の製造方法
US20050266592A1 (en) Method of fabricating an encapsulated chip and chip produced thereby
JPH07212013A (ja) ボール・グリッド・アレイ及びボール・グリッド・アレイ用のプリント回路基板の製造方法
CN112259661A (zh) 一种灌封装置、led显示屏及其封装方法
TWI811625B (zh) 晶片移轉方法、晶片移轉裝置以及影像顯示器
KR101366919B1 (ko) Ｓｒ 포스트 형성방법 및 이를 이용한 전자소자 패키지 제조방법
JPH03129843A (ja) マルチチップ実装方法